JPS6223466U - - Google Patents

Info

Publication number
JPS6223466U
JPS6223466U JP11486185U JP11486185U JPS6223466U JP S6223466 U JPS6223466 U JP S6223466U JP 11486185 U JP11486185 U JP 11486185U JP 11486185 U JP11486185 U JP 11486185U JP S6223466 U JPS6223466 U JP S6223466U
Authority
JP
Japan
Prior art keywords
light
lead wire
light emitting
emitting diodes
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11486185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11486185U priority Critical patent/JPS6223466U/ja
Publication of JPS6223466U publication Critical patent/JPS6223466U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Light Sources And Details Of Projection-Printing Devices (AREA)
  • Facsimile Scanning Arrangements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の発光素子の断面図、第
２図ａは従来の発光素子を用いた線状光源の要部
側面図、第２図ｂは線状光源の輝度特性図である
。 １，１，１……リード線、２，２……発光ダイ
オード、３……透光性樹脂、４……（透光性樹脂
の）レンズ部。 FIG. 1 is a cross-sectional view of a light emitting device according to an embodiment of the present invention, FIG. 2 a is a side view of a main part of a linear light source using a conventional light emitting device, and FIG. 2 b is a brightness characteristic diagram of the linear light source. . 1, 1, 1...Lead wire, 2, 2...Light emitting diode, 3...Transparent resin, 4... Lens portion (of transparent resin).

Claims (1)

【実用新案登録請求の範囲】 (1) 略平行なリード線と、リード線の先端に整
列載置され配線された複数の発光ダイオードと、
発光ダイオードを含むリード線先端部を覆い、発
光ダイオードの光照射部として発光ダイオードの
整列方向と略一致する方向に稜線を有する略半円
柱状のレンズ部を有する透光性樹脂とを具備した
事を特徴とする発光素子。 (2) 前記発光ダイオードの光照射部は前記リー
ド線の延在方向に設けてある事を等徴とする前記
実用新案登録請求の範囲第１項記載の発光素子。[Claims for Utility Model Registration] (1) A substantially parallel lead wire, a plurality of light emitting diodes arranged and wired at the tip of the lead wire,
A light-transmitting resin having a substantially semi-cylindrical lens portion that covers the tip of the lead wire containing the light-emitting diode and has a ridgeline in a direction that substantially coincides with the alignment direction of the light-emitting diodes serves as a light irradiation portion of the light-emitting diodes. A light emitting element characterized by: (2) The light emitting device according to claim 1 of the utility model registration, wherein the light emitting portion of the light emitting diode is provided in the extending direction of the lead wire.
JP11486185U 1985-07-25 1985-07-25 Pending JPS6223466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11486185U JPS6223466U (en) 1985-07-25 1985-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11486185U JPS6223466U (en) 1985-07-25 1985-07-25

Publications (1)

Publication Number Publication Date
JPS6223466U true JPS6223466U (en) 1987-02-13

Family

ID=30997982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11486185U Pending JPS6223466U (en) 1985-07-25 1985-07-25

Country Status (1)

Country Link
JP (1) JPS6223466U (en)

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