JPS6116538A - ボンデイングワイヤへの張力附加装置 - Google Patents

ボンデイングワイヤへの張力附加装置

Info

Publication number
JPS6116538A
JPS6116538A JP59138325A JP13832584A JPS6116538A JP S6116538 A JPS6116538 A JP S6116538A JP 59138325 A JP59138325 A JP 59138325A JP 13832584 A JP13832584 A JP 13832584A JP S6116538 A JPS6116538 A JP S6116538A
Authority
JP
Japan
Prior art keywords
wire
tension
diameter
capillary
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59138325A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0515066B2 (enrdf_load_stackoverflow
Inventor
Tadashi Yamamoto
山元　匡
Tsuneo Hamaguchi
浜口　恒夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP59138325A priority Critical patent/JPS6116538A/ja
Publication of JPS6116538A publication Critical patent/JPS6116538A/ja
Publication of JPH0515066B2 publication Critical patent/JPH0515066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59138325A 1984-07-03 1984-07-03 ボンデイングワイヤへの張力附加装置 Granted JPS6116538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59138325A JPS6116538A (ja) 1984-07-03 1984-07-03 ボンデイングワイヤへの張力附加装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59138325A JPS6116538A (ja) 1984-07-03 1984-07-03 ボンデイングワイヤへの張力附加装置

Publications (2)

Publication Number Publication Date
JPS6116538A true JPS6116538A (ja) 1986-01-24
JPH0515066B2 JPH0515066B2 (enrdf_load_stackoverflow) 1993-02-26

Family

ID=15219263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59138325A Granted JPS6116538A (ja) 1984-07-03 1984-07-03 ボンデイングワイヤへの張力附加装置

Country Status (1)

Country Link
JP (1) JPS6116538A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318837U (enrdf_load_stackoverflow) * 1986-07-22 1988-02-08
WO2006049977A1 (en) * 2004-10-28 2006-05-11 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318837U (enrdf_load_stackoverflow) * 1986-07-22 1988-02-08
WO2006049977A1 (en) * 2004-10-28 2006-05-11 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder

Also Published As

Publication number Publication date
JPH0515066B2 (enrdf_load_stackoverflow) 1993-02-26

Similar Documents

Publication Publication Date Title
JPS61502791A (ja) ボンディングツ−ル及びクランプアセンブリ−並びにワイヤ−取扱い方法
JP3996216B2 (ja) 改良されたキャピラリおよび細かいピッチのボールボンディング法
US3747198A (en) Tailless wedge bonding of gold wire to palladium-silver cermets
TWI495527B (zh) 用於導線鍵合機的自動導線進給系統
US5954260A (en) Fine pitch bonding technique
JPS6116538A (ja) ボンデイングワイヤへの張力附加装置
KR100749691B1 (ko) 와이어 본딩용 모세관
US7014095B2 (en) Wire bonding method, wire bonding apparatus and wire bonding program
US3689983A (en) Method of bonding
US6641025B2 (en) Threading tool and method for bond wire capillary tubes
US6155474A (en) Fine pitch bonding technique
JP2617541B2 (ja) ワイヤーボンディング装置
JPH0697213A (ja) 工具の取付構造
JPS6015938A (ja) ワイヤボンデイング装置
JPH0141025B2 (enrdf_load_stackoverflow)
JPH0219968Y2 (enrdf_load_stackoverflow)
JPS61229776A (ja) 細線の送給装置
JPH0141024B2 (enrdf_load_stackoverflow)
JPH027468Y2 (enrdf_load_stackoverflow)
JPH0310228B2 (enrdf_load_stackoverflow)
US5014900A (en) Deep access bond head
JPH07263477A (ja) 被覆ボンディング細線接合用キャピラリー
US20020139830A1 (en) Wire tensioning apparatus
JPS59112630A (ja) ワイヤボンデイング装置
KR200144700Y1 (ko) 다이 본딩장치

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term