JPS61166822A - 封止用樹脂組成物 - Google Patents

封止用樹脂組成物

Info

Publication number
JPS61166822A
JPS61166822A JP669285A JP669285A JPS61166822A JP S61166822 A JPS61166822 A JP S61166822A JP 669285 A JP669285 A JP 669285A JP 669285 A JP669285 A JP 669285A JP S61166822 A JPS61166822 A JP S61166822A
Authority
JP
Japan
Prior art keywords
resin
resin composition
sealing
oxa
phosphaphenanthrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP669285A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468345B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Nagata
勉 永田
Tatsuo Sato
辰雄 佐藤
Hiroyuki Hosokawa
洋行 細川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP669285A priority Critical patent/JPS61166822A/ja
Publication of JPS61166822A publication Critical patent/JPS61166822A/ja
Publication of JPH0468345B2 publication Critical patent/JPH0468345B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP669285A 1985-01-19 1985-01-19 封止用樹脂組成物 Granted JPS61166822A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP669285A JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP669285A JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61166822A true JPS61166822A (ja) 1986-07-28
JPH0468345B2 JPH0468345B2 (enrdf_load_stackoverflow) 1992-11-02

Family

ID=11645397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP669285A Granted JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61166822A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11124489A (ja) * 1997-10-22 1999-05-11 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
US6180695B1 (en) * 1997-05-30 2001-01-30 Sumitoimo Bakelite Company Limited Flame-retardant resin composition and semiconductor sealant using the same
WO2001042359A1 (en) * 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
JP2001181399A (ja) * 1999-12-28 2001-07-03 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
JP2002047395A (ja) * 2000-08-03 2002-02-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002053645A (ja) * 2000-08-04 2002-02-19 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002060468A (ja) * 2000-08-16 2002-02-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002088141A (ja) * 2000-09-13 2002-03-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002088140A (ja) * 2000-09-13 2002-03-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
US6486242B1 (en) * 1999-04-20 2002-11-26 Sumitomo Bakelite Company Limited Flame-retardant resin composition and prepreg and laminate using the same
DE112010001422B4 (de) * 2009-03-31 2015-07-23 Kolon Industries, Inc. Phosphorhaltiges Phenolnovolakharz, selbiges umfassendes Härtungsmittel und Epoxyharzzusammensetzung

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180695B1 (en) * 1997-05-30 2001-01-30 Sumitoimo Bakelite Company Limited Flame-retardant resin composition and semiconductor sealant using the same
JPH11124489A (ja) * 1997-10-22 1999-05-11 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
US6486242B1 (en) * 1999-04-20 2002-11-26 Sumitomo Bakelite Company Limited Flame-retardant resin composition and prepreg and laminate using the same
WO2001042359A1 (en) * 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
JP2003516455A (ja) * 1999-12-13 2003-05-13 ダウ グローバル テクノロジーズ インコーポレイティド 難燃性リン元素含有エポキシ樹脂組成物
JP2001181399A (ja) * 1999-12-28 2001-07-03 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
JP2002047395A (ja) * 2000-08-03 2002-02-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002053645A (ja) * 2000-08-04 2002-02-19 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002060468A (ja) * 2000-08-16 2002-02-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002088141A (ja) * 2000-09-13 2002-03-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002088140A (ja) * 2000-09-13 2002-03-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
DE112010001422B4 (de) * 2009-03-31 2015-07-23 Kolon Industries, Inc. Phosphorhaltiges Phenolnovolakharz, selbiges umfassendes Härtungsmittel und Epoxyharzzusammensetzung

Also Published As

Publication number Publication date
JPH0468345B2 (enrdf_load_stackoverflow) 1992-11-02

Similar Documents

Publication Publication Date Title
JPS61166822A (ja) 封止用樹脂組成物
JP2003213081A (ja) エポキシ樹脂組成物および半導体装置
JPS61101522A (ja) 封止用樹脂組成物
JP2862928B2 (ja) 封止用樹脂組成物及び半導体封止装置
JP2004115747A (ja) ヒートシンク形成用樹脂組成物および電子部品封止装置
JPS61293219A (ja) 封止用樹脂組成物
JPH0249329B2 (enrdf_load_stackoverflow)
JP2641183B2 (ja) 封止用樹脂組成物
JPS61101524A (ja) 封止用樹脂組成物
JPS61101523A (ja) 封止用樹脂組成物
JPS60161423A (ja) 封止用樹脂組成物
JP2857441B2 (ja) 封止用樹脂組成物及び半導体封止装置
JPH03177451A (ja) 封止用樹脂組成物および半導体装置
JPS6143621A (ja) 封止用樹脂組成物
JPH093169A (ja) 封止用樹脂組成物および電子部品封止装置
JPH0343445A (ja) 封止用樹脂組成物及びその半導体封止装置
JP3298084B2 (ja) 封止用樹脂組成物および半導体封止装置
JP3506423B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH0747681B2 (ja) 封止用樹脂組成物
JPH0739471B2 (ja) 封止用樹脂組成物
JPH03142956A (ja) 樹脂封止型半導体装置
JPS60152522A (ja) 封止用樹脂組成物
JPS61101525A (ja) 封止用樹脂組成物
JPH0552846B2 (enrdf_load_stackoverflow)
JPH0468329B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees