JPS61168913A - Heat treating apparatus of wafer - Google Patents

Heat treating apparatus of wafer

Info

Publication number
JPS61168913A
JPS61168913A JP902185A JP902185A JPS61168913A JP S61168913 A JPS61168913 A JP S61168913A JP 902185 A JP902185 A JP 902185A JP 902185 A JP902185 A JP 902185A JP S61168913 A JPS61168913 A JP S61168913A
Authority
JP
Japan
Prior art keywords
transfer
jig
wafers
transfer device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP902185A
Other languages
Japanese (ja)
Inventor
Toshio Murayama
村山　利雄
Hiroshi Maejima
前島　央
Fumitoshi Wakiyama
脇山　史敏
Tetsuya Takagaki
哲也 高垣
Toshio Nonaka
野中　利夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP902185A priority Critical patent/JPS61168913A/en
Publication of JPS61168913A publication Critical patent/JPS61168913A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To obtain an integrated automatic wafer treating process having a high operating rate, by providing treating chambers in a plurality of stages, and providing a transfer device, by which jigs are transferred among a conveying device, stocker, and a loader. CONSTITUTION:When a cartridge 15 is put into a transfer part 4, a transfer device 14 transfer a wafer 1 to a jig 13 for heat treatment one by one. The jig 13 is conveyed to a conveying part 3 and mounted on a stocker 19 from a guide 17 by a mounting device 20. When treatment is finished in one of a diffusing furnace 5, the jig 13, which accommodates the treated wafer 1, is conveyed to the conveying part 3 from the diffusing furnace 5 by a loader 9 under the state the jig is held by a fork 12. The jig is transferred on the guide 17. Then, the mounting device 20 mounts the jig before treatment, which is stocked in the stocker 19, on the fork 12, which has finished the conveying work, immediately. Meanwhile, the treated jig 13, which is mounted on the guide 17, is conveyed to the transfer part 4. The wafer 1 is transferred to the vacant cartridge 15 one by one.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、ウェハ処理技術、特に、−貫自動化技術に関
し、例えば、拡散工程に利用して有効な技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to wafer processing technology, particularly to through-through automation technology, and relates to a technology that is effective for use in, for example, a diffusion process.

〔背景技術〕[Background technology]

従来、ウェハ処理の拡散工程を一貫自動化する提案が種
々なされているが、拡散炉、ローダ、ウェハのカートリ
ッジと治具との間の移し換えを行う移換装置、治具のロ
ーダへの移載を行う移載装置の稼働率が充分に確保され
ていないという問題点があることが、本発明者によって
明らかにされた。In the past, various proposals have been made to fully automate the diffusion process of wafer processing. The inventor of the present invention has revealed that there is a problem in that the operating rate of the transfer device that performs the transfer is not sufficiently secured.

なお、拡散工程を一貫自動化する技術を述べである例と
しては、例えば、特開昭５２−１３９３７８号、特開昭
５５−９９７３９号、特開昭５８−１３８０４６号公報
がある。Examples of techniques for automating the diffusion process throughout include, for example, Japanese Patent Laid-Open Nos. 139378-1982, 99739-1980, and 138046-1980.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、稼働率の高い−貫自動化ウエハ処理技
術を提供することにある。An object of the present invention is to provide an automated wafer processing technique with high availability.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

〔発明の概要〕[Summary of the invention]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、処理室を複数段に併設するとともに、治具を
各段の処理室にローダにより出し入れするように構成し
、また、カートリッジに収容されているウェハを治具に
自動的に移し換える移換装置を設けるとともに、治具を
自動的に搬送する搬送装置を設け、さらに、治具を一時
的にストックするストッカを設けるとともに、搬送装置
、ストッカ、ローダ間で治具の移載を行う移載装置を設
けることにより、処理室の処理時間中に移載装置および
移換装置が待機期間を持つことなく稼働す（ようにして
、処理済み後のウェハの交換がローダにより処理室に待
ち時間無く直ちに実施され得るようにしたものである。In other words, processing chambers are arranged in multiple stages, jigs are moved in and out of each stage of processing chambers using a loader, and wafers housed in cartridges are automatically transferred to the jigs. In addition to providing a transfer device, a transfer device that automatically transfers the jigs is also provided, and a stocker is provided to temporarily stock the jigs, and the jigs are transferred between the transfer device, the stocker, and the loader. By installing this device, the transfer device and transfer device operate without waiting period during the processing time in the processing chamber (in this way, the exchange of wafers after processing can be done by the loader in the processing chamber without waiting time). It is designed to be implemented immediately.

