JP3389321B2 - Substrate transfer device and method of manufacturing hybrid integrated circuit device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device, and more particularly to a transfer device for preventing displacement of a substrate when a fluid is ejected onto the substrate during cleaning or the like.

[0002]

2. Description of the Related Art Generally, as a transfer device, a device for transferring a substrate through which a liquid such as water, a developing solution, an etching solution and a resist stripping solution is showered from a nozzle, and a gas is showered from the nozzle. ,
Some of these are transported. It is also possible to use powder. For example, it is described in Japanese Patent Application No. 5-272359, and FIG. 5 is a schematic view of an example of the resist stripping apparatus (30). Drawing numbers (32), (33), (34),
(35), (36) and (37) are chambers, and the rollers indicated by circles on the left and right of the center of the drawing are rollers. The relatively large circles provided above and below this roller are nozzles. And chamber (3
3) is a water washing step, in which the nozzle is sprayed onto the substrate in a shower shape.

[0003]

FIG. 2 is a cross-sectional view of the transfer device where the rollers are located, and shows the substrate between the first roller (40) and the second roller (42). (42) and (43) have passed. Generally, since the roller used here is made of a relatively hard material, even when the substrates (42) and (43) having different thicknesses pass between them, the thin substrate (43) has a gap with the roller. Therefore, there is a problem that the substrate is displaced due to the water ejected from the nozzle. For example, when water is sprayed only from above, the direction of spray is oblique to the surface of the substrate, or water is sprayed from above and below and the substrate floats due to the output from below, and the water is obliquely projected from above. When it is injected into the substrate, the movement of the substrate due to this shift is remarkable. Further, even in a shower which discharges a cone from one point, there is a problem that the substrate moves due to the above relationship.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. Firstly, the first invention is in contact with the back surface of a substrate and is provided at a constant interval from a transport start point to a transport end point. And a second roller that comes into contact with the surface of the substrate and is provided at a constant interval from the transport start point to the transport end point, and the contact surface is a soft material that is recessed inward from the non-contact surface. The solution is to have a roller consisting of.

Secondly, the first supporting means of the belt or chain that contacts the back surface of the substrate and supports the substrate from the transport start point to the transport end point is in contact with the front surface of the substrate and transports from the transport start point. And a second supporting means composed of rollers provided at a certain interval to the end point, and a second means composed of a soft material such that the contact surface is recessed inward from the non-contact surface. It is a thing.

[0006]

Even if the cleaning liquid is ejected from below and the substrate floats, at least one of the rollers is made of a soft material and the substrate having a different thickness bites into the roller as shown in FIG. Even if the cleaning liquid is ejected from above, the gap can be held by both rollers, so that the displacement of the substrate can be completely prevented.

Even when the substrate is conveyed by a belt or a chain, the substrate does not shift at all if the roller provided above is made of a soft material that bites as described above. Furthermore, by making the material porous, the roller can be softened and the substrate can be held completely. Moreover, when it comes in contact with chemicals such as etching, it is necessary to have strong chemical resistance.In this case, ethylene propylene rubber is preferable as the material, and if this material is made porous, a roller that is soft and resistant to chemicals is possible. Become.

[0008]

EXAMPLES Examples of the present invention will be described below. Figure 5
The following is an explanation of the conventional transporting device consisting of the above, which employs the roller of this feature. Here, a substrate in which copper is thermocompressed on the entire surface via an adhesive resin to a metallic substrate whose surface is anodized is used for patterning this copper or patterning the nickel-plated film deposited on this. The circle marks provided on the left and right sides of the center are rollers for transporting the substrate (31), and the circle marks having a relatively large size provided above and below the roller are It is a nozzle. Therefore, in the water washing process, water, the etching aqueous solution in the etching process, and the dry air in the drying process are sprayed in a shower shape through the nozzles.

The first chamber (32) is a process for receiving the substrate (31), a process for electroplating Ni, and a process for Cu.
After a predetermined pattern is formed in the etching process of 1. and the electroless plating process of Ni, it is transferred onto the roller of this chamber. The transferred substrate is washed with water in the second chamber (33) because the chemical liquid in the previous step is attached to it. The Cu etchant is ferric chloride,
In the case of Ni, since the electrolytic plating solution is attached, the chemical solution is removed by showering with water from above and below.

