CN111996577A - Quick electroplating production line - Google Patents
Quick electroplating production line Download PDFInfo
- Publication number
- CN111996577A CN111996577A CN202010878194.0A CN202010878194A CN111996577A CN 111996577 A CN111996577 A CN 111996577A CN 202010878194 A CN202010878194 A CN 202010878194A CN 111996577 A CN111996577 A CN 111996577A
- Authority
- CN
- China
- Prior art keywords
- tank
- activation
- pump
- electroplating
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 77
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 88
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000003860 storage Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 127
- 230000004913 activation Effects 0.000 claims description 103
- 238000007747 plating Methods 0.000 claims description 82
- 229910052759 nickel Inorganic materials 0.000 claims description 65
- 229910052737 gold Inorganic materials 0.000 claims description 59
- 239000010931 gold Substances 0.000 claims description 59
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 56
- 238000005406 washing Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 18
- 238000011084 recovery Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000004064 recycling Methods 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a rapid electroplating production line, which comprises a rack, an electroplating mechanism and a transmission mechanism, wherein the rack is provided with a plurality of electroplating mechanisms; the electroplating mechanism comprises an electroplating bath, a liquid storage tank and a liquid supply pump; the electroplating bath is arranged on the frame; the liquid storage tank is arranged at the bottom of the rack; the liquid supply pump is arranged at the top of the liquid storage tank, the input end of the liquid supply pump is communicated with the liquid storage tank, and the output end of the liquid supply pump is communicated with the electroplating bath; the transmission mechanism comprises a conveying motor, a conveying belt and a lifting conductive clamp; the conveying motor is arranged on the rack; the conveying belt is rotatably arranged on the rack and is in transmission connection with the driving end of the conveying motor; the lifting conductive clamp is arranged on the outer side of the conveying belt and is positioned above the electroplating bath. The invention can effectively improve the processing efficiency of products and the productivity.
Description
Technical Field
The invention belongs to the technical field of circuit board electroplating, and particularly relates to a rapid electroplating production line.
Background
The electroplating production line refers to a general name of all electroplating equipment in the process of completing the electroplating process of industrial products, the electroplating process must be completed according to the sequence, and the electroplating production line is also called as an electroplating production line.
The existing electroplating production line for the circuit board is limited to poor electroplating effect of an electroplating bath on products, and the products are usually required to be repeatedly electroplated for a plurality of times, so that complete electroplating processing of the circuit board can be realized, the processing efficiency of the products is not favorably improved, and the productivity is low.
Disclosure of Invention
The invention provides a rapid electroplating production line for solving the technical problems.
The solution adopted by the invention for realizing the technical effect is as follows:
the rapid electroplating production line comprises a frame, an electroplating mechanism and a transmission mechanism; the electroplating mechanism comprises an electroplating bath, a liquid storage tank and a liquid supply pump; the electroplating bath is arranged on the frame; the liquid storage tank is arranged at the bottom of the rack; the liquid supply pump is arranged at the top of the liquid storage tank, the input end of the liquid supply pump is communicated with the liquid storage tank, and the output end of the liquid supply pump is communicated with the electroplating bath; the transmission mechanism comprises a conveying motor, a conveying belt and a lifting conductive clamp; the conveying motor is arranged on the rack; the conveying belt is rotatably arranged on the rack and is in transmission connection with the driving end of the conveying motor; the lifting conductive clamp is arranged on the outer side of the conveying belt and is positioned above the electroplating bath.
Preferably, the plating bath includes a nickel plating bath and a gold plating bath; the nickel plating bath and the gold plating bath are sequentially arranged on the rack from left to right; the liquid storage tank comprises a nickel electroplating liquid tank and a gold electroplating liquid tank; the nickel electroplating solution tank and the gold electroplating solution tank are arranged at the bottom of the rack; the liquid supply pump comprises a nickel supply pump and a gold supply pump; the nickel supply pump is arranged at the top of the nickel electroplating solution tank, the input end of the nickel supply pump is communicated with the nickel electroplating solution tank, and the output end of the nickel supply pump is communicated with the nickel plating bath; the gold supply pump is arranged at the top of the gold electroplating liquid tank, the input end of the gold supply pump is communicated with the gold electroplating liquid tank, and the output end of the gold supply pump is communicated with the gold plating tank.
