JPS61199071U - - Google Patents
Info
- Publication number
- JPS61199071U JPS61199071U JP8198285U JP8198285U JPS61199071U JP S61199071 U JPS61199071 U JP S61199071U JP 8198285 U JP8198285 U JP 8198285U JP 8198285 U JP8198285 U JP 8198285U JP S61199071 U JPS61199071 U JP S61199071U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- insulating layer
- thick film
- lower electrode
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Description
第１図は本考案の一実施例を示す平面図、第２
図は同Ａ―Ａ線断面図、第３図は従来の平面図、
第４図はＢ―Ｂ線断面図である。
１１……セラミツク基板、１２……下部電極、
１３……誘電体、１４，１５……上部電極、１６
……絶縁壁体。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line A-A, and Figure 3 is a conventional plan view.
FIG. 4 is a sectional view taken along the line BB. 11... Ceramic substrate, 12... Lower electrode,
13... Dielectric, 14, 15... Upper electrode, 16
...Insulating wall.
Claims (1)
ーバ部分を有し、このクロスオーバ部分の下部電
極と上部電極との間に絶縁層を形成する厚膜混成
集積回路において、隣接する上部電極間に絶縁壁
体を前記絶縁層から突出形成することを特徴とす
る厚膜混成集積回路。 In a thick film hybrid integrated circuit in which a substrate has a crossover portion of a lower electrode and a plurality of upper electrodes, and an insulating layer is formed between the lower electrode and the upper electrode of this crossover portion, there is a gap between adjacent upper electrodes. A thick film hybrid integrated circuit characterized in that an insulating wall body is formed to protrude from the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8198285U JPS61199071U (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8198285U JPS61199071U (en) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61199071U true JPS61199071U (en) | 1986-12-12 |
Family
ID=30629283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8198285U Pending JPS61199071U (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199071U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160198A (en) * | 1981-03-27 | 1982-10-02 | Nippon Electric Co | Crossover insulating layer structure for thick film multilayer circuit board |
| JPS58148498A (en) * | 1982-02-26 | 1983-09-03 | 住友電気工業株式会社 | Yield improving pattern for ceramic thick film printed circuit board |
-
1985
- 1985-05-30 JP JP8198285U patent/JPS61199071U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160198A (en) * | 1981-03-27 | 1982-10-02 | Nippon Electric Co | Crossover insulating layer structure for thick film multilayer circuit board |
| JPS58148498A (en) * | 1982-02-26 | 1983-09-03 | 住友電気工業株式会社 | Yield improving pattern for ceramic thick film printed circuit board |