Next, although not shown in the drawing, the water draining process removes water adhering to the substrate by an air shower or the like,
The substrate is introduced to the third and fourth chamber (34) (35). This step is a resist stripping step, and the stripping solution is showered through the upper and lower nozzles. Although not shown in the drawing, a liquid draining step may be added between the two chambers. The third chamber is a step of removing most of the resist, and the fourth chamber is a step of removing a slight amount of resist that could not be removed by the third chamber. Therefore, over time,
A large amount of resist floats in the third chamber (34), but since the fourth chamber is clean, the resist can be completely removed and dust is not attached to the subsequent steps.

Here, the stripping solution is showered from both sides of the substrate. Subsequently, though omitted in the drawing, the liquid is removed and then put into the fifth chamber (36). Only one chamber is shown here,
There may be more than one. If the number of chambers is increased, the probability of remaining drug solution is greatly reduced. Finally, after a liquid draining process, it is put into the sixth chamber (37), and for example, dry air, dry nitrogen, etc. are showered,
The substrate is drying. Then, if it is the Ni electroplating step, it is a Cu etching step, if it is the Cu etching step, it is a Ni electroless plating step . If there is no electroless plating step , a solder applying step, a semiconductor element fixing step, a wire This substrate is flown to the bonding process, the lead fixing process, and the casing process.

Further, in order to convey the substrate by the rollers so as not to drop it, it is necessary that the intervals between the rollers are as follows. That is, when the length of the substrate is 200 mm, the distance L is L ≦ 200 / so that the lower roller can hold it.
It must be 2 and is set to 60 mm here. Further, it is sufficient that at least one of the upper rollers holds the substrate, and it is set to less than 200 mm. Therefore, the lower roller always keeps the substrate horizontal and the upper roller
The vertical movement of the bag is prevented. 3 and 4 show
FIG. 3 is a diagram showing a specific example, in which the distance between the upper roller and the lower roller is different, and FIG. 4 is the same.
In addition, at least one of the rollers may be forcibly driven and rotated, and when only one is driven, the other is idle.

However, as shown in FIG. 2, if the rollers are made of hard material and the upper and lower rollers are set at substantially the same intervals as the substrate (42), the substrate (42) can be held, The substrate (43) does not fall down, but it shifts in the direction perpendicular to the paper surface. However, by adopting the roller which is a feature of the present invention, this movement can be completely prevented. That is, the rollers (40) and / or (41) are made of a soft material (in FIG. 1, only the upper roller (40) is made soft). Here, ethylene propylene rubber is used as a sample, and the porous material is used. I have to. Also, the distance between the rollers (40) and (42) is such that the thinner substrate (43)
When the two substrates are sandwiched by both rollers, they are set so as to bite into the upper roller (40). That is, the contact surfaces (45) and (46) of the roller (40) are more
Made inside the roller. If the rollers are thick enough, both rollers may be in contact with each other without sandwiching the substrate at all. Further, one of the rollers may be a conventional hard roller and the other may be the soft roller of the present invention.

On the other hand, although not described in the conventional example, the material of the roller is ethylene propylene, which is the same as that of the present invention, and is not porous, so that the substrate is not soft enough to bite. However, by making this material porous, that is, so-called sponge, flexibility is generated. Although the material is not particularly limited as long as it is soft, propylene is preferable in view of chemical resistance. Specifically, EP
T, EPDM, EPM, etc. are desirable.

Next, a second embodiment will be briefly described. As described above, the upper and lower sides need not be rollers, and for example, the driving means that comes into contact with the back surface of the substrate may be a chain or a belt. This chain or belt has a certain width so that the substrate can be stably transported, and is inflexible. Therefore, the roller on the side that comes into contact with the substrate surface is the roller having the structure described above. Therefore, even if substrates having different thicknesses are transferred and an external force such as a shower is applied from above, these substrates can be transferred without being displaced.

Further, it goes without saying that even one sheet can be conveyed without shifting as in the conventional case.

[0017]

As is apparent from the above description, in the transportation of the substrate, the upper and lower rollers are used, and an external force for lifting the upper part by a shower or the like acts from the bottom, and a vertical or horizontal external force acts from the upper part or the like. Even if the roller is added, since at least one of the upper and lower sides of the roller is made of a soft material, the substrate bites into the roller, so that the displacement of the substrate can be prevented.