Preferably, the electroplating mechanism further comprises a microetching groove, a first activation groove, a second activation groove, a microetching liquid box, a first activation liquid box, a second activation liquid box, a microetching pump, a first activation pump and a second activation pump; the microetching groove, the first activation groove and the second activation groove are arranged on the rack, the microetching groove is arranged at the left end of the nickel plating groove, the first activation groove is arranged between the microetching groove and the nickel plating groove, and the second activation groove is arranged between the nickel plating groove and the gold plating groove; the microetching liquid tank, the first activating liquid tank and the second activating liquid tank are arranged at the bottom of the rack; the micro-etching pump is arranged at the top of the micro-etching liquid tank, the input end of the micro-etching pump is communicated with the top of the micro-etching liquid tank, and the output end of the micro-etching pump is communicated with the micro-etching groove; the first activation pump is arranged at the top of the first activation liquid tank, the input end of the first activation pump is communicated with the first activation liquid tank, and the output end of the first activation pump is communicated with the first activation trough; the second activation pump is arranged at the top of the second activation liquid tank, the input end of the second activation pump is communicated with the second activation liquid tank, and the output end of the second activation pump is communicated with the second activation trough.
Preferably, rinsing tanks are arranged between the microetching tank and the first activation tank, between the first activation tank and the nickel plating tank, between the nickel plating tank and the second activation tank, between the second activation tank and the gold plating tank and at the right end of the gold plating tank; the bottom of the rack is provided with washing tanks corresponding to the washing tanks in number; a water pump is arranged at the top of any one of the washing tanks; the input end of any one water pump is communicated with the corresponding rinsing tank, and the output end of the water pump is communicated with the corresponding rinsing tank.
Preferably, two rinsing baths are arranged between the microetching bath and the first activation bath, between the first activation bath and the nickel plating bath, between the nickel plating bath and the second activation bath, between the second activation bath and the gold plating bath, and at the right end of the gold plating bath.
Preferably, the electroplating mechanism further comprises a recovery tank and a recovery pump; the recovery box is arranged at the bottom of the rack; the recycling pump is arranged at the top of the recycling tank, the input end of the recycling pump is communicated with the rinsing bath, and the output end of the recycling pump is communicated with the recycling tank.
Preferably, the lifting conductive clamp comprises a conductive copper bar, a hanger, a lifting rod and a clamp; the conductive copper bar is arranged on the rack; the hanging frame is arranged on the outer side of the conveyor belt, and two ends of the bottom of the hanging frame are in sliding contact with the conductive copper bars; the lifting rod is arranged at the bottom of the hanging bracket; the clamp is arranged at the bottom of the hanger.
Preferably, the conveyor belt is a drive chain.
Preferably, the conveyor belt is a double-layer transmission chain.
The invention has the beneficial effects that: the product is conveyed by matching the lifting conductive clamp with the conveying belt, so that the conveying is convenient and the processing speed is high; meanwhile, the lifting conductive clamp can enhance the speed of current flowing to the product, so that the electroplating effect of the product is improved, the product can be electroplated at one time, the processing efficiency of the product is improved, and the productivity is increased.
Drawings
FIG. 1 is a front view of an electroplating line according to an embodiment of the present invention;
FIG. 2 is a top view of an electroplating line according to an embodiment of the present invention;
FIG. 3 is a side view of an electroplating line according to an embodiment of the present invention;
fig. 4 is a schematic view of a lifting conductive fixture disclosed in the embodiment of the present invention.
And (3) identification and explanation: 1-frame, 2-conveying motor, 3-conveyor belt, 4-lifting conductive fixture, 41-conductive copper bar, 42-hanger, 43-lifting rod, 44-fixture, 5-nickel plating tank, 6-gold plating tank, 7-nickel plating solution tank, 8-gold plating solution tank, 9-nickel supply pump, 10-gold supply pump, 11-microetching tank, 12-first activation tank, 13-second activation tank, 14-microetching solution tank, 15-first activation tank, 16-second activation tank, 17-microetching pump, 18-first activation pump, 19-second activation pump, 20-water washing tank, 21-water washing tank, 22-water pump, 23-recovery tank and 24-recovery pump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When one element is referred to as being "fixedly attached" to another element, it can be fixedly attached by welding, bolting, gluing, or the like.