第１図は本発明の一実施例であるウェハ熱処理装置を示
す平面図、第２図はその正面図、第３図はその側面断面
図、第４図はその斜視図である。FIG. 1 is a plan view showing a wafer heat treatment apparatus according to an embodiment of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a side sectional view thereof, and FIG. 4 is a perspective view thereof.

本実施例において、このウェハ熱処理装置はウェハ１に
拡散処理を施すものとして構成されており、処理部２、
移載部３および移換部４を備えている。処理部２には拡
散炉５が上下方向に４段、水平横向き（以下、左右方向
とする。）にそれぞれ設備されており、拡散炉５は右端
に炉口、左端に処理ガス導入口をそれぞれ開設されてい
るプロセスチューブ６と、プロセスチューブ６を包囲し
て内部を加熱するヒータ７とを備えている。In this embodiment, this wafer heat treatment apparatus is configured to perform a diffusion treatment on a wafer 1, and a treatment section 2,
It includes a transfer section 3 and a transfer section 4. In the processing section 2, diffusion furnaces 5 are installed in four stages vertically and horizontally (hereinafter referred to as horizontal direction), and the diffusion furnace 5 has a furnace opening at the right end and a processing gas inlet at the left end. It includes an open process tube 6 and a heater 7 that surrounds the process tube 6 and heats the inside.

移載部３および移換部４はクリーンルーム８の内部に設
備されており、移載部３にはソフトランディング型のロ
ーダ９が４基、各拡散炉５の延長線上にそれぞれ位置す
るように設備されている。The transfer section 3 and the transfer section 4 are installed inside the clean room 8, and the transfer section 3 has four soft landing type loaders 9, each of which is installed so as to be located on the extension line of each diffusion furnace 5. has been done.

ローダ９は各拡散炉５の延長線に平行にそれぞれ敷設さ
れているガイド１０と、適当な駆動装置（図示せず）に
よりガイドｌＯに沿って往復走行される移動台１１と、
移動台１１に右端部を支持されているフォーク１２とを
備えており、フォーク１２は石英ガラス等によって長い
略円筒形状に形成され、ウェハ１を収容した治具１３を
保持して拡散炉５に出し入れす°るようになっている。The loader 9 includes a guide 10 laid parallel to the extension line of each diffusion furnace 5, and a movable table 11 that is reciprocated along the guide IO by an appropriate drive device (not shown).
The moving table 11 includes a fork 12 whose right end is supported, and the fork 12 is formed of quartz glass or the like into a long, substantially cylindrical shape, and holds the jig 13 containing the wafer 1 and moves it into the diffusion furnace 5. It is designed to be put in and taken out.

移換部４には移換装置１４が配設されており、移換装置
１４は第４図に示されているようなパンタグラフ機構を
利用することにより、カートリッジ１５および治具１３
相互においてウェハ１の移し換えを行えるように構成さ
れている。A transfer device 14 is disposed in the transfer section 4, and the transfer device 14 transfers the cartridge 15 and the jig 13 by using a pantograph mechanism as shown in FIG.
They are configured so that wafers 1 can be transferred between them.

クリーンルーム８内には搬送装置１６が移載部３と移換
部４とを連絡するように設備されており、搬送装［１６
は、移載部３と移換部４との間に敷設されているガイド
１７と、ガイド１７上を適当な駆動装置（図示せず）に
よって往復走行される台車１８とを備えている。A transport device 16 is installed in the clean room 8 to connect the transfer section 3 and the transfer section 4, and the transport device [16
includes a guide 17 laid between the transfer section 3 and the transfer section 4, and a cart 18 that is reciprocated on the guide 17 by a suitable drive device (not shown).

移載部３にはスト７カ１９が搬送装置１６におけるガイ
ド１７の真上に位置するように設備されており、ストッ
カ１９はガイド１７の真上において治具１１をｉｍ＊平
に方措すみ上へｒ塔虐六力−アいる。The transfer unit 3 is equipped with a stocker 19 located directly above the guide 17 in the transfer device 16, and the stocker 19 is used to place the jig 11 in an im* flat manner directly above the guide 17. I'm going up to the top of the tower.

