JPS61185996A - Automatic terminal plating apparatus - Google Patents
Automatic terminal plating apparatusInfo
- Publication number
- JPS61185996A JPS61185996A JP2610485A JP2610485A JPS61185996A JP S61185996 A JPS61185996 A JP S61185996A JP 2610485 A JP2610485 A JP 2610485A JP 2610485 A JP2610485 A JP 2610485A JP S61185996 A JPS61185996 A JP S61185996A
- Authority
- JP
- Japan
- Prior art keywords
- conveyor belt
- plating
- printed circuit
- circuit board
- automatic terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明はプリント基板の端子部分にめっきを解こす自動
端子めっき装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an automatic terminal plating apparatus for deplating terminal portions of a printed circuit board.
［発明の技術的背景とその問題点］
従来からプリント基板の端子部分にめっきを施ず装置と
して、プリント基板を両面から挟持する搬送ベルトと、
この搬送ベルトを駆動する駆動装置と、前記搬送ベルト
の搬送路に沿ってその下方に配置された複数の処理セル
とを備えた自動端子めつき装置が知られている。[Technical background of the invention and its problems] Conventionally, the terminal portion of the printed circuit board is not plated, and as a device, a conveyor belt that holds the printed circuit board from both sides,
An automatic terminal plating apparatus is known that includes a drive device that drives the conveyor belt, and a plurality of processing cells arranged below the conveyor belt along the conveyance path of the conveyor belt.
この自動端子めっき装置においては、めっきを施すべき
プリント基板が、全ラインを通じて一対の搬送ベルトに
挟持されて搬送され、その過程で端子めっき部分が研磨
装置、ニッケルめっきセル、金めつきセルおよび乾燥賛
歌等を通過して、それぞれ研磨、ニッケルめっき、金め
つき、乾燥等の各処理が施される。In this automatic terminal plating equipment, the printed circuit board to be plated is conveyed through the entire line by being held between a pair of conveyor belts, and in the process, the terminal plating area is transferred to the polisher, nickel plating cell, gold plating cell, and dryer. After passing through the hymns, etc., each piece undergoes various treatments such as polishing, nickel plating, gold plating, and drying.
ところでこのような従来の自動端子めっき装置において
は、搬送ベルトの駆動装置が正送機構しか有しておらず
、また一度ベルトではさまれたプリント基板を途中で抜
き出すことができないため、たとえば研磨装置で研磨さ
れたプリント基板の研磨状態を確認するためにプリント
基板を取り出したい場合でも、プリント基板は搬送ベル
トの出口側からしか取り出すことができなかった。した
がって、研磨状態の確認に非常に時間がかかり、能率が
悪いという欠点があった。However, in such conventional automatic terminal plating equipment, the drive device for the conveyor belt has only a forward feeding mechanism, and it is not possible to remove the printed circuit board once it is caught between the belts. Even if you wanted to take out the printed circuit board to check its polishing condition, you could only take out the printed circuit board from the exit side of the conveyor belt. Therefore, there is a drawback that it takes a very long time to check the polishing state, resulting in poor efficiency.
Ｉ発明の目的］
本発明はこのような従来の欠点を解消するためなされた
もので、研磨状況を確認する場合にプリント基板の取り
出しを能率良く行なうことのできる自動端子めっき装置
を提供することを目的とする。I. OBJECT OF THE INVENTION The present invention has been made in order to eliminate such conventional drawbacks, and an object of the present invention is to provide an automatic terminal plating device that can efficiently take out a printed circuit board when checking the polishing status. purpose.
