JPS61173134U - - Google Patents
Info
- Publication number
- JPS61173134U JPS61173134U JP1985055512U JP5551285U JPS61173134U JP S61173134 U JPS61173134 U JP S61173134U JP 1985055512 U JP1985055512 U JP 1985055512U JP 5551285 U JP5551285 U JP 5551285U JP S61173134 U JPS61173134 U JP S61173134U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- bonding
- wire bonding
- tip
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図ないし第３図はこの考案の一実施例にか
かり、第１図はキヤピラリ先端部の断面図、第２
図ａはリード部へのボンデイングを説明する一部
の断面図、同図ｂはボンデイング部の上面図、第
３図ａはリード部へのボンデイングを説明するた
めのキヤピラリの断面図、同図ｂは圧着域を示す
上面図、第４図はワイヤボンデイング工程を説明
するためのボンデイング部の断面図、第５図以降
は従来例を示し、第５図ａは先端が平坦面である
キヤピラリの断面図、同図ｂはボンデイング部の
上面図、第６図ａ〜ｄはワイヤボンデイング工程
を示すいずれも断面図、第７図は従来例の問題点
を示す断面図、第８図ａは先端が円錐面であるキ
ヤピラリの断面図、同図ｂはボンデイング形状を
示す上面図、第９図ａは先端が平坦面であるキヤ
ピラリによる傾斜したリード部へのボンデイング
を説明するための断面図、同図ｂは圧着域の形状
を示す上面図、第１０図ａは先端が円錐面である
キヤピラリによる傾斜したリード部へのボンデイ
ングを説明するための断面図、同図ｂは圧着域の
形状を示す上面図である。
１……キヤピラリ、１ｂ……キヤピラリ先端の
円錐面、２……リード部上面への圧着域、１０１
ｂ……リードフレーム部、１０３……ボンデイン
グワイヤ、Ｈ……水平面、Ｌ……リード部上面、
θ……キヤピラリ先端のテーパ、α……リード部
上面の水平面に対する傾斜。
Figures 1 to 3 show one embodiment of this invention; Figure 1 is a sectional view of the tip of the capillary;
Figure 3a is a cross-sectional view of a part to explain bonding to the lead part, figure b is a top view of the bonding part, figure 3a is a cross-sectional view of the capillary to explain bonding to the lead part, figure b is a top view showing the crimping area, FIG. 4 is a cross-sectional view of the bonding part to explain the wire bonding process, FIGS. 5 and after show conventional examples, and FIG. Fig. 6b is a top view of the bonding part, Figs. 6a to d are sectional views showing the wire bonding process, Fig. 7 is a sectional view showing problems in the conventional example, and Fig. 8a is a top view of the bonding part. FIG. 9B is a top view showing the bonding shape; FIG. FIG. 10b is a top view showing the shape of the crimping area, FIG. It is a diagram. 1... Capillary, 1b... Conical surface at the tip of the capillary, 2... Crimp area to the upper surface of the lead part, 101
b...Lead frame part, 103...Bonding wire, H...Horizontal surface, L...Top surface of lead part,
θ...Taper of the capillary tip, α...Inclination of the top surface of the lead with respect to the horizontal plane.
Claims (1)
面に対し傾斜したリード部に対しボンデイングを
施すために、キヤピラリの先端が円錐形で１〜３
°のテーパに形成されていることを特徴とするワ
イヤボンデイングキヤピラリ。 In semiconductor wire bonding equipment, the tip of the capillary is conical in order to perform bonding on a lead part that is inclined with respect to the horizontal plane.
A wire bonding capillary characterized by being formed into a taper of °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055512U JPS61173134U (en) | 1985-04-16 | 1985-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055512U JPS61173134U (en) | 1985-04-16 | 1985-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173134U true JPS61173134U (en) | 1986-10-28 |
Family
ID=30578255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985055512U Pending JPS61173134U (en) | 1985-04-16 | 1985-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173134U (en) |
-
1985
- 1985-04-16 JP JP1985055512U patent/JPS61173134U/ja active Pending