Referring to fig. 1-4, in the preferred embodiment of the present invention, a rapid electroplating production line is disclosed, which comprises a frame 1, an electroplating mechanism and a transmission mechanism; the electroplating mechanism comprises an electroplating bath, a liquid storage tank and a liquid supply pump; the electroplating bath is arranged on the frame 1; the liquid storage tank is arranged at the bottom of the rack 1; the liquid supply pump is arranged at the top of the liquid storage tank, the input end of the liquid supply pump is communicated with the liquid storage tank, and the output end of the liquid supply pump is communicated with the electroplating bath; the transmission mechanism comprises a conveying motor 2, a conveying belt 3 and a lifting conductive clamp 4; the conveying motor 2 is arranged on the frame 1; the conveying belt 3 is rotatably arranged on the rack 1 and is in transmission connection with the driving end of the conveying motor 2; the lifting conductive clamp 4 is arranged on the outer side of the conveyor belt 3 and is positioned above the electroplating bath.
Specifically, the plating bath includes a nickel plating bath 5 and a gold plating bath 6; the nickel plating bath 5 and the gold plating bath 6 are arranged on the frame 1 from left to right in sequence; the liquid storage tank comprises a nickel electroplating liquid tank 7 and a gold electroplating liquid tank 8; the nickel electroplating solution tank 7 and the gold electroplating solution tank 8 are arranged at the bottom of the frame 1; the liquid supply pump comprises a nickel supply pump 9 and a gold supply pump 10; the nickel supply pump 9 is arranged at the top of the nickel electroplating solution tank 7, the input end of the nickel supply pump is communicated with the nickel electroplating solution tank 7, and the output end of the nickel supply pump is communicated with the nickel plating bath 5; the gold supply pump 10 is arranged at the top of the gold plating solution tank 8, and the input end of the gold supply pump is communicated with the gold plating solution tank 8, and the output end of the gold supply pump is communicated with the gold plating bath 6.
Specifically, the electroplating mechanism further comprises a microetching groove 11, a first activation groove 12, a second activation groove 13, a microetching liquid tank 14, a first activation liquid tank 15, a second activation liquid tank 16, a microetching pump 17, a first activation pump 18 and a second activation pump 19; the micro-etching tank 11, the first activation tank 12 and the second activation tank 13 are arranged on the frame 1, the micro-etching tank 11 is arranged at the left end of the nickel plating tank 5, the first activation tank 12 is arranged between the micro-etching tank 11 and the nickel plating tank 5, and the second activation tank 13 is arranged between the nickel plating tank 5 and the gold plating tank 6; the microetching liquid tank 14, the first activating liquid tank 15 and the second activating liquid tank 16 are arranged at the bottom of the frame 1; the microetching pump 17 is arranged at the top of the microetching liquid tank 14, the input end of the microetching pump is communicated with the top of the microetching liquid tank 14, and the output end of the microetching pump is communicated with the microetching groove 11; the first activation pump 18 is arranged at the top of the first activation liquid tank 15, and the input end thereof is communicated with the first activation liquid tank 15, and the output end thereof is communicated with the first activation tank 12; the second activation pump 19 is provided at the top of the second activation tank 16, and its input end is communicated with the second activation tank 16, and its output end is communicated with the second activation tank 13.
Specifically, a rinsing bath 20 is arranged between the microetching bath 11 and the first activation bath 12, between the first activation bath 12 and the nickel plating bath 5, between the nickel plating bath 5 and the second activation bath 13, between the second activation bath 13 and the gold plating bath 6, and at the right end of the gold plating bath 6; the bottom of the frame 2 is provided with washing tanks 21 the number of which corresponds to that of the washing tanks 20; a water pump 22 is arranged at the top of any one of the washing tanks 21; the input end of any one water pump 22 is communicated with the corresponding washing tank 21, and the output end of the water pump is communicated with the corresponding washing tank 20.
Specifically, two rinsing baths 20 are respectively arranged between the microetching bath 11 and the first activation bath 12, between the first activation bath 12 and the nickel plating bath 5, between the nickel plating bath 5 and the second activation bath 13, between the second activation bath 13 and the gold plating bath 6, and at the right end of the gold plating bath 6.
Specifically, the electroplating mechanism further comprises a recovery tank 23 and a recovery pump 24; the recovery box 23 is arranged at the bottom of the rack 1; the recovery pump 24 is provided at the top of the recovery tank 21, and has an input end communicating with the rinsing bath 20 and an output end communicating with the recovery tank 21.
Specifically, the lifting conductive clamp 4 comprises a conductive copper bar 41, a hanger 42, a lifting rod 43 and a clamp 44; the conductive copper bar 41 is arranged on the rack 1; the hanger 42 is arranged at the outer side of the conveyor belt 3, and two ends of the bottom of the hanger 42 are in sliding contact with the conductive copper bar 41; the lifting rod 43 is arranged at the bottom of the hanger 42; the clamp 44 is disposed at the bottom of the hanger 42.
