JPS6120074U - heat seal connector - Google Patents
heat seal connectorInfo
- Publication number
- JPS6120074U JPS6120074U JP10359884U JP10359884U JPS6120074U JP S6120074 U JPS6120074 U JP S6120074U JP 10359884 U JP10359884 U JP 10359884U JP 10359884 U JP10359884 U JP 10359884U JP S6120074 U JPS6120074 U JP S6120074U
- Authority
- JP
- Japan
- Prior art keywords
- seal connector
- heat seal
- heat
- insulating
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図〜第3図は本考案の実施例を示すものであり、第
1図は基板に電子部品が実装された状態を示す断面図、
第2図はヒートシールコネクタを示す第1図の■−■部
分断面図、第3図はヒートシールコネクタと電子部品と
基板を示す分解斜視図、第4図以下は従来例を示すもの
であり、第4図は従来の電子部品の取付け構造を示す断
面図、第5図は取付け具の斜視図である。
1・・・印刷基板、2・・・回路パターン、3・・・電
子部品、3a・・・接続端子、10・・・ヒートシール
コネクタ、10a・・・絶縁フイルム、10b・・・導
電層、10c・・・絶縁層、10d・・・切欠き。1 to 3 show an embodiment of the present invention, and FIG. 1 is a sectional view showing a state in which electronic components are mounted on a board;
Figure 2 is a partial sectional view taken along the line ■-■ of Figure 1 showing the heat seal connector, Figure 3 is an exploded perspective view showing the heat seal connector, electronic components and circuit board, and Figures 4 and below show conventional examples. , FIG. 4 is a sectional view showing a conventional electronic component mounting structure, and FIG. 5 is a perspective view of the mounting tool. DESCRIPTION OF SYMBOLS 1... Printed board, 2... Circuit pattern, 3... Electronic component, 3a... Connection terminal, 10... Heat seal connector, 10a... Insulating film, 10b... Conductive layer, 10c...Insulating layer, 10d...Notch.
Claims (1)
形成されており、絶縁フイルムの一面には、導電性ヒー
トシール部材によって形成された導電層が、電気部品の
本体から突出している端子と同じピッチにて配列されて
おり、且つ隣り合う導電層の間には、絶縁性ヒートシー
ル部材による絶縁層が形成されて成るヒートシールコネ
クタ。A notch is formed in the insulating film into which the main body of the electronic component is inserted, and a conductive layer formed by a conductive heat sealing member is formed on one side of the insulating film to form a terminal and a terminal protruding from the main body of the electrical component. A heat-seal connector in which an insulating layer made of an insulating heat-sealing member is formed between adjacent conductive layers arranged at the same pitch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10359884U JPS6120074U (en) | 1984-07-09 | 1984-07-09 | heat seal connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10359884U JPS6120074U (en) | 1984-07-09 | 1984-07-09 | heat seal connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6120074U true JPS6120074U (en) | 1986-02-05 |
JPS645351Y2 JPS645351Y2 (en) | 1989-02-09 |
Family
ID=30662988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10359884U Granted JPS6120074U (en) | 1984-07-09 | 1984-07-09 | heat seal connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6120074U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5121192A (en) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | DODENSEISETSU CHAKUSHIITO |
JPS552709A (en) * | 1978-06-19 | 1980-01-10 | Ricoh Co Ltd | Evaporation source for metallizing |
-
1984
- 1984-07-09 JP JP10359884U patent/JPS6120074U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5121192A (en) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | DODENSEISETSU CHAKUSHIITO |
JPS552709A (en) * | 1978-06-19 | 1980-01-10 | Ricoh Co Ltd | Evaporation source for metallizing |
Also Published As
Publication number | Publication date |
---|---|
JPS645351Y2 (en) | 1989-02-09 |
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