JPS61164033U - - Google Patents
Info
- Publication number
- JPS61164033U JPS61164033U JP3245085U JP3245085U JPS61164033U JP S61164033 U JPS61164033 U JP S61164033U JP 3245085 U JP3245085 U JP 3245085U JP 3245085 U JP3245085 U JP 3245085U JP S61164033 U JPS61164033 U JP S61164033U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- pellet
- mounting
- lead frame
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
Description
第１図Ａ及びＢは本考案によるリードフレーム
の断面図及び平面図、第２図乃至第５図は従来の
リードフレーム及びそれを用いたパツケージの断
面図である。
２：内部リード、３：ペレツト、４：ボンデイ
ングワイヤ、９：タブ、１０：ペレツトマウント
面、１１：凹部。
1A and 1B are a sectional view and a plan view of a lead frame according to the present invention, and FIGS. 2 to 5 are sectional views of a conventional lead frame and a package using the same. 2: Internal lead, 3: Pellet, 4: Bonding wire, 9: Tab, 10: Pellet mounting surface, 11: Recess.
Claims (1)
ードよりも下方に位置するように成形されたリー
ドフレームにおいて、前記タブのペレツト・マウ
ント面にマウント時のペレツト位置ずれを防止す
るための凹部を設けたことを特徴とするリードフ
レーム。 A lead frame in which a tab for mounting a semiconductor pellet is formed so as to be positioned below the tab lead, characterized in that a recess is provided on the pellet mounting surface of the tab to prevent the pellet from shifting during mounting. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245085U JPS61164033U (en) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245085U JPS61164033U (en) | 1985-03-06 | 1985-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61164033U true JPS61164033U (en) | 1986-10-11 |
Family
ID=30533974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3245085U Pending JPS61164033U (en) | 1985-03-06 | 1985-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61164033U (en) |
-
1985
- 1985-03-06 JP JP3245085U patent/JPS61164033U/ja active Pending