JPH0141025B2 - - Google Patents

Info

Publication number
JPH0141025B2
JPH0141025B2 JP57179111A JP17911182A JPH0141025B2 JP H0141025 B2 JPH0141025 B2 JP H0141025B2 JP 57179111 A JP57179111 A JP 57179111A JP 17911182 A JP17911182 A JP 17911182A JP H0141025 B2 JPH0141025 B2 JP H0141025B2
Authority
JP
Japan
Prior art keywords
wire
tension
spool
capillary
compressed air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57179111A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5968937A (ja
Inventor
Hiroshi Ushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57179111A priority Critical patent/JPS5968937A/ja
Publication of JPS5968937A publication Critical patent/JPS5968937A/ja
Publication of JPH0141025B2 publication Critical patent/JPH0141025B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Wire Bonding (AREA)
JP57179111A 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法 Granted JPS5968937A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57179111A JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57179111A JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Publications (2)

Publication Number Publication Date
JPS5968937A JPS5968937A (ja) 1984-04-19
JPH0141025B2 true JPH0141025B2 (enrdf_load_stackoverflow) 1989-09-01

Family

ID=16060201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57179111A Granted JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Country Status (1)

Country Link
JP (1) JPS5968937A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685044B1 (ko) 2005-11-29 2007-02-20 주식회사 포스코 에어 가이드형 선재 가이더
KR101516608B1 (ko) * 2009-12-25 2015-05-04 아다만도 고교 가부시키가이샤 에어 텐션 장치
CN102658344B (zh) * 2012-05-29 2015-04-22 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN105304223B (zh) * 2015-12-03 2017-07-28 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
CN113070417A (zh) * 2021-04-22 2021-07-06 中国空气动力研究与发展中心设备设计与测试技术研究所 一种极细铝丝自动绷直切割装置

Also Published As

Publication number Publication date
JPS5968937A (ja) 1984-04-19

Similar Documents

Publication Publication Date Title
US6023837A (en) Winding head
US4928871A (en) Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US7407079B2 (en) Automated filament attachment system for vacuum fluorescent display
JP2002083837A (ja) ワイヤボンディング装置
JPH0141025B2 (enrdf_load_stackoverflow)
US4019669A (en) Wire bonding apparatus
US5564616A (en) Wire bonding apparatus
US6854683B2 (en) Tape winder
US7549569B2 (en) Wire clamp gap control mechanism and method
JP2000235993A (ja) ワイヤボンダ
US6036080A (en) Wire bonding method
US6789721B2 (en) Threading tool and method for bond wire capillary tubes
JPS6141231Y2 (enrdf_load_stackoverflow)
US6246106B1 (en) Lead frame
US20100224715A1 (en) Wire supply device for a wire bonder
JP2617541B2 (ja) ワイヤーボンディング装置
KR940002760B1 (ko) 와이어 본딩방법
JPH0521879Y2 (enrdf_load_stackoverflow)
JPH10139278A (ja) テンション装置
US6024271A (en) Wire bonding apparatus
CN220189611U (zh) 一种引线键合线夹及键合系统
KR100273237B1 (ko) 반도체패키지의와이어본딩공정용와이어공급장치
JP2592506Y2 (ja) 巻線機の巻線抑え装置付きノズルホルダ
JPH01265529A (ja) ワイヤーボンディング装置のエアーテンション装置
JPH019156Y2 (enrdf_load_stackoverflow)