JPS6116611Y2 - - Google Patents

Info

Publication number

JPS6116611Y2

JPS6116611Y2 JP5153079U JP5153079U JPS6116611Y2 JP S6116611 Y2 JPS6116611 Y2 JP S6116611Y2 JP 5153079 U JP5153079 U JP 5153079U JP 5153079 U JP5153079 U JP 5153079U JP S6116611 Y2 JPS6116611 Y2 JP S6116611Y2

Authority

JP

Japan

Prior art keywords

resin

heating element

heating resistor

layer

temperature sensing

Prior art date

1979-04-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000011347 resin Substances 0.000 claims description 36
• 229920005989 resin Polymers 0.000 claims description 36
• 238000010438 heat treatment Methods 0.000 claims description 33
• 229910052751 metal Inorganic materials 0.000 claims description 7
• 239000002184 metal Substances 0.000 claims description 7
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
• 229910052799 carbon Inorganic materials 0.000 claims description 4
• 239000002245 particle Substances 0.000 claims description 2
• 239000011810 insulating material Substances 0.000 description 7
• 239000003973 paint Substances 0.000 description 4
• 238000007650 screen-printing Methods 0.000 description 3
• 238000009413 insulation Methods 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 239000003960 organic solvent Substances 0.000 description 2
• 230000002093 peripheral effect Effects 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229920000742 Cotton Polymers 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
• 239000005062 Polybutadiene Substances 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 238000010521 absorption reaction Methods 0.000 description 1
• 239000000654 additive Substances 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 238000004026 adhesive bonding Methods 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 230000009172 bursting Effects 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 238000010097 foam moulding Methods 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000004033 plastic Substances 0.000 description 1
• 229920003023 plastic Polymers 0.000 description 1
• 229920002857 polybutadiene Polymers 0.000 description 1
• 238000003672 processing method Methods 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1