移載部３には移載装置２０が、搬送装置１６とスト７カ
１９との間、およびストッカ１９と各フォーク１２との
間の治具１３についての移載を行えるように設備されて
いる。すなわち、移載装置２０は上下方向に敷設されて
いるガイド２１と、適当な駆動装置（図示せず）により
ガイド２１に沿って往復昇降される昇降台２２と、昇降
台２２にフォーク１２と平行に敷設されている左右方向
ガイド２３と、適当な駆動装置（図示せず）によりこの
ガイド２３に沿って往復移動される移動台２４と、この
移動台２４にフォーク１２と直角に敷設されている前後
方向ガイド２５と、適当な駆動装置（図示せず）により
このガイド２５に沿って往復移動されるアーム２６とを
備えており、アーム２６はその先端部において治具１３
を下から支持し得るように構成されている。The transfer unit 3 is equipped with a transfer device 20 so as to be able to transfer the jig 13 between the transport device 16 and the stocker 19 and between the stocker 19 and each fork 12. . That is, the transfer device 20 includes a guide 21 laid in the vertical direction, a lifting platform 22 that is reciprocated up and down along the guide 21 by an appropriate drive device (not shown), and a lifting platform 22 that is parallel to the fork 12. A horizontal guide 23 is laid on the fork 12, a moving table 24 is reciprocated along this guide 23 by an appropriate drive device (not shown), and a moving table 24 is laid on the moving table 24 at right angles to the fork 12. It is equipped with a front-rear guide 25 and an arm 26 that is reciprocated along this guide 25 by a suitable drive device (not shown), and the arm 26 has a distal end that is connected to the jig 13.
It is constructed so that it can be supported from below.

次に作用を説明する。Next, the effect will be explained.

ウェハ１を収容しているカートリッジ１５が移換部４に
搬入されると、移換装置１４はカートリノジ１５のウェ
ハ１を熱処理専用の治具１３に一枚宛、移し換える。When the cartridge 15 containing the wafers 1 is carried into the transfer unit 4, the transfer device 14 transfers the wafers 1 in the cartridge nozzle 15 one by one to the jig 13 dedicated to heat treatment.

所定枚数のウェハｌを移し換えられて収容した治具１３
は搬送装置１６により、台車１８に載せられた状態でガ
イド１７に沿って移載部３に搬送される。A jig 13 that has transferred and accommodated a predetermined number of wafers l.
is transported to the transfer section 3 along the guide 17 while being placed on a cart 18 by the transport device 16 .

移載部３に搬送された治具１３は移載装置２０によりガ
イドドア上からストッカ１９上に移載される。すなわち
、移載装置２０のアーム２６は３次元的に移動すること
により、治具１３を支持してガイド１７からストッカ１
９に移載する。The jig 13 transported to the transfer section 3 is transferred from above the guide door onto the stocker 19 by the transfer device 20. That is, the arm 26 of the transfer device 20 moves three-dimensionally to support the jig 13 and move it from the guide 17 to the stocker 1.
Transferred to 9.

拡散炉５の１基が処理を終了すると、処理済みのウェハ
１を収容している治具１３は拡散炉５から移載部３へ、
ローダ９によりフォーク１２に保持された状態で搬出さ
れる。移載部３に搬出された治具１３は移載装置２０に
より、フォーク１２上から搬送装置１６におけるガイド
１７上に移載される。すなわち、移載装置２０のアーム
２６は３次元的に移動することにより、治具１３を支持
してフォーク１２からガイド１７に移載する。When one of the diffusion furnaces 5 finishes processing, the jig 13 containing the processed wafer 1 is transferred from the diffusion furnace 5 to the transfer section 3.
It is carried out by the loader 9 while being held by the fork 12. The jig 13 carried out to the transfer section 3 is transferred from the fork 12 onto the guide 17 in the transport device 16 by the transfer device 20 . That is, the arm 26 of the transfer device 20 supports the jig 13 and transfers it from the fork 12 to the guide 17 by moving three-dimensionally.

りされている処理前の治具１３をストソカエ９から搬出
を終えたフォーク１２へ直ちに移載する。The unprocessed jig 13 that has been removed is immediately transferred from the stock transporter 9 to the fork 12 that has been unloaded.

すなわち、移載装置２０におけるアーム２６は３次元的
に移動することにより、治具１３を支持してストッカ１
９からフォーク１２へ移載する。That is, the arm 26 in the transfer device 20 supports the jig 13 by moving three-dimensionally and moves it to the stocker 1.
Transfer from 9 to fork 12.

一方、ガイド１７に移載された処理済みの治具１３は搬
送装置１６により移載部３から移換部４へ搬送される。On the other hand, the processed jig 13 transferred to the guide 17 is transferred from the transfer section 3 to the transfer section 4 by the transfer device 16.

移換部４に搬送された治具１３に収容されている処理済
みのウェハ１は、治具１３から空カートリッジ１５に移
換装置１４により一枚宛、移し換えられる。The processed wafers 1 housed in the jig 13 transported to the transfer section 4 are transferred one by one from the jig 13 to the empty cartridge 15 by the transfer device 14 .

以降、前記作動が繰り返されることにより、各拡散炉５
に対してウェハ１が自動的に出し入れされ、拡散処理が
順次実施されて行く。Thereafter, by repeating the above operation, each diffusion furnace 5
The wafers 1 are automatically taken in and out of the wafers, and the diffusion process is sequentially performed.

なお、拡散処理時間に比べてウェハの移換作業時間およ
び治具の移載時間は短いので、移換、移載作業により拡
散処理が待たされる虞はない。Note that since the wafer transfer work time and the jig transfer time are shorter than the diffusion process time, there is no possibility that the diffusion process will be delayed due to the transfer and transfer work.

〔効果〕〔effect〕

（１）　　ウェハの処理室への出し入れを一貫自動化す
ることにより、生産性を高められるばかりでなく、人手
が介入することを回避することができるため、誤処理や
汚染を防止することができる。(1) By fully automating the loading and unloading of wafers into and out of the processing chamber, not only can productivity be increased, but manual intervention can also be avoided, thereby preventing erroneous processing and contamination.

（２）治具を一時的にストックするストッカを介設する
ことにより、移換装置および移載装置を常時稼働し続け
ることができるため、その稼働率を高めることができる
とともに、複数併設されている処理室の待ち時間を短縮
して稼働率を高めることができる。(2) By installing a stocker to temporarily stock jigs, the transfer device and transfer device can be kept in operation at all times, increasing their operating rate and allowing multiple devices to be installed together. It is possible to shorten the waiting time of the processing room and increase the operating rate.

（３）　　ストッカを搬送ラインの真上に設備すること
によ”す、スペース効率を高めることができる。(3) Space efficiency can be improved by installing the stocker directly above the transfer line.

（４）　　ウェハを一枚宛移し換えるように移換装置を
構成することにより、カートリッジおよび治具の規格に
対して汎用性を持たせることができる。(4) By configuring the transfer device to transfer one wafer at a time, it is possible to provide versatility with respect to cartridge and jig specifications.

（５）　　カートリッジと治具相互でウェハの移し換え
を行うように移換装置を構成することにより、移換装置
の稼働率を一層高めることができる。(5) By configuring the transfer device to transfer wafers between the cartridge and the jig, the operating rate of the transfer device can be further increased.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例い範囲で種々変
更可能であることはいうまでもない。Although the invention made by the present inventor has been specifically explained based on examples, it goes without saying that the present invention can be modified in various ways within the scope of the above-mentioned examples.

例えば、移換装置はウェハを一枚宛移し換えるように構
成するに限らず、複数枚を一度に移し換えるように構成
してもよい。For example, the transfer device is not limited to being configured to transfer one wafer, but may be configured to transfer multiple wafers at once.

移換装置は未処理ウェハの実カートリッジがら空治具へ
の移し換えと、処理済みウェハの実治具から空カートリ
ッジへの移し換えを別々に行うように構成してもよい。The transfer device may be configured to separately transfer unprocessed wafers from a real cartridge to an empty jig and transfer processed wafers from a real jig to an empty cartridge.

ストッカは治具を複数ストックし得るように構成しても
よい。The stocker may be configured to be able to stock a plurality of jigs.

