JPS61195098U - - Google Patents
Info
- Publication number
- JPS61195098U JPS61195098U JP7915885U JP7915885U JPS61195098U JP S61195098 U JPS61195098 U JP S61195098U JP 7915885 U JP7915885 U JP 7915885U JP 7915885 U JP7915885 U JP 7915885U JP S61195098 U JPS61195098 U JP S61195098U
- Authority
- JP
- Japan
- Prior art keywords
- case
- electronic component
- plating layer
- component unit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910000889 permalloy Inorganic materials 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案の実施例による電子部器ユニ
ツトのケースの部分断面図、第２図は従来におけ
る電子部品ユニツトのケースの構成断面図である
。
図において、１：電子部品ユニツト、２：電子
部品ユニツト収容用のケース、３：ケース本体、
４：銅めつき層、５：錫ないしはんだめつき層。
FIG. 1 is a partial sectional view of a case of an electronic component unit according to an embodiment of the present invention, and FIG. 2 is a structural sectional view of a case of a conventional electronic component unit. In the figure, 1: electronic component unit, 2: case for housing electronic component unit, 3: case body,
4: Copper plating layer, 5: Tin or solder plating layer.
Claims (1)
に対し、該ケースを成形加工した後にそのケース
の表面に銅めつき層および錫ないしはんだめつき
層を成層して構成したことを特徴とする電子部品
ユニツトのケース。 (2) 実用新案登録請求の範囲第１項に記載のケ
ースにおいて、銅めつき層の厚みが１０〜１５μ
ｍ、錫、はんだめつき層の厚みが２５〜３５μｍ
であることを特徴とする電子部品ユニツトのケー
ス。 (3) 実用新案登録請求の範囲第１項に記載のケ
ースにおいて、ケースの素材がパーマロイである
ことを特徴とする電子部品ユニツトのケース。[Scope of Claim for Utility Model Registration] (1) A metal case housing an electronic component unit is formed by forming a copper plating layer and a tin or solder plating layer on the surface of the case. A case for an electronic component unit characterized by the following configuration. (2) In the case described in paragraph 1 of the claims for utility model registration, the thickness of the copper plating layer is 10 to 15 μm.
m, tin, thickness of solder plating layer is 25 to 35 μm
A case for an electronic component unit characterized by: (3) A case for an electronic component unit, which is characterized in that the material of the case is permalloy, in the case set forth in claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7915885U JPS61195098U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7915885U JPS61195098U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195098U true JPS61195098U (en) | 1986-12-04 |
Family
ID=30623808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7915885U Pending JPS61195098U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195098U (en) |
-
1985
- 1985-05-27 JP JP7915885U patent/JPS61195098U/ja active Pending
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