JPH0124552Y2 - - Google Patents
Info
- Publication number
- JPH0124552Y2 JPH0124552Y2 JP10257484U JP10257484U JPH0124552Y2 JP H0124552 Y2 JPH0124552 Y2 JP H0124552Y2 JP 10257484 U JP10257484 U JP 10257484U JP 10257484 U JP10257484 U JP 10257484U JP H0124552 Y2 JPH0124552 Y2 JP H0124552Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead wire
- case
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、電気冷蔵庫の蒸発器のような冷却装
置に霜が着いたことを感知する霜センサに関する
ものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a frost sensor that detects the formation of frost on a cooling device such as an evaporator of an electric refrigerator.
従来例の構成とその問題点
従来この種の霜センサにおいてはそのリード線
の接続は第１図に示すようにプリント基板３に発
光素子１と受光素子２を対向させて接続し、これ
らをケース４に収納するものであるが、リード線
５はプリント基板３にリード線５の取り出し方向
と同方向に半田付けされ、取り付けられていた。
このためプリント基板３とその面上の銅箔部６の
接着力でリード線５の引張り強度がささえられて
おり、接着力より強い力でリード線５を引張れ
ば、リード線５はその半田付け部にて銅箔部６が
剥離してしまうという欠点を有していた。Conventional Structure and Problems Conventionally, in this type of frost sensor, the lead wires are connected to the printed circuit board 3 with the light emitting element 1 and the light receiving element 2 facing each other, as shown in Fig. 1, and these are connected to the case. 4, the lead wires 5 were soldered and attached to the printed circuit board 3 in the same direction as the direction in which the lead wires 5 were taken out.
Therefore, the tensile strength of the lead wire 5 is supported by the adhesive force between the printed circuit board 3 and the copper foil portion 6 on its surface, and if the lead wire 5 is pulled with a force stronger than the adhesive force, the lead wire 5 will be It had a drawback that the copper foil part 6 peeled off at the attachment part.
また、防水のためケース４内にシール用樹脂
（図示せず）を充填するがこの際ケース４とプリ
ント基板３の隙間から赤外線発光素子１や受光素
子２を納めた空間４ａへシール用樹脂が流れ込
み、誤動作（発光素子１と受光素子２の間に霜に
相当するシール用樹脂が介在することになるので
誤動作する）を起こしたり、信頼性が落ちるとい
う欠点を有していた。 In addition, sealing resin (not shown) is filled in the case 4 for waterproofing, but at this time, the sealing resin leaks from the gap between the case 4 and the printed circuit board 3 into the space 4a where the infrared light emitting element 1 and the light receiving element 2 are housed. This has disadvantages in that it may flow in, cause malfunction (malfunction occurs because the sealing resin corresponding to frost is present between the light emitting element 1 and the light receiving element 2), and reduce reliability.
考案の目的
本考案はリード線が引張られても容易に半田付
け部の銅箔が剥離することがないようにすると共
に、またシール用樹脂が赤外線の発光素子、受光
素子を納めた空間に流れ込むことを防ぎ、誤動作
等が生じることを防止することを目的とする。Purpose of the invention This invention prevents the copper foil on the soldered part from peeling off easily even when the lead wire is pulled, and also prevents the sealing resin from flowing into the space containing the infrared light emitting element and light receiving element. The purpose is to prevent the occurrence of malfunctions, etc.
考案の構成
この目的を達するため、本考案はリード線をプ
リント基板の銅箔の接着力のみで引張り強度を持
たせずに、リード線をケースとプリント基板とで
はさみ込み、そのはさみ力による固定力も加える
ことにより、リード線の引張り強度を増すもので
ある。また、少なくともリード線の線径以上の高
さの突起をケースに設けることにより、シール用
樹脂が赤外線発光素子、受光素子を収めた空間へ
流れ込むことをなくし、かつプリント基板をケー
ス内で水平に保持することを実現するものであ
る。Structure of the invention In order to achieve this purpose, the present invention uses only the adhesive force of the copper foil of the printed circuit board to provide the lead wire with no tensile strength, and instead sandwiches the lead wire between the case and the printed circuit board, and fixes it by the sandwiching force. By also applying force, the tensile strength of the lead wire is increased. In addition, by providing the case with a protrusion that is at least as tall as the wire diameter of the lead wire, it is possible to prevent the sealing resin from flowing into the space containing the infrared light emitting element and the light receiving element, and to keep the printed circuit board horizontal within the case. This is what makes it possible to maintain.
