JPS6343464U - - Google Patents

Info

Publication number
JPS6343464U
JPS6343464U JP13451886U JP13451886U JPS6343464U JP S6343464 U JPS6343464 U JP S6343464U JP 13451886 U JP13451886 U JP 13451886U JP 13451886 U JP13451886 U JP 13451886U JP S6343464 U JPS6343464 U JP S6343464U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
junction
wiring
matrix type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13451886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13451886U priority Critical patent/JPS6343464U/ja
Publication of JPS6343464U publication Critical patent/JPS6343464U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のドツトマトリクス型発光ダイ
オードの斜視図で第２図は本考案の他の実施例を
示す要部平面図ａと側面断面図ｂ、第３図は従来
の発光ダイオードの斜視図である。 １……ベース、２……発光ダイオード、２１…
…ＰＮ接合、２２，２２……２３，２３……溝、
２４，２４……発光素子、３，３……金線。 Fig. 1 is a perspective view of a dot matrix type light emitting diode of the present invention, Fig. 2 is a plan view a and a side sectional view b showing another embodiment of the present invention, and Fig. 3 is a perspective view of a conventional light emitting diode. It is a diagram. 1...Base, 2...Light emitting diode, 21...
...PN junction, 22,22...23,23...groove,
24, 24... Light emitting element, 3, 3... Gold wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に略平行なＰＮ接合を有し、そのＰＮ接合
より深い略直交する溝によつて表面略四角形をな
す複数個の発光素子に分離された発光ダイオード
と、その発光ダイオードの表面側において発光素
子の対角線方向に１行おきに配線を施こす配線手
段とを具備した事を特徴とするマトリクス型発光
ダイオード。 A light emitting diode which has a PN junction substantially parallel to its surface and is separated into a plurality of light emitting elements each having a substantially rectangular surface by a substantially perpendicular groove deeper than the PN junction, and a light emitting element on the surface side of the light emitting diode. 1. A matrix type light emitting diode, comprising a wiring means for wiring every other row in a diagonal direction.
JP13451886U 1986-09-02 1986-09-02 Pending JPS6343464U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13451886U JPS6343464U (en) 1986-09-02 1986-09-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13451886U JPS6343464U (en) 1986-09-02 1986-09-02

Publications (1)

Publication Number Publication Date
JPS6343464U true JPS6343464U (en) 1988-03-23

Family

ID=31035830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13451886U Pending JPS6343464U (en) 1986-09-02 1986-09-02

Country Status (1)

Country Link
JP (1) JPS6343464U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225628A (en) * 2013-01-30 2014-12-04 日亜化学工業株式会社 Semiconductor light-emitting element
US9093356B2 (en) 2010-12-28 2015-07-28 Nichia Corporation Semiconductor light emitting element
WO2019092893A1 (en) * 2017-11-10 2019-05-16 シャープ株式会社 Semiconductor module, display device, and semiconductor module production method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093356B2 (en) 2010-12-28 2015-07-28 Nichia Corporation Semiconductor light emitting element
JP2014225628A (en) * 2013-01-30 2014-12-04 日亜化学工業株式会社 Semiconductor light-emitting element
WO2019092893A1 (en) * 2017-11-10 2019-05-16 シャープ株式会社 Semiconductor module, display device, and semiconductor module production method
JPWO2019092893A1 (en) * 2017-11-10 2020-11-12 シャープ株式会社 Semiconductor modules, display devices, and methods for manufacturing semiconductor modules

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