〔利用分野〕[Application field]

以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である拡散装置に適用した
場合について説明したが、それに限定されるものではな
く、他の熱処理装置等にも適用することができる。The above explanation has mainly been about the application of the invention made by the present inventor to a diffusion device, which is the field of application behind the invention, but it is not limited to this, and the invention can also be applied to other heat treatment devices, etc. be able to.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例であるウェハ処理装第２図は
その正面図、 第３図はその側面断面図、 第４図はその斜視図である。 ■・・・ウェハ、２・・・処理部、３・・・移載部、４
・・・移換部、５・・・拡散炉（処理室）、６・・・プ
ロセスチューブ、７・・・ヒータ、８・・・クリーンル
ーム、９・・・ローダ、１０・・・ガイド、１１・・・
移動台、１２・・・フォーク、１３・・・治具、１４・
・・移換装置、１５・・・カートリッジ、工６・・・搬
送装置、１７・・・ガイド、１８・・・台車、１９・・
・ストッカ、２０・・・移載装置、２１．２３．２５・
・・ガイド、２２・・・昇降台、２４・・・移動台、２
６・・・アーム。 第　　３　　図FIG. 1 is a wafer processing apparatus according to an embodiment of the present invention. FIG. 2 is a front view thereof, FIG. 3 is a side sectional view thereof, and FIG. 4 is a perspective view thereof. ■... Wafer, 2... Processing section, 3... Transfer section, 4
... Transfer section, 5... Diffusion furnace (processing chamber), 6... Process tube, 7... Heater, 8... Clean room, 9... Loader, 10... Guide, 11 ...
Moving table, 12... Fork, 13... Jig, 14.
... Transfer device, 15... Cartridge, Work 6... Conveyance device, 17... Guide, 18... Dolly, 19...
・Stocker, 20...Transfer device, 21.23.25.
...Guide, 22...Elevating platform, 24...Moving platform, 2
6...Arm. Figure 3

Claims (1)

【特許請求の範囲】 １、複数段に併設されている処理室と、ウェハを収容し
ている治具を各段の処理室に出し入れするローダと、カ
ートリッジに収容されているウェハを治具に移し換える
移換装置と、ウェハを収容している治具を搬送する搬送
装置と、ウェハを収容している治具を一時的にストック
するストッカと、搬送装置、ストッカ、ローダ間で治具
の移載を行う移載装置とを備えているウェハ熱処理装置
。 ２、移換装置が、カートリッジおよび治具相互でウェハ
の移し換えを行うように構成されていることを特徴とす
る特許請求の範囲第１項記載のウェハ熱処理装置。 ３、移換装置が、ウェハを一枚宛移し換えるように構成
されていることを特徴とする特許請求の範囲第１項記載
のウェハ熱処理装置。 ４、ストッカが、搬送ラインの真上に配設されているこ
とを特徴とする特許請求の範囲第１項記載のウェハ熱処
理装置。[Scope of Claims] 1. Processing chambers installed in multiple stages, a loader for loading and unloading jigs containing wafers into and out of the processing chambers at each stage, and wafers stored in cartridges in the jigs. A transfer device that transfers wafers, a transfer device that transfers jigs that contain wafers, a stocker that temporarily stocks jigs that contain wafers, and a transfer device that transfers wafers, a stocker that temporarily stocks jigs that contain wafers, and a A wafer heat processing apparatus comprising a transfer device that performs transfer. 2. The wafer heat processing apparatus according to claim 1, wherein the transfer device is configured to transfer wafers between the cartridge and the jig. 3. The wafer heat treatment apparatus according to claim 1, wherein the transfer device is configured to transfer wafers one by one. 4. The wafer heat processing apparatus according to claim 1, wherein the stocker is disposed directly above the transfer line.
JP902185A 1985-01-23 1985-01-23 Heat treating apparatus of wafer Pending JPS61168913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP902185A JPS61168913A (en) 1985-01-23 1985-01-23 Heat treating apparatus of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP902185A JPS61168913A (en) 1985-01-23 1985-01-23 Heat treating apparatus of wafer

Publications (1)

Publication Number Publication Date
JPS61168913A true JPS61168913A (en) 1986-07-30

Family

ID=11708998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP902185A Pending JPS61168913A (en) 1985-01-23 1985-01-23 Heat treating apparatus of wafer

Country Status (1)

Country Link
JP (1) JPS61168913A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661957U (en) * 1993-02-12 1994-09-02 護 加藤 Continuous heat treatment equipment with auto stocker
KR101163636B1 (en) 2010-04-09 2012-07-09 (유)에스엔티 Apparatus for Transferring Wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661957U (en) * 1993-02-12 1994-09-02 護 加藤 Continuous heat treatment equipment with auto stocker
KR101163636B1 (en) 2010-04-09 2012-07-09 (유)에스엔티 Apparatus for Transferring Wafer

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