JPS61198644A - ウエハの移し替え方法 - Google Patents

ウエハの移し替え方法

Info

Publication number
JPS61198644A
JPS61198644A JP3667185A JP3667185A JPS61198644A JP S61198644 A JPS61198644 A JP S61198644A JP 3667185 A JP3667185 A JP 3667185A JP 3667185 A JP3667185 A JP 3667185A JP S61198644 A JPS61198644 A JP S61198644A
Authority
JP
Japan
Prior art keywords
wafer
chucks
interval
chuck
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3667185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226382B2 (enrdf_load_html_response
Inventor
Kenichi Kinoshita
健一 木下
Wataru Ookase
亘 大加瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TERU SAAMUKO KK
Tokyo Electron Sagami Ltd
Original Assignee
TERU SAAMUKO KK
Tokyo Electron Sagami Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TERU SAAMUKO KK, Tokyo Electron Sagami Ltd filed Critical TERU SAAMUKO KK
Priority to JP3667185A priority Critical patent/JPS61198644A/ja
Publication of JPS61198644A publication Critical patent/JPS61198644A/ja
Publication of JPH0226382B2 publication Critical patent/JPH0226382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
JP3667185A 1985-02-27 1985-02-27 ウエハの移し替え方法 Granted JPS61198644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3667185A JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3667185A JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Publications (2)

Publication Number Publication Date
JPS61198644A true JPS61198644A (ja) 1986-09-03
JPH0226382B2 JPH0226382B2 (enrdf_load_html_response) 1990-06-08

Family

ID=12476315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3667185A Granted JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Country Status (1)

Country Link
JP (1) JPS61198644A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0185326U (enrdf_load_html_response) * 1987-11-26 1989-06-06
JP2011224733A (ja) * 2010-04-21 2011-11-10 Ihi Corp 把持装置と方法
CN103236414A (zh) * 2013-05-17 2013-08-07 嘉兴景焱智能装备技术有限公司 晶圆固定装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0185326U (enrdf_load_html_response) * 1987-11-26 1989-06-06
JP2011224733A (ja) * 2010-04-21 2011-11-10 Ihi Corp 把持装置と方法
CN103236414A (zh) * 2013-05-17 2013-08-07 嘉兴景焱智能装备技术有限公司 晶圆固定装置
CN103236414B (zh) * 2013-05-17 2015-09-30 嘉兴景焱智能装备技术有限公司 晶圆固定装置

Also Published As

Publication number Publication date
JPH0226382B2 (enrdf_load_html_response) 1990-06-08

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