JPH0233466U - - Google Patents
Info
- Publication number
- JPH0233466U JPH0233466U JP11244388U JP11244388U JPH0233466U JP H0233466 U JPH0233466 U JP H0233466U JP 11244388 U JP11244388 U JP 11244388U JP 11244388 U JP11244388 U JP 11244388U JP H0233466 U JPH0233466 U JP H0233466U
- Authority
- JP
- Japan
- Prior art keywords
- lens
- rod
- light emitting
- emitting diodes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Facsimile Scanning Arrangements (AREA)
Description
第１図は本考案実施例の線状光源の要部断面図
、第２図ｂはその断面図、第２図ａ及びｃは特性
図、第３図ｂは従来の線状光源の断面図、第３図
ａ及びｃは特性図である。
１……基板、２……発光ダイオード、３……棒
状レンズ、３１……レンズ面、３２……平坦部。
Fig. 1 is a cross-sectional view of the main part of a linear light source according to an embodiment of the present invention, Fig. 2b is a cross-sectional view thereof, Fig. 2a and c are characteristic diagrams, and Fig. 3b is a cross-sectional view of a conventional linear light source. , FIGS. 3a and 3c are characteristic diagrams. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Light emitting diode, 3... Rod-shaped lens, 31... Lens surface, 32... Flat part.
Claims (1)
た複数の発光ダイオードと、その発光ダイオード
の列に平行な稜線を有し発光ダイオードの上方に
配置された棒状レンズとを具備した線状光源にお
いて、前記棒状レンズは上面に所定の曲率のレン
ズ面を有し、かつそのレンズ面の照射体対向部に
棒状レンズの稜線に平行な平坦部を具備した事を
特徴とする線状光源。 A linear lens comprising a substrate, a plurality of light emitting diodes arranged and fixed on the substrate, and a rod-shaped lens having a ridge line parallel to the row of the light emitting diodes and disposed above the light emitting diodes. The linear light source is characterized in that the rod-shaped lens has a lens surface with a predetermined curvature on its upper surface, and a flat portion parallel to the ridgeline of the rod-shaped lens is provided on the portion of the lens surface that faces the irradiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244388U JPH0233466U (en) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244388U JPH0233466U (en) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233466U true JPH0233466U (en) | 1990-03-02 |
Family
ID=31351387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11244388U Pending JPH0233466U (en) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233466U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253808A (en) * | 2010-05-28 | 2011-12-15 | Baldwin Uv Ltd | Uv led-curing assembly |
-
1988
- 1988-08-26 JP JP11244388U patent/JPH0233466U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253808A (en) * | 2010-05-28 | 2011-12-15 | Baldwin Uv Ltd | Uv led-curing assembly |