実施例の説明
以下本考案の一実施例を添付図面の第２図ない
し第４図に従い説明する。第２図〜第４図におい
て、１は赤外線を発する発光素子、２は赤外線を
受光して作動する受光素子、３はプリント基板、
４はケース、５はリード線、６はプリント基板３
上の銅箔部、７はプリント基板３の一端部に設け
た切り欠き、８はケース４内に形成した突起部、
９はシール用樹脂である。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 of the accompanying drawings. In FIGS. 2 to 4, 1 is a light emitting element that emits infrared rays, 2 is a light receiving element that operates by receiving infrared rays, 3 is a printed circuit board,
4 is the case, 5 is the lead wire, 6 is the printed circuit board 3
The upper copper foil part, 7 is a notch provided at one end of the printed circuit board 3, 8 is a protrusion formed inside the case 4,
9 is a sealing resin.
ここで、発光素子１と受光素子２、リード線５
は、プリント基板３に半田付けされ、プリント基
板３共々ケース４に組み込まれシール用樹脂９に
てシールされる。 Here, a light emitting element 1, a light receiving element 2, a lead wire 5
is soldered to the printed circuit board 3, and the printed circuit board 3 is incorporated into the case 4 and sealed with a sealing resin 9.
第３図は本考案の主要部であるプリント基板３
の平面図であり、長手方向（矢印ｌ方向）にリー
ド線５の径より小さな深さ寸法ｄで幅寸法ｗはリ
ード線５の径より大きな切り欠き７を設けたもの
である。 Figure 3 shows the printed circuit board 3 which is the main part of this invention.
, in which a notch 7 is provided in the longitudinal direction (direction of arrow l) with a depth dimension d smaller than the diameter of the lead wire 5 and a width dimension w larger than the diameter of the lead wire 5.
リード線５はプリント基板３の銅箔部６で半田
付けされ、リード線５は矢印Ｆ方向に向けて出さ
れ、プリント基板３の切り欠き７を通つて再び上
に引き出される。 The lead wire 5 is soldered to the copper foil portion 6 of the printed circuit board 3, and the lead wire 5 is brought out in the direction of the arrow F, passed through the notch 7 of the printed circuit board 3, and pulled out upward again.
上記構成においてプリント基板３をケース４に
組み込んだ際、リード線５はプリント基板３とケ
ース４の間にはさまれ、リード線５に無理な力が
加わることなく圧縮されて固定される。 When the printed circuit board 3 is assembled into the case 4 in the above configuration, the lead wires 5 are sandwiched between the printed circuit board 3 and the case 4, and are compressed and fixed without applying excessive force to the lead wires 5.
従つて、従来リード線５は銅箔部６とプリント
基板３の接着力のみで固定されていたのが、プリ
ント基板３とケース４とでリード線５を固定する
力も加わつて、より強く固定され、リード線５を
引張ることによるリード線５とプリント基板３の
銅箔半田付け部の断線をなくすことができる。ま
た、プリント基板３の下方とケース４との間にケ
ース側より、少なくともリード線５の径より高い
突起８を発光素子１ならびに受光素子２を納める
空間４ａのつけ根の全周に設けることにより、プ
リント基板５を水平に保持することができる。ま
た、シール用樹脂９を流し込んだ時、発光素子１
および発光素子２の納まる空間４ａまでシール用
樹脂９が流れ込まないため、センサとしての検知
能力を低下させないという効果も得られる。 Therefore, conventionally, the lead wire 5 was fixed only by the adhesive force between the copper foil part 6 and the printed circuit board 3, but now the force for fixing the lead wire 5 between the printed circuit board 3 and the case 4 is added, and the lead wire 5 is fixed more strongly. , disconnection of the copper foil soldered portion between the lead wire 5 and the printed circuit board 3 due to pulling the lead wire 5 can be eliminated. Further, by providing a protrusion 8 which is higher than the diameter of the lead wire 5 at least from the case side between the lower part of the printed circuit board 3 and the case 4, around the entire circumference of the base of the space 4a in which the light emitting element 1 and the light receiving element 2 are housed. The printed circuit board 5 can be held horizontally. Also, when the sealing resin 9 is poured, the light emitting element 1
Also, since the sealing resin 9 does not flow into the space 4a where the light emitting element 2 is accommodated, the effect of not reducing the detection ability of the sensor is also obtained.