Specifically, the conveyor belt 3 is a double-layer transmission chain, so that stable conveying of products is guaranteed.
Specifically, the left end and the right end of the rapid nickel and gold plating production line are respectively provided with a feeding manipulator and a discharging manipulator, so that the automatic feeding and the automatic discharging of the product are realized, and the processing speed of the product is improved. The manipulator is a common device in the prior art, and therefore, the description thereof is omitted.
The working principle of the invention is as follows: the circuit board is automatically grabbed onto the lifting conductive clamp 4 through a feeding manipulator, then the lifting conductive clamp 4 and the circuit board are driven by the conveyor belt 3 to move along the whole production line, the lifting of the circuit board is controlled by the lifting conductive clamp 4 during the process, so that the circuit board firstly enters the microetching groove 11, at the moment, the microetching pump 17 injects the microetching liquid in the microetching liquid box 14 into the microetching groove 11 to carry out microetching treatment on the circuit board, and the surface of the circuit board forms a micro-rough surface so as to enhance the bonding force with a coating; then enters a water washing tank 20, water in a water washing tank 21 is injected into the water washing tank 20 by a water pump 22, and the micro-etched circuit board is cleaned; then the mixture enters a first activation tank 12, at the moment, a first activation pump 18 injects the activation liquid in a first activation liquid box 15 into the first activation tank 12, so that an oxide film on the surface of the circuit board is dissolved to expose an active metal interface, and the bonding force of an electroplated layer and a matrix is ensured; then, the circuit board enters the washing tank 20 again to be washed; then the copper wire enters a nickel plating tank 5, at the moment, a nickel pump 9 is supplied to inject nickel plating solution in a nickel plating solution tank 7 into the nickel plating tank 5, and the surface of the circuit board is subjected to nickel plating treatment; then, the water enters the water washing tank 20 again for washing; then the nickel-plated nickel enters a second activation tank 13, a second activation pump 19 injects the activation liquid in a second activation liquid tank 16 into the second activation tank 13, and the nickel-plated layer on the circuit board is also subjected to activation treatment; and finally, the gold plating solution enters a gold plating tank 6, the gold plating solution in a gold plating solution tank 8 is injected into the gold plating tank 6 through a gold supply pump 10, the circuit board is subjected to gold plating treatment, and then the circuit board is put into a washing tank 20 for cleaning and drying to obtain a required product.
According to the above description, the present invention can effectively improve the processing efficiency of the product and the productivity.
While the preferred embodiments of the present invention have been illustrated in detail in the accompanying drawings, it should be understood that the scope of the invention includes, but is not limited to, the embodiments described above; while the invention has been described with reference to specific embodiments, it will be appreciated by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (9)
1. Quick electroplating production line, its characterized in that includes:
a frame;
an electroplating mechanism; the electroplating mechanism comprises an electroplating bath, a liquid storage tank and a liquid supply pump; the electroplating bath is arranged on the frame; the liquid storage tank is arranged at the bottom of the rack; the liquid supply pump is arranged at the top of the liquid storage tank, the input end of the liquid supply pump is communicated with the liquid storage tank, and the output end of the liquid supply pump is communicated with the electroplating bath;
a transport mechanism; the transmission mechanism comprises a conveying motor, a conveying belt and a lifting conductive clamp; the conveying motor is arranged on the rack; the conveying belt is rotatably arranged on the rack and is in transmission connection with the driving end of the conveying motor; the lifting conductive clamp is arranged on the outer side of the conveying belt and is positioned above the electroplating bath.
2. The rapid plating line according to claim 1, characterized in that: the electroplating bath comprises a nickel plating bath and a gold plating bath; the nickel plating bath and the gold plating bath are sequentially arranged on the rack from left to right; the liquid storage tank comprises a nickel electroplating liquid tank and a gold electroplating liquid tank; the nickel electroplating solution tank and the gold electroplating solution tank are arranged at the bottom of the rack; the liquid supply pump comprises a nickel supply pump and a gold supply pump; the nickel supply pump is arranged at the top of the nickel electroplating solution tank, the input end of the nickel supply pump is communicated with the nickel electroplating solution tank, and the output end of the nickel supply pump is communicated with the nickel plating bath; the gold supply pump is arranged at the top of the gold electroplating liquid tank, the input end of the gold supply pump is communicated with the gold electroplating liquid tank, and the output end of the gold supply pump is communicated with the gold plating tank.
