JPS61205143U - - Google Patents
Info
- Publication number
- JPS61205143U JPS61205143U JP8985885U JP8985885U JPS61205143U JP S61205143 U JPS61205143 U JP S61205143U JP 8985885 U JP8985885 U JP 8985885U JP 8985885 U JP8985885 U JP 8985885U JP S61205143 U JPS61205143 U JP S61205143U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- case
- board
- depressions
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案のハイブリツドＩＣの縦断面図
。第２図は従来例のハイブリツドＩＣの縦断面図
でハイブリツドＩＣ基板がケースに対して傾斜し
ているものを示す。第３図は従来例のハイブリツ
ドＩＣの縦断面図でハイブリツドＩＣ基板がケー
スに対し偏つているものを示す。第４図は公知の
改良型ハイブリツドＩＣ縦断面図。
１……ハイブリツドＩＣ基板、２……ケース、
３……実装部品、４……樹脂、５……外部導出リ
ード、１０，１１，１２，１３……基板の凸部、
１４，１５，１６……基板の凹部、２０，２１，
２２，２３……ケース内面の凹部、２４，２５，
２６……ケース内面の凸部、Ａ……反リード面、
Ｂ……リード面、Ｃ……ケース内面、Δ……凹凸
の高さ。
FIG. 1 is a longitudinal sectional view of the hybrid IC of the present invention. FIG. 2 is a vertical cross-sectional view of a conventional hybrid IC, in which the hybrid IC board is inclined with respect to the case. FIG. 3 is a longitudinal sectional view of a conventional hybrid IC, showing that the hybrid IC board is biased with respect to the case. FIG. 4 is a longitudinal sectional view of a known improved hybrid IC. 1...Hybrid IC board, 2...Case,
3... Mounted component, 4... Resin, 5... External lead-out lead, 10, 11, 12, 13... Convex portion of board,
14, 15, 16... concavity of substrate, 20, 21,
22, 23... recess on the inner surface of the case, 24, 25,
26...Protrusion on the inner surface of the case, A...Anti-lead surface,
B...Lead surface, C...Case inner surface, Δ...Height of unevenness.
Claims (1)
面に実装部品、薄膜抵抗、印刷配線を設け反対側
の面に凹凸を形成したハイブリツドＩＣ基板と、
底部に開口を有し上部の内面にハイブリツドＩＣ
基板の凹凸に嵌合する凹凸を形成してあるケース
と、ハイブリツドＩＣ基板をケースの中に入れた
状態を固定するための樹脂とよりなる事を特徴と
するハイブリツドＩＣ。 A hybrid IC board having external lead-out leads, mounted components, thin film resistors, and printed wiring on the surface to which the external lead-out leads are attached, and an uneven surface formed on the opposite side;
Opening at the bottom and hybrid IC on the inner surface of the top
A hybrid IC characterized by comprising a case having projections and depressions that fit into the projections and depressions of a substrate, and a resin for fixing the hybrid IC board in the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8985885U JPS61205143U (en) | 1985-06-13 | 1985-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8985885U JPS61205143U (en) | 1985-06-13 | 1985-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205143U true JPS61205143U (en) | 1986-12-24 |
Family
ID=30644333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8985885U Pending JPS61205143U (en) | 1985-06-13 | 1985-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205143U (en) |
-
1985
- 1985-06-13 JP JP8985885U patent/JPS61205143U/ja active Pending