考案の効果
上記実施例から明らかなように、本考案の霜セ
ンサは、プリント基板上にリード線を接続すると
共に発光素子と受光素子を相対向させて接続し、
このプリント基板の端部に深さ寸法がリード線の
径より小さく幅寸法がリード線のより大きい円弧
の切り欠きを形成し、前記発光素子と受光素子が
収納される空間を有するケースに前記プリント基
板をほぼ水平状態に挿入して前記空間を封じ前記
リード線を前記発光素子および受光素子の側より
前記切り欠きを通してその反対側に導出すると共
に前記リード線を前記ケースと前記プリント基板
の端部とで挟持し、前記リード線の導体側におい
て前記プリント基板とケースの間にシール用樹脂
を充填したもので、プリント基板の銅箔部半田付
面とリード線との剥離がなくなり、リード線のよ
り強い引張り強度を実現できる。さらに霜センサ
として、誤動作を防止し、高い検知能力を維持
し、高い信頼性を得ることができる。Effects of the Invention As is clear from the above embodiments, the frost sensor of the present invention connects a lead wire onto a printed circuit board, and also connects a light emitting element and a light receiving element so as to face each other.
An arcuate cutout is formed at the end of the printed circuit board, and the depth is smaller than the diameter of the lead wire, and the width is larger than the lead wire. The board is inserted in a substantially horizontal state to seal the space, and the lead wires are guided from the light emitting element and light receiving element side through the notches to the opposite side, and the lead wires are connected to the ends of the case and the printed circuit board. A sealing resin is filled between the printed circuit board and the case on the conductor side of the lead wire, which eliminates separation between the soldered surface of the copper foil part of the printed circuit board and the lead wire, and prevents the lead wire from peeling off. Stronger tensile strength can be achieved. Furthermore, as a frost sensor, it can prevent malfunctions, maintain high detection ability, and achieve high reliability.
第１図は従来の霜センサの分解斜視図、第２図
は本考案の霜センサの一実施例を示す分解斜視
図、第３図は同霜センサのプリント基板の平面
図、第４図は同霜センサの第２図Ａ面断面に相当
する断面図である。
１……発光素子、２……受光素子、３……プリ
ント基板、４……ケース、４ａ……空間、５……
リード線、６……銅箔部、７……切り欠き、８…
…突起部、９……シール用樹脂。
Fig. 1 is an exploded perspective view of a conventional frost sensor, Fig. 2 is an exploded perspective view showing an embodiment of the frost sensor of the present invention, Fig. 3 is a plan view of the printed circuit board of the frost sensor, and Fig. 4 is an exploded perspective view of a conventional frost sensor. FIG. 2 is a cross-sectional view corresponding to the cross section of plane A in FIG. 2 of the same frost sensor. 1... Light emitting element, 2... Light receiving element, 3... Printed circuit board, 4... Case, 4a... Space, 5...
Lead wire, 6...Copper foil part, 7...Notch, 8...
...Protrusion, 9...Sealing resin.
Claims (1)
発光素子と受光素子を相対向させて接続し、こ
のプリント基板の端部に、深さ寸法がリード線
の径より小さく幅寸法がリード線の径より大き
い円弧の切り欠きを形成し、前記発光素子と受
光素子が収納される空間を有するケースに前記
プリント基板をほぼ水平状態に挿入して前記空
間を封じ、前記リード線を前記発光素子および
受光素子の側より前記切り欠きを通してその反
対側に導出すると共に前記リード線を前記ケー
スと前記プリント基板の端部とで挟持し、前記
リード線の導出側において、前記プリント基板
とケースの間にシール用樹脂を充填した霜セン
サ。 (2) ケースに、プリント基板を水平状態に位置ぎ
めする突起を設けた実用新案登録請求の範囲第
１項記載の霜センサ。[Claims for Utility Model Registration] (1) A lead wire is connected to a printed circuit board, and a light emitting element and a light receiving element are connected facing each other. forming a smaller circular arc notch with a width dimension larger than the diameter of the lead wire, and inserting the printed circuit board in a substantially horizontal state into a case having a space in which the light emitting element and the light receiving element are housed, and sealing the space; Leading out the lead wire from the side of the light emitting element and the light receiving element through the notch to the opposite side thereof, and sandwiching the lead wire between the case and the end of the printed circuit board, and on the leading out side of the lead wire, A frost sensor in which a sealing resin is filled between the printed circuit board and the case. (2) The frost sensor according to claim 1 of the utility model registration claim, wherein the case is provided with a protrusion for horizontally positioning the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10257484U JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10257484U JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6118490U JPS6118490U (en) | 1986-02-03 |
| JPH0124552Y2 true JPH0124552Y2 (en) | 1989-07-25 |
Family
ID=30661969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10257484U Granted JPS6118490U (en) | 1984-07-06 | 1984-07-06 | frost sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6118490U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7183936B2 (en) * | 2019-04-24 | 2022-12-06 | 株式会社豊田自動織機 | Weft detection device for loom |
-
1984
- 1984-07-06 JP JP10257484U patent/JPS6118490U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6118490U (en) | 1986-02-03 |
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