3. The rapid plating line according to claim 2, characterized in that: the electroplating mechanism further comprises a micro-etching groove, a first activation groove, a second activation groove, a micro-etching liquid box, a first activation liquid box, a second activation liquid box, a micro-etching pump, a first activation pump and a second activation pump; the microetching groove, the first activation groove and the second activation groove are arranged on the rack, the microetching groove is arranged at the left end of the nickel plating groove, the first activation groove is arranged between the microetching groove and the nickel plating groove, and the second activation groove is arranged between the nickel plating groove and the gold plating groove; the microetching liquid tank, the first activating liquid tank and the second activating liquid tank are arranged at the bottom of the rack; the micro-etching pump is arranged at the top of the micro-etching liquid tank, the input end of the micro-etching pump is communicated with the top of the micro-etching liquid tank, and the output end of the micro-etching pump is communicated with the micro-etching groove; the first activation pump is arranged at the top of the first activation liquid tank, the input end of the first activation pump is communicated with the first activation liquid tank, and the output end of the first activation pump is communicated with the first activation trough; the second activation pump is arranged at the top of the second activation liquid tank, the input end of the second activation pump is communicated with the second activation liquid tank, and the output end of the second activation pump is communicated with the second activation trough.
4. The rapid plating line according to claim 3, characterized in that: rinsing tanks are arranged between the microetching tank and the first activation tank, between the first activation tank and the nickel plating tank, between the nickel plating tank and the second activation tank, between the second activation tank and the gold plating tank and at the right end of the gold plating tank; the bottom of the rack is provided with washing tanks corresponding to the washing tanks in number; a water pump is arranged at the top of any one of the washing tanks; the input end of any one water pump is communicated with the corresponding rinsing tank, and the output end of the water pump is communicated with the corresponding rinsing tank.
5. The rapid plating line according to claim 4, characterized in that: and two rinsing tanks are arranged between the microetching tank and the first activation tank, between the first activation tank and the nickel plating tank, between the nickel plating tank and the second activation tank, between the second activation tank and the gold plating tank and at the right end of the gold plating tank.
6. The rapid plating line according to claim 5, characterized in that: the electroplating mechanism further comprises a recovery tank and a recovery pump; the recovery box is arranged at the bottom of the rack; the recycling pump is arranged at the top of the recycling tank, the input end of the recycling pump is communicated with the rinsing bath, and the output end of the recycling pump is communicated with the recycling tank.
7. The rapid plating line according to claim 1, characterized in that: the lifting conductive clamp comprises a conductive copper bar, a hanger, a lifting rod and a clamp; the conductive copper bar is arranged on the rack; the hanging frame is arranged on the outer side of the conveyor belt, and two ends of the bottom of the hanging frame are in sliding contact with the conductive copper bars; the lifting rod is arranged at the bottom of the hanging bracket; the clamp is arranged at the bottom of the hanger.
8. The rapid plating line according to claim 1, characterized in that: the conveying belt is a transmission chain.
9. The rapid plating line according to claim 8, characterized in that: the conveying belt is a double-layer transmission chain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010878194.0A CN111996577A (en) | 2020-08-27 | 2020-08-27 | Quick electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010878194.0A CN111996577A (en) | 2020-08-27 | 2020-08-27 | Quick electroplating production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111996577A true CN111996577A (en) | 2020-11-27 |
Family
