JPS61195896A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a card containing an integrated circuit or the like, and particularly to an IC card that prevents the influence of heat generated by the built-in integrated circuit.

[Background of the invention]

2. Description of the Related Art In recent years, a card called an IC card that includes a built-in memory element and a control element for storing ID information, for example, has been proposed.

Since such an IC card requires only one piece of stored information, there are various ways to protect it. However, conventional IC
The object of protection regarding cards is Japanese Patent Application Laid-Open No. 58-13445.
Static electricity countermeasures shown in Publication No. 6 and JP-A-58-1344
The protection measures against heat generated by an IC card that is an external force and has a built-in semiconductor that consumes power, as shown in Publication No. 56, is as follows:
Not considered. In particular, the base material of an IC card is synthetic resin, and when data is continuously recorded and reproduced, the internal elements generate heat and the synthetic resin deforms, causing the internal elements to be affected by this deformation force. It is unlikely to be damaged by.

[Purpose of the invention]

An object of the present invention is to provide a protective means that prevents the card from being damaged due to the heat generated by the semiconductor integrated circuit 1 inside the card and the temperature of the operating environment affecting the resin that is the base material of the card. be.

[Summary of the invention]

An IC card is composed of semiconductor integrated circuits, connecting conductors, exterior resin, etc., but the resin is most susceptible to the effects of temperature and melts at high temperatures.

To prevent this, a temperature detection element is built into the resin, its output is input to the semiconductor integrated circuit, and in response to an external operation command, the IC card stops operating, and the semiconductor integrated circuit itself The aim is to minimize heat generation.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing the arrangement of components within an IC card in an embodiment, and FIG. 2 is a diagram showing a connection diagram. Reference numeral 1 indicates the outer shape of an IC card made of resin, 2 indicates an external connection terminal for reading and writing to the IC card, and 3 indicates a conductor for connecting built-in elements of the internal semiconductor integrated circuit. Reference numeral 4 denotes an integrated circuit that controls the storage element according to commands from an external device, and in this embodiment, it is a one-chip microcomputer (hereinafter referred to as a one-chip microcomputer) having an operating program built into the chip. 5 is a temperature detection element, which is a platinum wire or a ceramic sintered body.

Reference numeral 6 indicates a storage element, which in this embodiment is an electrically rewritable read-only memory (hereinafter referred to as EEFROM).
It is called EPROM. ) is shown.

When writing or reading from the IC card writing/reading device to the BBPR, 0M6 via the external connection terminal 4 is specified, one chip controller 4
Generates an operation signal to BBPR, 0M6. At this time, I.J.
The power consumption of FROM is 0.5 to α7w81 degrees, which is 5
Since power is concentrated in a chip as small as m x 5 , the local temperature rise is around 100°C. If this condition continues for a long time, the heat resistance limit of the surrounding resin will be exceeded.

(In the case of vinyl chloride, the heat resistance limit is around 80℃). If the resin is melted by this, exposure of the semiconductor, etc.
The C card will be destroyed.

In order to prevent the above-mentioned destruction, the present invention provides a temperature detection element 5
is placed near the integrated circuit. In Fig. 2, R1 and R2 are temperature detection elements with different temperature coefficients, and when the temperature changes, the voltage value divided by the detection elements R1 and R2 is changed, and that value changes the voltage value of the one-chip microcomputer 4. When the threshold level ft m ,t of the input terminal IN is exceeded, the one-chip microcomputer 4 recognizes it as a temperature abnormality. As soon as the single-chip microcomputer 4 recognizes this, it stops operating and shifts its operation to a standby state.

Since the temperature resistance of recent IC cards is set to 50 cc by 180, it is desirable that this temperature limit is 50 cc. At this time, a message indicating that the temperature of the IC card resin is abnormal may be transmitted to the writing/reading device, and an instruction to stop operation may be given to the 1-chip microcontroller from the outside.
When the computer is in a stopped state, an abnormality may be detected because there is no response from the IC card within a certain period of time, and the writing/reading device may recognize that the temperature is abnormal. At this time, the ggpRoM6 in the IC card enters a standby state, and the power consumption at that time is 0.1 W or less, so the temperature rise is low and the resin is prevented from melting.

Although the above embodiment shows an example in which the temperature detection element is provided outside the integrated circuit, the forward voltage of the PN junction part can also be used as a temperature detection element within the integrated circuit to prevent abnormal production increases. It is also possible.

〔Effect of the invention〕

As described above, according to the present invention, a problem arises when reading and writing operations are continuously performed on an IC card. It is possible to prevent damage to the IC card due to temperature, and even if the writing/reading device malfunctions and issues an abnormal command, it is possible to prevent permanent destruction of the IC card.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a layout of an embodiment of an IC card according to the present invention, and FIG. 2 is a diagram showing connections. DESCRIPTION OF SYMBOLS 1... IC card exterior resin, 2... External connection VC terminal, 3... Connection conductor, 4... Semiconductor ST-integrated circuit, 5
...Temperature detection element, 6...Semiconductor memory element agent 1st 2nd country

Claims (3)

[Claims] (1) Detecting the temperature of a semiconductor integrated circuit that controls a memory element, an electrically rewritable semiconductor memory element, an external connection terminal that connects the semiconductor integrated circuit to the outside, and the semiconductor integrated circuit. An IC characterized in that a temperature detection element and a conductor connecting the above-mentioned parts are embedded inside a resin.
card. (2) The IC card according to claim 1, wherein the temperature detection element stops the operation of the semiconductor integrated circuit when the temperature of the semiconductor integrated circuit reaches a predetermined temperature or higher. (3) The IC card according to claim 1, wherein the predetermined temperature is 50°C.