JPS61172337A - Removing process of foreign matters - Google Patents

Removing process of foreign matters

Info

Publication number
JPS61172337A
JPS61172337A JP1315285A JP1315285A JPS61172337A JP S61172337 A JPS61172337 A JP S61172337A JP 1315285 A JP1315285 A JP 1315285A JP 1315285 A JP1315285 A JP 1315285A JP S61172337 A JPS61172337 A JP S61172337A
Authority
JP
Japan
Prior art keywords
foreign matters
pellets
recessions
semiconductor
semiconductor pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1315285A
Other languages
Japanese (ja)
Inventor
Toshio Yamamoto
Original Assignee
Nec Kansai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Kansai Ltd filed Critical Nec Kansai Ltd
Priority to JP1315285A priority Critical patent/JPS61172337A/en
Publication of JPS61172337A publication Critical patent/JPS61172337A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Abstract

PURPOSE:To remove any foreign matters effectively, by a method wherein, when any foreign matters adhering to semiconductor pellets are removed from alignment jigs of semiconductor pellets, the air between the jigs is vacuum- attracted to vibrate the semiconductor pellets. CONSTITUTION:The first jig 4 with recessions 6 containing individual semiconductor pellets 1 and the second jig with vacuum attracting holes 12 opened on the positions opposing to the plane formed into the recessions of the first jig 4 are opposed to each other not to disconnect the semiconductor pellets 1 from said recessions 6. Next the air between the jigs 4, 10 is attracted by the vacuum attracting holes 12 to vibrate the semiconductor pelletds 1 for removing any foreign matters from the semiconductor pellets 1 and the inner walls of recessions 6. Through these procedures, any foreign matters due to cracking and breaking off of pellets 1 adhering to the pellets 1 may be removed effectively.
JP1315285A 1985-01-26 1985-01-26 Removing process of foreign matters Pending JPS61172337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1315285A JPS61172337A (en) 1985-01-26 1985-01-26 Removing process of foreign matters

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1315285A JPS61172337A (en) 1985-01-26 1985-01-26 Removing process of foreign matters

Publications (1)

Publication Number Publication Date
JPS61172337A true JPS61172337A (en) 1986-08-04

Family

ID=11825190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1315285A Pending JPS61172337A (en) 1985-01-26 1985-01-26 Removing process of foreign matters

Country Status (1)

Country Link
JP (1) JPS61172337A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7571538B2 (en) * 2001-10-19 2009-08-11 Fujitsu Microelectronics Limited Vacuum fixing jig for semiconductor device
US8141570B2 (en) 2006-02-27 2012-03-27 Denso Corporation System and method for removing foreign particles from semiconductor device
JP2013169474A (en) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp Method and apparatus for removing foreign matter
JP2015034731A (en) * 2013-08-08 2015-02-19 三菱電機株式会社 Testing apparatus and testing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7571538B2 (en) * 2001-10-19 2009-08-11 Fujitsu Microelectronics Limited Vacuum fixing jig for semiconductor device
US8141570B2 (en) 2006-02-27 2012-03-27 Denso Corporation System and method for removing foreign particles from semiconductor device
JP2013169474A (en) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp Method and apparatus for removing foreign matter
JP2015034731A (en) * 2013-08-08 2015-02-19 三菱電機株式会社 Testing apparatus and testing method

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