JPS61162292A - 光溶接装置 - Google Patents

光溶接装置

Info

Publication number
JPS61162292A
JPS61162292A JP60002046A JP204685A JPS61162292A JP S61162292 A JPS61162292 A JP S61162292A JP 60002046 A JP60002046 A JP 60002046A JP 204685 A JP204685 A JP 204685A JP S61162292 A JPS61162292 A JP S61162292A
Authority
JP
Japan
Prior art keywords
welding
light
optical
optical fiber
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60002046A
Other languages
English (en)
Japanese (ja)
Other versions
JPH057110B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yutaka Kaneda
豊 金田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP60002046A priority Critical patent/JPS61162292A/ja
Publication of JPS61162292A publication Critical patent/JPS61162292A/ja
Publication of JPH057110B2 publication Critical patent/JPH057110B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP60002046A 1985-01-11 1985-01-11 光溶接装置 Granted JPS61162292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60002046A JPS61162292A (ja) 1985-01-11 1985-01-11 光溶接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60002046A JPS61162292A (ja) 1985-01-11 1985-01-11 光溶接装置

Publications (2)

Publication Number Publication Date
JPS61162292A true JPS61162292A (ja) 1986-07-22
JPH057110B2 JPH057110B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-01-28

Family

ID=11518383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60002046A Granted JPS61162292A (ja) 1985-01-11 1985-01-11 光溶接装置

Country Status (1)

Country Link
JP (1) JPS61162292A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618606A1 (fr) * 1987-07-24 1989-01-27 Thomson Composants Militaires Four de soudure de puces de circuit integre
JPH02284783A (ja) * 1989-03-27 1990-11-22 General Electric Co <Ge> ホルダ
JPH0655288A (ja) * 1992-03-27 1994-03-01 Matsushita Electric Ind Co Ltd 多軸ビームレーザ加工機
EP1393848A1 (de) * 2002-08-30 2004-03-03 Hella KG Hueck & Co. Anordnung zur Laser-Schweissung
JP2007136483A (ja) * 2005-11-16 2007-06-07 Denso Corp レーザ加工装置
JP2021523019A (ja) * 2018-05-15 2021-09-02 レニショウ パブリック リミテッド カンパニーＲｅｎｉｓｈａｗ Ｐｕｂｌｉｃ Ｌｉｍｉｔｅｄ Ｃｏｍｐａｎｙ レーザービーム位置決め光学系、光ファイバーおよびファイバー終端光学系を備えるレーザービームスキャナー

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764487A (en) * 1980-10-09 1982-04-19 Nec Corp Laser working device
JPS5785687A (en) * 1980-11-17 1982-05-28 Nec Corp Laser working device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764487A (en) * 1980-10-09 1982-04-19 Nec Corp Laser working device
JPS5785687A (en) * 1980-11-17 1982-05-28 Nec Corp Laser working device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618606A1 (fr) * 1987-07-24 1989-01-27 Thomson Composants Militaires Four de soudure de puces de circuit integre
US4909428A (en) * 1987-07-24 1990-03-20 Thomson Composants Militaires Et Spatiaux Furnace to solder integrated circuit chips
JPH02284783A (ja) * 1989-03-27 1990-11-22 General Electric Co <Ge> ホルダ
JPH0655288A (ja) * 1992-03-27 1994-03-01 Matsushita Electric Ind Co Ltd 多軸ビームレーザ加工機
EP1393848A1 (de) * 2002-08-30 2004-03-03 Hella KG Hueck & Co. Anordnung zur Laser-Schweissung
JP2007136483A (ja) * 2005-11-16 2007-06-07 Denso Corp レーザ加工装置
JP2021523019A (ja) * 2018-05-15 2021-09-02 レニショウ パブリック リミテッド カンパニーＲｅｎｉｓｈａｗ Ｐｕｂｌｉｃ Ｌｉｍｉｔｅｄ Ｃｏｍｐａｎｙ レーザービーム位置決め光学系、光ファイバーおよびファイバー終端光学系を備えるレーザービームスキャナー

Also Published As

Publication number Publication date
JPH057110B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-01-28

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