JPS61199695A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a printed wiring board using a double-sided copper foil laminated board.

(Prior Art) The most common method for manufacturing printed wiring boards is the etched wheel method. This etched wheel method uses, for example, a double-sided copper foil-covered 8Im plate, makes holes in it, adheres cedar to the holes, forms a copper layer on the inner wall of the hole by chemical plating or electroplating, and then This method uses a large amount of copper to form a predetermined circuit, but it has the disadvantage that it requires a large amount of copper and is expensive.

For this reason, a method called a part-additive method has been used instead of the etched wheel method to reduce manufacturing costs. In the part-additive method, a double-sided copper foil laminated board is first etched to form a circuit, then holes are made, the circuit area except for the land area around the hole is covered with plating resist, and the inside of the hole is covered with a plating resist. A copper layer is formed in the holes and lands by seeding and electroless copper plating.

(Problems to be solved by the invention) However, in this part-additive method, the adhesion between the copper foil and the plating cyst layer is low, and the plating solution seeps into the gap during electroless copper plating. However, there were drawbacks such as corrosion and discoloration of the copper foil, and short circuits between circuits.

Furthermore, there was also the drawback that the plating resist layer peeled off during subsequent soldering and the like.

An object of the present invention is to provide a method for manufacturing a vine printed wiring board, which improves the above-mentioned drawbacks and improves the adhesion between the copper foil and the plating resist layer.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a process of forming a circuit pattern on a double-sided copper foil laminated board, a process of punching holes, and a process of forming a circuit pattern on a double-sided copper foil laminated board. In the printed wiring board manufacturing method, which sequentially performs the process of forming a plating resist layer at a predetermined location, the process of seeding through holes, and the electroless plating process, Komei added copper to the process before forming the plating resist layer. The present invention provides a method for manufacturing a printed wiring board, characterized in that the surface of the foil is treated with a silane coupling agent.

(Function) That is, according to the present invention, since the surface of the copper foil is treated with a silane coupling agent before the plating resist treatment, the adhesion between the copper foil and the plating resist layer formed thereafter is improved, Prevents plating solution from seeping in.

As a silane coupling agent, mercaptosilane, for example, γ-mercaptoalkylalkoxysilane such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane, is particularly effective when used in an amount of 1 it%.

(Example) Hereinafter, the present invention will be explained based on examples.

A double-sided copper foil laminated plate (MCL-44 manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 1.5 mm is used as the laminated plate.

First, this laminate is etched at room temperature to form a circuit in a predetermined pattern. Next, drill holes for through holes. Later, Komei removed 10% of the circuit copper foil surface of the laminate.
Wash with hydrochloric acid solution for about 10 seconds, and then wash with water. After washing the laminate with water, add γ-mercaptobrobyltrimethoxysilanya γ-mercaptobrobyltrimethoxysilane at room temperature, with pH adjusted to 3 to 4 with glacial acetic acid.
Dip into a 0.3% aqueous solution of mercaptopropyltriethoxysilane for about 5 seconds, remove and dry at 90'C for 10 minutes. After drying, plating resist ink (HCTM-0 manufactured by Hitachi Chemical Co., Ltd.
28-1) is printed and cured to form a plating resist layer. After forming the plating resist layer, the holes were treated with a cedar (H8101B manufactured by Hitachi Chemical Co., Ltd.), washed with sulfuric acid, and washed with water. After washing with water, a treatment with an electroless plating solution was performed.

When the laminate was examined after electroless plating, it was found that almost no plating solution penetrated between the copper foil and the plating resist layer, and no peeling of the plating resist layer was observed.

(Effects of the Invention) As described above, according to the present invention, since the surface of the copper foil is treated with a silane coupling agent before forming the plating resist layer, the adhesion between the copper foil and the plating resist layer is improved. , a method for manufacturing a printed wiring board is obtained that can prevent defects caused by plating solution penetrating between the copper foil and the plating resist layer.

Claims (1)

[Claims] (1) A process of forming a circuit pattern on a double-sided copper foil laminated board, a process of drilling a hole, a process of forming a plating resist layer at a predetermined location other than the through-hole land, a process of seeding the through-hole, no A method for manufacturing a printed wiring board in which electrolytic plating steps are sequentially performed, wherein the surface of the copper foil is treated with a silane coupling agent after the hole punching step and before the step of forming a plating resist layer. Production method.