JPS6118490U - frost sensor - Google Patents
frost sensorInfo
- Publication number
- JPS6118490U JPS6118490U JP10257484U JP10257484U JPS6118490U JP S6118490 U JPS6118490 U JP S6118490U JP 10257484 U JP10257484 U JP 10257484U JP 10257484 U JP10257484 U JP 10257484U JP S6118490 U JPS6118490 U JP S6118490U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frost sensor
- light emitting
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Defrosting Systems (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の霜センサの分解斜視図、第２図は本考案
の霜センサの一実施例を示す分解斜視図、第３図は同霜
センサのブリン１・基板の平面図、第４図は同霜センサ
の第２図Ａ面断面に相当する断面図である。
１・・・・・・発光素子、２・・・・・・受光素子、３
・・・・・・プリント基板、４・・・・・・ケース、４
ａ・・・・・・空間、５・・・・・・リード線、６・・
・・・・銅箔部、７・・・・・・切り欠き、８・・・・
・・突起部、９・・・・・・シール用樹脂。FIG. 1 is an exploded perspective view of a conventional frost sensor, FIG. 2 is an exploded perspective view showing an embodiment of the frost sensor of the present invention, FIG. The figure is a cross-sectional view corresponding to the cross-section of plane A in FIG. 2 of the same frost sensor. 1... Light emitting element, 2... Light receiving element, 3
...Printed circuit board, 4...Case, 4
a... Space, 5... Lead wire, 6...
...Copper foil part, 7...Notch, 8...
...Protrusion, 9...Resin for sealing.
Claims (2)
素子と受光素子を相対向させて接続し、このプリント基
板に、リード線の径より小さい径の円弧の切り欠きある
いは孔を形成し、前記発光素子と受光素子が収納される
空間を有するケースに前記プリント基板をほぼ水平状態
に挿入して前記空間を封じ、前記リード線を前記発光素
子および受光素子の側より前記切り欠きあるいは孔を通
してその反対側に導出し、この導出側において、前記プ
リント基板とケースの間にシール用樹脂を充填した霜セ
ンサ。(1) A lead wire is connected on a printed circuit board, and a light emitting element and a light receiving element are connected facing each other, and an arc notch or hole having a diameter smaller than the diameter of the lead wire is formed on this printed circuit board, and The printed circuit board is inserted almost horizontally into a case having a space in which a light emitting element and a light receiving element are housed, the space is sealed, and the lead wire is passed through the notch or hole from the side of the light emitting element and the light receiving element. A frost sensor is led out to the opposite side, and a sealing resin is filled between the printed circuit board and the case on this lead-out side.
突起を設けた実用新案登録請求の範囲第１項記載の霜セ
ンサ。(2) The frost sensor according to claim 1, which is a utility model, and is provided with a protrusion for horizontally positioning the case and the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10257484U JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10257484U JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6118490U true JPS6118490U (en) | 1986-02-03 |
| JPH0124552Y2 JPH0124552Y2 (en) | 1989-07-25 |
Family
ID=30661969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10257484U Granted JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6118490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020180388A (en) * | 2019-04-24 | 2020-11-05 | 株式会社豊田自動織機 | Weft detecting device for loom |
-
1984
- 1984-07-06 JP JP10257484U patent/JPS6118490U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020180388A (en) * | 2019-04-24 | 2020-11-05 | 株式会社豊田自動織機 | Weft detecting device for loom |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0124552Y2 (en) | 1989-07-25 |
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