［発明の概要］
すなわち本考案は、プリント基板を両面から挟持する搬
送ベルトと、この搬送ベルトを駆動する駆動装置と、前
記搬送ベルトの搬送路に沿ってその下方に順に配置され
た研磨装置および複数のめっき処理セルとを備えた自動
端子めっき装置において、前記駆動装置を前記搬送ベル
トの逆送を可能に構成することにより、プリント基板の
研磨状況の確認のための取り出しを能率よく行ない、生
産性の向上を可能にしたものである。[Summary of the Invention] That is, the present invention comprises a conveyor belt that holds a printed circuit board from both sides, a drive device that drives this conveyor belt, a polishing device that is arranged below the conveyor belt in order along the conveyance path of the conveyor belt, and In an automatic terminal plating apparatus equipped with a plurality of plating processing cells, the drive device is configured to allow the conveyor belt to be fed in reverse, thereby efficiently taking out the printed circuit board for checking the polishing status, and increasing the production speed. This made it possible to improve sexual performance.
Ｕ発明の実施例１ 次に本発明の実施例を図面を用いて説明する。Example 1 of U invention Next, embodiments of the present invention will be described using the drawings.
この実施例の装置は、第１図および第２図にその構成を
概略的に示すように、プリント基板Ｐを両面から挟持す
る搬送ベルト１と、この搬送ベルト１を駆動する駆動装
置２と、搬送ベルト１の搬送路に沿ってその下方に配置
された研磨装Ｍ３と、複数のめつき処理セル４と、乾燥
装置（図示せず）からその主体部分が構成されている。As schematically shown in FIGS. 1 and 2, the device of this embodiment includes a conveyor belt 1 that holds a printed circuit board P from both sides, a drive device 2 that drives this conveyor belt 1, The main portion thereof includes a polishing device M3 disposed below the conveyor belt 1 along the conveyance path, a plurality of plating processing cells 4, and a drying device (not shown).
研磨装置３は、例えばスクラビング（回転研磨）装置か
らなり、その回転速度は電子コントロールされ、電流に
よってスクラブ圧力が調整されるようになっている。The polishing device 3 is composed of, for example, a scrubbing (rotary polishing) device, the rotational speed of which is electronically controlled, and the scrubbing pressure is adjusted by an electric current.
また、めっき処理セル４は、例えば前処理槽４ａ１ニツ
ケルめっきセル４ｂ、金めつきセル４０等からなり、研
磨装置３および各めっき処理セル４ａ 、４ｂ １４ｃ
間には水洗装置Ｆ５ａ 、 ５ｂ 、５Ｃ・・・が配置
されている。The plating cell 4 includes, for example, a pretreatment tank 4a, a nickel plating cell 4b, a gold plating cell 40, etc., and includes a polishing device 3 and each plating cell 4a, 4b, 14c.
Water washing devices F5a, 5b, 5C, . . . are arranged between them.
これらの各めっき処理槽および水洗装置におけるめっき
処理、水洗は、第２図に示すように、ノズル６から処理
液７をスプレィすることによって行なわれる。さらに、
これらのめつき処理槽および水洗槽の直後には、セパレ
ータ（小部屋）が配置され、核部でスクィーズすなわち
ソフトプラスチックや絞りローラ等によるワイピングが
行なわれ、各槽中の液の持出しを防ぐような機構にされ
ている。なお、８は液を抜くためのドレンである。Plating processing and water washing in each of these plating processing tanks and water washing devices are performed by spraying a processing liquid 7 from a nozzle 6, as shown in FIG. moreover,
A separator (small room) is placed immediately after these plating treatment tanks and washing tanks, and squeezing, that is, wiping with soft plastic or squeezing rollers, is performed at the core to prevent the liquid in each tank from being taken out. It has a good structure. Note that 8 is a drain for draining liquid.
そして、搬送ベルト１を駆動する駆動装置２には、その
駆動部に搬送ベルト１の搬送方向を正逆（Ａ。The drive device 2 that drives the conveyor belt 1 has a drive section that rotates the conveyor belt 1 in forward and reverse directions (A).
Ｂ）方向に切換えるためのギア（図示を省略）が備えら
れている。A gear (not shown) for switching in the B) direction is provided.
