JPS61207051U - - Google Patents
Info
- Publication number
- JPS61207051U JPS61207051U JP1985091774U JP9177485U JPS61207051U JP S61207051 U JPS61207051 U JP S61207051U JP 1985091774 U JP1985091774 U JP 1985091774U JP 9177485 U JP9177485 U JP 9177485U JP S61207051 U JPS61207051 U JP S61207051U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- lead wire
- translucent resin
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案実施例の発光ダイオードランプ
の平面図aとそのA―A′断面図b、第2図は従
来の発光ダイオードランプの平面図aとそのB―
B′断面図bである。
1,1…リード線、2,2…橋絡部切断跡、3
…発光ダイオード、4…透光性樹脂。
Fig. 1 is a plan view a of a light emitting diode lamp according to an embodiment of the present invention and its sectional view taken along line AA' b, and Fig. 2 is a plan view a of a conventional light emitting diode lamp and its cross section taken along line b -
It is B' sectional view b. 1, 1... Lead wire, 2, 2... Bridge cut trace, 3
...Light emitting diode, 4...Translucent resin.
Claims (1)
置された発光ダイオードと、発光ダイオードを含
むリード線先端を覆う透光性樹脂を有した発光ダ
イオードランプにおいて、少なくともリード線の
露出部分のうち透光性樹脂近傍はスエージング加
工により端縁に丸味が設けられている事を特徴と
する発光ダイオードランプ。 In a light emitting diode lamp having a substantially parallel prismatic lead wire, a light emitting diode placed on the lead wire, and a translucent resin covering the tip of the lead wire including the light emitting diode, at least the exposed portion of the lead wire is A light emitting diode lamp characterized by a rounded edge near the translucent resin due to swaging.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985091774U JPH0412697Y2 (en) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985091774U JPH0412697Y2 (en) | 1985-06-18 | 1985-06-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61207051U true JPS61207051U (en) | 1986-12-27 |
JPH0412697Y2 JPH0412697Y2 (en) | 1992-03-26 |
Family
ID=30647959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985091774U Expired JPH0412697Y2 (en) | 1985-06-18 | 1985-06-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0412697Y2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
JP2005184033A (en) * | 1999-12-08 | 2005-07-07 | Nichia Chem Ind Ltd | Led lamp and method of manufacturing same |
JP2006165410A (en) * | 2004-12-10 | 2006-06-22 | Stanley Electric Co Ltd | Led |
JP4703903B2 (en) * | 2001-07-17 | 2011-06-15 | ローム株式会社 | Semiconductor device manufacturing method and semiconductor device |
JP2012190941A (en) * | 2011-03-09 | 2012-10-04 | Stanley Electric Co Ltd | Optical semiconductor device and method of manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5633392B2 (en) * | 2011-01-26 | 2014-12-03 | 日亜化学工業株式会社 | Semiconductor device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5179569A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | RIIDOFUREEMU |
JPS5334998A (en) * | 1976-09-10 | 1978-03-31 | Hauni Werke Koerber & Co Kg | Roddshaped products conveying apparatus |
JPS5839046A (en) * | 1981-08-31 | 1983-03-07 | Rohm Co Ltd | Electronic part |
JPS5918691U (en) * | 1982-07-29 | 1984-02-04 | 株式会社シマノ | Gear shift operation device |
JPS60123047A (en) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | Semiconductor device |
JPS6347344A (en) * | 1986-08-15 | 1988-02-29 | Koujiyundo Kagaku Kenkyusho:Kk | Production of low oxygen alloy molding |
-
1985
- 1985-06-18 JP JP1985091774U patent/JPH0412697Y2/ja not_active Expired
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5179569A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | RIIDOFUREEMU |
JPS5334998A (en) * | 1976-09-10 | 1978-03-31 | Hauni Werke Koerber & Co Kg | Roddshaped products conveying apparatus |
JPS5839046A (en) * | 1981-08-31 | 1983-03-07 | Rohm Co Ltd | Electronic part |
JPS5918691U (en) * | 1982-07-29 | 1984-02-04 | 株式会社シマノ | Gear shift operation device |
JPS60123047A (en) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | Semiconductor device |
JPS6347344A (en) * | 1986-08-15 | 1988-02-29 | Koujiyundo Kagaku Kenkyusho:Kk | Production of low oxygen alloy molding |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
JP2005184033A (en) * | 1999-12-08 | 2005-07-07 | Nichia Chem Ind Ltd | Led lamp and method of manufacturing same |
JP4703903B2 (en) * | 2001-07-17 | 2011-06-15 | ローム株式会社 | Semiconductor device manufacturing method and semiconductor device |
JP2006165410A (en) * | 2004-12-10 | 2006-06-22 | Stanley Electric Co Ltd | Led |
JP4656927B2 (en) * | 2004-12-10 | 2011-03-23 | スタンレー電気株式会社 | LED |
JP2012190941A (en) * | 2011-03-09 | 2012-10-04 | Stanley Electric Co Ltd | Optical semiconductor device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0412697Y2 (en) | 1992-03-26 |
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