JPS61190166U - - Google Patents

Info

Publication number
JPS61190166U
JPS61190166U JP7392385U JP7392385U JPS61190166U JP S61190166 U JPS61190166 U JP S61190166U JP 7392385 U JP7392385 U JP 7392385U JP 7392385 U JP7392385 U JP 7392385U JP S61190166 U JPS61190166 U JP S61190166U
Authority
JP
Japan
Prior art keywords
stem
semiconductor laser
block portion
die
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7392385U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7392385U priority Critical patent/JPS61190166U/ja
Publication of JPS61190166U publication Critical patent/JPS61190166U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す側面図、第2
図は従来例を示す側面図、第3図は他の従来例を
示す側面図である。 図中、1:レーザチツプ、2:ブロツク部、4
:段部。

Claims (1)

    【実用新案登録請求の範囲】
  1. プレス加工によりブロツク部を含めてステムを
    一体成形するものにおいて、前記ブロツク部にお
    ける半導体レーザチツプをダイボンドする面の前
    方に段部を形成したことを特徴とする半導体レー
    ザ用ステム。
JP7392385U 1985-05-17 1985-05-17 Pending JPS61190166U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7392385U JPS61190166U (ja) 1985-05-17 1985-05-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7392385U JPS61190166U (ja) 1985-05-17 1985-05-17

Publications (1)

Publication Number Publication Date
JPS61190166U true JPS61190166U (ja) 1986-11-27

Family

ID=30613741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7392385U Pending JPS61190166U (ja) 1985-05-17 1985-05-17

Country Status (1)

Country Link
JP (1) JPS61190166U (ja)

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