このように構成された本実施例の装置は、搬送ベルト１
を正逆いずれの方向にも駆動することができるので、例
えば長さ１０嘗の製造ラインで、搬送速度１ｍ／分の速
度でプリント基板を入口から出口まで搬送している場合
、従来の装置ではプリント基板をラインの出口側からし
か取り出すことができなかったので研磨装置３における
プリント基板の研磨の良否を確認するのに約１０分のロ
スタイムを要していたが、本発明の装置では搬送ベルト
１を逆送することにより、約１分で入口側からプリント
基板を取り出して確認することができる。The apparatus of this embodiment configured in this way has a conveyor belt 1
can be driven in either forward or reverse directions, so for example, in a production line 10 meters long, when printed circuit boards are being transported from the entrance to the exit at a transport speed of 1 m/min, conventional equipment cannot Since the printed circuit board could only be taken out from the exit side of the line, it took about 10 minutes of lost time to check whether the printed circuit board was polished in the polishing device 3. However, in the device of the present invention, the conveyor belt By reversing 1, it is possible to take out the printed circuit board from the entrance side and check it in about 1 minute.
［発明の効果］
以上説明したように、本発明の自動端子めっき装置はプ
リント基板を搬送する搬送ベルトが正逆両方向に駆動可
能に構成されているので、研磨後のプリント基板の状態
を確認する場合にプリント基板を入口側から取り出すこ
とができ、生産性が向上する。[Effects of the Invention] As explained above, since the automatic terminal plating apparatus of the present invention is configured such that the conveyor belt for conveying the printed circuit board can be driven in both forward and reverse directions, it is possible to check the condition of the printed circuit board after polishing. In some cases, the printed circuit board can be taken out from the entrance side, improving productivity.
第１図は本発明装置を概略的に示す図、第２図は第１図
のＩｔ−Ｉｔ線に沿う拡大断面図である。
１・・・・・・・・・・・・搬送ベルト２・・・・・・
・・・・・・駆動装置
３・・・・・・・・・・・・研磨装置
４・・・・・・・・・・・・めっき処理セル４ａ・・・
・・・・・・前処理槽
４ｂ・・・・・・・・・ニッケルめっき処理セル４Ｃ・
・・・・・・・・金めつき処理セル５ａ、５ｂ・・・・
・・水洗装置
６・・・・・・・・・・・・ノズル
７・・・・・・・・・・・・処理液
Ｐ・・・・・・・・・・・・プリント基板代理人弁理士
須 山 佐 −
第１図
第２図FIG. 1 is a diagram schematically showing the apparatus of the present invention, and FIG. 2 is an enlarged sectional view taken along the line It-It in FIG. 1......Transport belt 2...
...... Drive device 3 ...... Polishing device 4 ...... Plating processing cell 4a ...
・・・・・・Pre-treatment tank 4b・・・・・・Nickel plating treatment cell 4C・
......Gold plating processing cells 5a, 5b...
...Water washing device 6...Nozzle 7...Processing liquid P...Printed circuit board agent Patent Attorney Sa Suyama - Figure 1 Figure 2
Claims (2)
この搬送ベルトを駆動する駆動装置と、前記搬送ベルト
の搬送路に沿ってその下方に順に配置された研磨装置お
よび複数の処理セルとを備えた自動端子めっき装置にお
いて、前記駆動装置が前記搬送ベルトを逆送可能に構成
されてなることを特徴とする自動端子めっき装置。(1) A conveyor belt that holds the printed circuit board from both sides,
In an automatic terminal plating apparatus including a drive device that drives the conveyor belt, and a polishing device and a plurality of processing cells that are sequentially arranged below the conveyor belt along the conveyance path of the conveyor belt, the drive device drives the conveyor belt. An automatic terminal plating device characterized by being configured to be capable of reverse feeding.
ルとを備えていることを特徴とする特許請求の範囲第１
項記載の自動端子めっき装置。(2) Claim 1, characterized in that the processing cell includes a nickel plating cell and a gold plating cell.