ID=73472005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010878194.0A Pending CN111996577A (en) | 2020-08-27 | 2020-08-27 | Quick electroplating production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111996577A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114606558A (en) * | 2022-04-12 | 2022-06-10 | 宁波德洲精密电子有限公司 | A lead frame strip is electroplated and is produced line for intelligent system control by temperature change oven |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN204311151U (en) * | 2014-11-21 | 2015-05-06 | 广州明铨机械设备有限公司 | The gold-plated equipment of a kind of vertical continuous immersion type PCB nickel plating |
| CN104911681A (en) * | 2015-01-15 | 2015-09-16 | 东莞宇宙电路板设备有限公司 | Flexible circuit board double-row continuous electroplating production line |
| CN205774895U (en) * | 2016-05-25 | 2016-12-07 | 苏州三雄自动化设备有限公司 | Pcb board plating line |
| CN207738337U (en) * | 2017-12-28 | 2018-08-17 | 东莞市速远自动化设备有限公司 | A kind of plating line gantry overhead traveling crane |
| CN207738883U (en) * | 2017-12-28 | 2018-08-17 | 珠海市春生五金工业有限公司 | Automate electroplating production device |
| CN207958537U (en) * | 2018-03-05 | 2018-10-12 | 汤润枚 | A kind of VCP semiautomatic electroplatings equipment |
| CN109023495A (en) * | 2018-09-26 | 2018-12-18 | 东莞宇宙电路板设备有限公司 | A kind of continuous glass electroplating assembly line of annular vertical |
| CN111519233A (en) * | 2020-04-22 | 2020-08-11 | 太仓市施美电镀有限公司 | Nickel plating production line and electroplating process thereof |
-
2020
- 2020-08-27 CN CN202010878194.0A patent/CN111996577A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN204311151U (en) * | 2014-11-21 | 2015-05-06 | 广州明铨机械设备有限公司 | The gold-plated equipment of a kind of vertical continuous immersion type PCB nickel plating |
| CN104911681A (en) * | 2015-01-15 | 2015-09-16 | 东莞宇宙电路板设备有限公司 | Flexible circuit board double-row continuous electroplating production line |
| CN205774895U (en) * | 2016-05-25 | 2016-12-07 | 苏州三雄自动化设备有限公司 | Pcb board plating line |
| CN207738337U (en) * | 2017-12-28 | 2018-08-17 | 东莞市速远自动化设备有限公司 | A kind of plating line gantry overhead traveling crane |
| CN207738883U (en) * | 2017-12-28 | 2018-08-17 | 珠海市春生五金工业有限公司 | Automate electroplating production device |
| CN207958537U (en) * | 2018-03-05 | 2018-10-12 | 汤润枚 | A kind of VCP semiautomatic electroplatings equipment |
| CN109023495A (en) * | 2018-09-26 | 2018-12-18 | 东莞宇宙电路板设备有限公司 | A kind of continuous glass electroplating assembly line of annular vertical |
| CN111519233A (en) * | 2020-04-22 | 2020-08-11 | 太仓市施美电镀有限公司 | Nickel plating production line and electroplating process thereof |
Non-Patent Citations (1)
| Title |
|---|
| 曾华梁等: "《电镀工艺手册》", vol. 2, 机械工业出版社, pages: 685 - 686 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114606558A (en) * | 2022-04-12 | 2022-06-10 | 宁波德洲精密电子有限公司 | A lead frame strip is electroplated and is produced line for intelligent system control by temperature change oven |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4576685A (en) | Process and apparatus for plating onto articles | |
| CN206343424U (en) | A kind of swing automatic cleaning product line | |
| CN2900556Y (en) | Double line vertical continuous electroplating device | |
| CN111996577A (en) | Quick electroplating production line | |
| CN206607333U (en) | A kind of way double-line annular V CP electroplating producing systems | |
| CN207958537U (en) | A kind of VCP semiautomatic electroplatings equipment | |
| CN105088299B (en) | Carbon fiber continuous electroplating method | |
| CN210736883U (en) | Nickel-plated gold wire | |
| CN212610896U (en) | Nickel-palladium-gold and nickel-gold melting combined equipment | |
| CN116856043A (en) | Multi-channel multi-string continuous hard chromium plating production line for metal shaft | |
| CN216141619U (en) | Automatic production circulating device for single FPC (flexible printed circuit) nickel-gold section vertical hanging rack of horizontal nickel-gold wire | |
| CN110644040A (en) | Full-automatic aluminum bar two-end tinning production line | |
| CN205711019U (en) | A kind of electrolytic tinning device | |
| EP3741474A1 (en) | A washing machine and a process for treating containers therewith | |
| CN109195358B (en) | Tin plating surface treatment device of PCB board | |
| CN204080147U (en) | A kind of horizontal pre-treatment vertical continuous formula electroplating device | |
| CN203096199U (en) | Desulfurization machine | |
| US1959764A (en) | Apparatus for plating | |
| US2675813A (en) | Apparatus for conveying pipe through an electrolyte | |
| CN205774895U (en) | Pcb board plating line | |
| CN116162993B (en) | Continuous automatic electroplating production line compatible with bucket type centrifugal plating basket and hexagonal barrel plating basket | |
| CN220685297U (en) | Wire clamp conducting mechanism for hard chromium plating production of metal shaft | |
| CN210907298U (en) | Spray washer | |
| CN221254760U (en) | Automatic electroplating production line | |
| CN215163278U (en) | Electroplating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |