JP2013169474A - Method and apparatus for removing foreign matter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing foreign matter that can efficiently remove foreign matter on the front face, rear face and side faces of a chip.SOLUTION: A method for removing foreign matter includes a process for placing chips on the surface of a pedestal having a plurality of through holes penetrating from a front face to a rear face, and bringing the rear faces of the chips into contact with the pedestal; and a foreign matter removing process for sucking air in the plurality of through holes from the rear face side of the pedestal while blowing air to the chips from the front face side of the chips.

Description

  The present invention relates to a foreign matter removing method and a foreign matter removing device for removing foreign matter attached to a component such as a chip.

  Patent Document 1 discloses a technique for drying a chip by blowing air to the front and back surfaces of the chip after being cleaned with pure water. In this technique, the front and back surfaces of the chip are simultaneously dried by simultaneously blowing air to the front and back surfaces of the chip.

Japanese Unexamined Patent Publication No. 7-176511

  If air is simultaneously blown to the front surface and the back surface of the chip as disclosed in Patent Document 1, there is a certain effect in removing foreign substances on the front surface and the back surface of the chip. However, foreign substances may adhere not only to the front and back surfaces of the chip but also to the side surfaces of the chip. When air is blown simultaneously on the front surface and back surface of the chip to remove the foreign matter, the air on the chip surface and the air on the back surface of the chip cancel each other, and it is difficult to remove the foreign matter on the side surface of the chip. For this reason, the method disclosed in Patent Document 1 may not sufficiently remove the foreign matter on the chip.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a foreign matter removing method and a foreign matter removing device that can efficiently remove foreign matters on the front surface, back surface, and side surfaces of a chip. .

  The foreign matter removing method according to the present invention includes a step of placing a chip on the surface of a pedestal having a plurality of through holes penetrating from the front surface to the back surface, contacting the back surface of the chip with the pedestal, and from the front surface side of the chip A foreign matter removing step of sucking air from the plurality of through holes from the back side of the pedestal while blowing air to the chip.

  The foreign matter removing apparatus according to the present invention includes a pedestal having a plurality of through holes penetrating from the front surface to the back surface, an air blowing portion for blowing air to the front surface, and attached to the back surface. And a suction part for sucking air.

  According to the present invention, since air flows along the outer periphery of the chip, foreign substances on the front surface, back surface, and side surfaces of the chip can be efficiently removed.

It is a perspective view of the base which is components of the foreign material removal apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the foreign material removal apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows having put the chip | tip on the base. It is sectional drawing which shows removing the foreign material adhering to a chip | tip. It is a perspective view which shows the base of the foreign material removal apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the foreign material removal apparatus which concerns on Embodiment 3 of this invention. It is sectional drawing which shows having closed the 1st through-hole with the filter in the foreign material removal process. It is sectional drawing which shows having closed the 2nd through-hole with the filter in the foreign material removal process.

Embodiment 1 FIG.
FIG. 1 is a perspective view of a pedestal that is a part of a foreign matter removing apparatus according to Embodiment 1 of the present invention. The pedestal 10 has a front surface 12 and a back surface 14. A plurality of through holes 16 penetrating from the front surface 12 to the back surface 14 are formed in the base 10. The pedestal 10 is made of a rubber material.

  FIG. 2 is a cross-sectional view showing the foreign matter removing apparatus according to Embodiment 1 of the present invention. On the surface 12 side of the pedestal 10, an air blowing portion 50 that blows air onto the surface 12 is formed. The air blowing portion 50 is disposed so as to blow air obliquely with respect to the surface 12 of the base 10.

  A suction part 52 is attached to the back surface 14 of the base 10. The suction part 52 sucks air from the plurality of through holes 16 while supporting the base 10. The suction part 52 sucks the air in the through hole 16 by the vacuum pump 52a.

  Subsequently, a foreign matter removing method using the foreign matter removing apparatus according to Embodiment 1 of the present invention will be described. First, the chip is placed on the base 10. FIG. 3 is a cross-sectional view showing that the chip is placed on the pedestal. The chip 60 is placed on the surface 12 of the base 10. Thereby, the back surface of the chip 60 and the base 10 come into contact. Foreign matter 62 adheres to the front surface, back surface, and side surface of the chip 60.

  Next, the process proceeds to a foreign matter removing process for removing the foreign matter 62 attached to the chip 60. FIG. 4 is a cross-sectional view showing the removal of foreign matter adhering to the chip. In the foreign matter removing step, air is blown from the front surface side of the chip 60 to the chip 60 by the air blowing portion 50, and air in the plurality of through holes 16 is sucked from the back surface 14 side of the base 10 by the suction portion 52. At this time, the chip 60 is vacuum-adsorbed to the base 10 by the suction pressure exerted on the through-hole 16 by the suction part 52.

  In the foreign matter removing step, the air blowing part 50 and the suction part 52 generate an air flow in the direction indicated by the arrow in FIG. That is, the air discharged from the air blowing part 50 flows to the through hole 16 via the surface and side surfaces of the chip 60. Foreign matter on the surface and side surfaces of the chip 60 can be removed by this air flow. Further, foreign matters on the back surface of the chip 60 can be removed through the through holes 16. Therefore, according to the foreign matter removing method according to the first embodiment of the present invention, foreign matters on the front surface, the back surface, and the side surface of the chip can be efficiently removed collectively.

  Further, the air blowing portion 50 blows air obliquely with respect to the surface 12 of the pedestal 10, whereby foreign matters on the side surfaces of the chip 60 can be efficiently removed. Further, since the rubber material is used for the base 10, the chip 60 can be prevented from falling off.

  By the way, the foreign material removing apparatus according to Embodiment 1 of the present invention can be variously modified. For example, the pedestal 10 may be formed of a material other than a rubber-based material. Further, the pedestal 10 may have a shape different from the pedestal of FIG. 1 as long as it has air permeability in the direction from the front surface to the back surface.

Embodiment 2. FIG.
The foreign matter removing apparatus and the foreign matter removing method according to the second embodiment of the present invention will be described with a focus on differences from the first embodiment. FIG. 5 is a perspective view showing a base of the foreign matter removing apparatus according to Embodiment 2 of the present invention. A plurality of through holes 76 penetrating from the front surface 72 to the back surface 74 are formed in the base 70. The pedestal 70 is formed to have a honeycomb structure in plan view.

  By making the base 70 have a honeycomb structure, the partition wall of the base 70 can be made thin while maintaining the strength of the base 70. When the partition wall of the pedestal 70 is thinned, the contact area between the chip and the pedestal 70 is reduced, and most of the back surface of the chip can be exposed to the through hole 76. Therefore, the foreign matter removal efficiency can be increased. Further, by reducing the contact area between the chip and the pedestal 70, the chip can be prevented from being damaged.

Embodiment 3 FIG.
The foreign matter removing apparatus and the foreign matter removing method according to the third embodiment of the present invention will be described focusing on differences from the first embodiment. FIG. 6 is a cross-sectional view showing a foreign matter removing apparatus according to Embodiment 3 of the present invention. The foreign matter removing apparatus 100 is for continuously changing the magnitude relationship between the suction pressure in the first through hole 16a of the plurality of through holes 16 and the suction pressure in the second through hole 16b adjacent to the first through hole 16a. A suction pressure adjusting unit 102 is provided. The suction pressure adjusting unit 102 includes a filter 102a and a filter moving unit 102b.

  The filter 102a is formed so as to block every other through hole of the plurality of through holes 16. The filter 102a reduces the suction pressure of air by the suction part 52. Therefore, the suction pressure in the through hole blocked by the filter 102a is smaller than the suction pressure in the through hole not blocked by the filter 102a.

  The filter moving part 102b slides the filter 102a with respect to the base 10. The filter moving part 102b moves the filter 102a so as to alternately block the intake path of the first through hole 16a and the intake path of the second through hole 16b. That is, the filter moving unit 102b is configured to be movable in the left-right direction in FIG. 6 at a predetermined cycle.

  Subsequently, a foreign matter removing method using the foreign matter removing apparatus 100 will be described. FIG. 7 is a cross-sectional view showing that the first through hole is blocked with a filter in the foreign matter removing step. When the first through hole 16a is closed with the filter 102a, the suction pressure in the first through hole 16a is smaller than the suction pressure in the second through hole 16b. This state is referred to as a first state.

  Next, the filter 102a is moved by the filter moving part 102b, and the second through hole 16b is closed by the filter 102a. FIG. 8 is a cross-sectional view showing that the second through hole is blocked with a filter in the foreign matter removing step. When the second through hole 16b is closed with the filter 102a, the suction pressure in the second through hole 16b is smaller than the suction pressure in the first through hole 16a. This state is referred to as a second state.

  In the foreign substance removal step according to Embodiment 3 of the present invention, the first state and the second state are alternately repeated. Then, the magnitude relationship between the suction pressure in the first through hole 16a and the suction pressure in the second through hole 16b continues to change, and the chip 60 vibrates. This vibration can increase the foreign matter removal efficiency of the chip 60. By vibrating the chip 60, it is possible to promote the removal of foreign matters adhering particularly to the back surface of the chip 60. And the vibration of the chip | tip 60 can be changed arbitrarily by controlling the motion of the filter moving part 102b.

  As described above, in the foreign matter removing process according to the third embodiment of the present invention, as shown in the first embodiment, the air flow is generated around the chip 60 and attached to the chip 60 to give vibration to the chip 60. Foreign matter can be removed efficiently. The foreign matter removing method according to Embodiment 3 of the present invention can be variously modified as long as this feature is not lost. For example, the suction pressure adjusting unit 102 only needs to change the suction pressure in the through hole with time, and is not limited to the above-described configuration. Further, the foreign substance removal method and the foreign substance removal apparatus according to the second and third embodiments can be modified at least as much as the first embodiment. In addition, you may combine suitably the characteristic of the foreign material removal method and foreign material removal apparatus which concern on each embodiment.

  10 pedestal, 12 surface, 14 back surface, 16 through hole, 16a first through hole, 16b second through hole, 50 air blowing part, 52 suction part, 52a vacuum pump, 60 chip, 62 foreign material, 70 pedestal, 72 surface, 74 back surface, 76 through-hole, 100 foreign matter removing device, 102 suction pressure adjusting unit, 102a filter, 102b filter moving unit

Claims (8)

Placing the chip on the surface of the pedestal having a plurality of through holes penetrating from the front surface to the back surface, and contacting the back surface of the chip and the pedestal;
A foreign matter removing method comprising: a foreign matter removing step of sucking air from the plurality of through holes from the back side of the pedestal while blowing air from the front side of the tip to the tip. In the foreign matter removing step,
The chip is vibrated by continuously changing the magnitude relationship between the suction pressure in the first through hole of the plurality of through holes and the suction pressure in the second through hole adjacent to the first through hole. The foreign matter removing method according to claim 1. A pedestal having a plurality of through holes penetrating from the front surface to the back surface;
An air blowing section for blowing air onto the surface;
A foreign matter removing apparatus comprising: a suction portion attached to the back surface and sucking air from the plurality of through holes.   The foreign matter removing apparatus according to claim 3, wherein the pedestal is formed of a rubber-based material.   The foreign matter removing apparatus according to claim 3, wherein the air blowing unit blows air obliquely with respect to the surface of the pedestal.   6. The foreign matter removing apparatus according to claim 3, wherein the pedestal is formed to have a honeycomb structure in a plan view.   A suction pressure adjusting unit that continuously changes a magnitude relationship between a suction pressure in a first through hole of the plurality of through holes and a suction pressure in a second through hole adjacent to the first through hole is provided. The foreign matter removing apparatus according to any one of claims 3 to 6. The suction pressure adjusting unit is
A filter that closes the intake path of the first through hole or the second through hole and reduces the suction pressure;
The foreign matter removing apparatus according to claim 7, further comprising: a filter moving unit that moves the filter so as to alternately block the intake path of the first through hole and the intake path of the second through hole. .

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