Automatic terminal plating equipment as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610485A JPS61185996A (en) | 1985-02-13 | 1985-02-13 | Automatic terminal plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610485A JPS61185996A (en) | 1985-02-13 | 1985-02-13 | Automatic terminal plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61185996A true JPS61185996A (en) | 1986-08-19 |
Family
ID=12184284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2610485A Pending JPS61185996A (en) | 1985-02-13 | 1985-02-13 | Automatic terminal plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61185996A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054880A (en) * | 2000-08-09 | 2002-02-20 | Asahi Tec Corp | Rotary heat treatment furnace, heat treatment device, and heat treatment method |
| JP2002107064A (en) * | 2000-09-27 | 2002-04-10 | Asahi Tec Corp | Hot air blow-through type fluidized bed furnace, and heat treating device using the furnace |
| US7025927B2 (en) | 2000-08-09 | 2006-04-11 | Asahi Tec Corporation | Hot air blowing type fluidized-bed furnace, rotary heat-treatment furnace, heat-treatment apparatus, and method of heat treatment |
-
1985
- 1985-02-13 JP JP2610485A patent/JPS61185996A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054880A (en) * | 2000-08-09 | 2002-02-20 | Asahi Tec Corp | Rotary heat treatment furnace, heat treatment device, and heat treatment method |
| US7025927B2 (en) | 2000-08-09 | 2006-04-11 | Asahi Tec Corporation | Hot air blowing type fluidized-bed furnace, rotary heat-treatment furnace, heat-treatment apparatus, and method of heat treatment |
| KR100706697B1 (en) * | 2000-08-09 | 2007-04-11 | 아사히 테크 가부시키가이샤 | Hot air blow type fluidized bed furnace, rotary type heat treatment furnace, heat treatment device, and heat treatment method |
| JP2002107064A (en) * | 2000-09-27 | 2002-04-10 | Asahi Tec Corp | Hot air blow-through type fluidized bed furnace, and heat treating device using the furnace |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060201817A1 (en) | Device and method for electrolytically treating electrically insulated structures | |
| GB2174107A (en) | Process and apparatus for plating onto articles | |
| JPS61185996A (en) | Automatic terminal plating apparatus | |
| JPH0193197A (en) | Substrate cleaning mechanism | |
| GB2144150A (en) | Plating the contacts of a printed circuit board | |
| US3643278A (en) | Printed circuit panel scrubbing apparatus | |
| CN111996577A (en) | Quick electroplating production line | |
| JP2948748B2 (en) | Lead frame transfer device | |
| JP2689097B2 (en) | Conveyor for printed wiring board | |
| KR20070017718A (en) | Apparatus for copper plating | |
| JPS6225496A (en) | Method and apparatus for continuous chemical plating of printed wiring board conduction hole | |
| JPS60169599A (en) | Device for plating plate-shaped work | |
| JPH08172271A (en) | Plating method of printed-circuit board | |
| KR101215925B1 (en) | Connection terminal piece partial coating device | |
| JPS6216596A (en) | Solder peeling apparatus for printed circuit board | |
| JPH0122357B2 (en) | ||
| CN208162153U (en) | Water washing device after a kind of pcb board is gold-plated | |
| SU147409A1 (en) | Automatic machine for applying multi-layer electroplating on cylindrical products | |
| JPS6045714B2 (en) | Continuous partial plating equipment for the lower end of the workpiece | |
| JP6662231B2 (en) | Power supply jig, work holding jig, chemical processing equipment | |
| JP2920525B1 (en) | Liquid drainer for thin plate | |
| KR101215926B1 (en) | Connection terminal piece partial coating device | |
| JP3389321B2 (en) | Substrate transfer device and method of manufacturing hybrid integrated circuit device using the same | |
| JPS6237839B2 (en) | ||
| Breidenbach et al. | The Etching of Copper in the Preliminary Treatment of Printed Circuit Boards |