JPS61202495A - 電子部品搭載用基板およびその製造方法 - Google Patents

電子部品搭載用基板およびその製造方法

Info

Publication number
JPS61202495A
JPS61202495A JP60043015A JP4301585A JPS61202495A JP S61202495 A JPS61202495 A JP S61202495A JP 60043015 A JP60043015 A JP 60043015A JP 4301585 A JP4301585 A JP 4301585A JP S61202495 A JPS61202495 A JP S61202495A
Authority
JP
Japan
Prior art keywords
substrate
board
recess
metal plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60043015A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0358552B2 (cs
Inventor
矢津　一
勝美 馬渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60043015A priority Critical patent/JPS61202495A/ja
Publication of JPS61202495A publication Critical patent/JPS61202495A/ja
Publication of JPH0358552B2 publication Critical patent/JPH0358552B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60043015A 1985-03-05 1985-03-05 電子部品搭載用基板およびその製造方法 Granted JPS61202495A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60043015A JPS61202495A (ja) 1985-03-05 1985-03-05 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60043015A JPS61202495A (ja) 1985-03-05 1985-03-05 電子部品搭載用基板およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4236546A Division JPH05291429A (ja) 1992-08-12 1992-08-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS61202495A true JPS61202495A (ja) 1986-09-08
JPH0358552B2 JPH0358552B2 (cs) 1991-09-05

Family

ID=12652147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60043015A Granted JPS61202495A (ja) 1985-03-05 1985-03-05 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS61202495A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH02278894A (ja) * 1989-04-20 1990-11-15 Satosen Co Ltd プリント配線板
JPH05291429A (ja) * 1992-08-12 1993-11-05 Ibiden Co Ltd 半導体装置
JP2007036050A (ja) * 2005-07-28 2007-02-08 Shin Kobe Electric Mach Co Ltd 積層回路基板の製造方法
JP2009177016A (ja) * 2008-01-25 2009-08-06 Tdk Corp 集合基板、集合基板の製造方法、及びバリスタ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH02278894A (ja) * 1989-04-20 1990-11-15 Satosen Co Ltd プリント配線板
JPH05291429A (ja) * 1992-08-12 1993-11-05 Ibiden Co Ltd 半導体装置
JP2007036050A (ja) * 2005-07-28 2007-02-08 Shin Kobe Electric Mach Co Ltd 積層回路基板の製造方法
JP2009177016A (ja) * 2008-01-25 2009-08-06 Tdk Corp 集合基板、集合基板の製造方法、及びバリスタ
US8125307B2 (en) 2008-01-25 2012-02-28 Tdk Corporation Aggregate substrate, production method of aggregate substrate, and varistor
TWI385678B (zh) * 2008-01-25 2013-02-11 Tdk Corp A manufacturing method of a collective substrate, a collective substrate, and a varistor

Also Published As

Publication number Publication date
JPH0358552B2 (cs) 1991-09-05

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