Further, a conveyer such as a belt or a chain is used on the lower surface of the substrate, and even if a shower or the like is ejected from above, the substrate bites into the roller, so that the displacement of the substrate can be prevented. Moreover, depending on the material, the sponge-like porous shape makes the roller even softer,
The substrate can be bited, and at the same time, the substrate surface can be prevented from being scratched.

Further, by using the porous ethylene-propylene material, it is possible to prevent the roller from deteriorating even in the step of using a chemical or the like, and it is possible to improve the reliability of the apparatus.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a state of a roller used in a substrate transfer device of the present invention.

FIG. 2 is a diagram illustrating a state of a roller used in a conventional substrate transfer device.

FIG. 3 is a diagram illustrating substrate transfer.

FIG. 4 is a diagram illustrating substrate transfer.

FIG. 5 is a diagram illustrating an example of a substrate transfer device.

[Explanation of symbols]

40 First Roller 41 Second roller 42 first substrate 43 Second substrate 44 Non-contact surface 45,46 contact surface

─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Jun Sakano 2-5-5 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Inventor Sadamichi Takasagi 2-5 Keihan Hondori, Moriguchi City, Osaka Prefecture No. 5 within Sanyo Electric Co., Ltd. (56) Reference JP-A-4-280748 (JP, A) JP-A-5-331307 (JP, A) JP-A-63-18762 (JP, A) JP-A-1- 156250 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B65H 5/06 H01L 21/027 H01L 21/306 H01L 21/68

Claims (9)

(57) [Claims] 1. A first roller which is in contact with the back surface of the substrate and is provided at a certain interval from a carrying start point to a carrying end point, and a first roller which is brought into contact with the front surface of the substrate and is provided at a given interval from a carrying start point to a carrying end point. And a second roller that is
A substrate transfer device that transfers a substrate from a transfer start point to a transfer end point by rotating the second roller and / or the second roller, wherein liquid and / or gas is supplied to the substrate from a nozzle provided in the substrate transfer device. Is ejected from above and / or below and an external force is applied to the contact surface of the first roller and / or the second roller is made of a soft material such that the contact surface is recessed inward from the non-contact surface, and at least the thickness is different. A substrate transfer device, wherein two or more substrates are transferred by the first and second rollers. 2. The distance between the first roller and the second roller is equal to or thinner than the thinnest thickness of the at least two or more substrates. The substrate transfer device according to claim 1. 3. The substrate transfer apparatus according to claim 1, wherein the material of at least the second roller is porous. 4. The substrate transfer apparatus according to claim 3, wherein the material is ethylene propylene rubber. 5. A first supporting means of a belt or a chain that contacts the back surface of the substrate and supports the substrate from the transport start point to the transport end point, and contacts the front surface of the substrate, from the transport start point to the transport end point. Substrate transport for transporting a substrate from a transport start point to a transport end point by rotation of the first support means and / or the second support means. The apparatus is made of a soft material such that a liquid and / or a gas is ejected from the nozzle provided in the substrate transfer device onto the substrate, and the contact surface of the second supporting means is recessed inward from the non-contact surface. A substrate transfer device, wherein at least two substrates having different thicknesses are transferred by the first and second supporting means. 6. The substrate transfer apparatus according to claim 5, wherein the material is porous. 7. The substrate transfer apparatus according to claim 6, wherein the material is ethylene propylene rubber. 8. A conductive foil adhered to at least one main surface
A step of preparing two or more substrates having different thicknesses and patterning the conductive foil into a desired shape, a first roller contacting the back surface of the substrate, and a second roller contacting the front surface of the substrate. And at least one of the first and second rollers is a soft and porous substrate , and the substrate is transported by a substrate transporting device, and a liquid and / or gas shower ring is delivered to the substrate. And a step of electrically connecting the pattern of the substrate and a semiconductor element, the method for manufacturing a hybrid integrated circuit device. 9. A nickel plating film is formed on the pattern, and a resist is applied on the nickel plating film to pattern the pattern and the nickel plating film into a desired shape. 9. The method for manufacturing a hybrid integrated circuit device according to claim 8, wherein the hybrid integrated circuit device is installed and transported.