JPS61161608A - 金属鎧装ケ−ブルにおける金属鎧装とケ−ブルシ−スとのボンド構造 - Google Patents
金属鎧装ケ−ブルにおける金属鎧装とケ−ブルシ−スとのボンド構造Info
- Publication number
- JPS61161608A JPS61161608A JP27960284A JP27960284A JPS61161608A JP S61161608 A JPS61161608 A JP S61161608A JP 27960284 A JP27960284 A JP 27960284A JP 27960284 A JP27960284 A JP 27960284A JP S61161608 A JPS61161608 A JP S61161608A
- Authority
- JP
- Japan
- Prior art keywords
- cable
- metal
- layer
- sheath
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 30
- 239000002184 metal Substances 0.000 title claims description 30
- 238000010276 construction Methods 0.000 title 1
- 238000005260 corrosion Methods 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 description 15
- -1 polyethylene Polymers 0.000 description 15
- 229920000573 polyethylene Polymers 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27960284A JPS61161608A (ja) | 1984-12-31 | 1984-12-31 | 金属鎧装ケ−ブルにおける金属鎧装とケ−ブルシ−スとのボンド構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27960284A JPS61161608A (ja) | 1984-12-31 | 1984-12-31 | 金属鎧装ケ−ブルにおける金属鎧装とケ−ブルシ−スとのボンド構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61161608A true JPS61161608A (ja) | 1986-07-22 |
| JPH0421968B2 JPH0421968B2 (enExample) | 1992-04-14 |
Family
ID=17613271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27960284A Granted JPS61161608A (ja) | 1984-12-31 | 1984-12-31 | 金属鎧装ケ−ブルにおける金属鎧装とケ−ブルシ−スとのボンド構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61161608A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5971701A (en) * | 1996-02-09 | 1999-10-26 | Hitachi, Ltd. | Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device |
-
1984
- 1984-12-31 JP JP27960284A patent/JPS61161608A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5971701A (en) * | 1996-02-09 | 1999-10-26 | Hitachi, Ltd. | Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device |
| US6077027A (en) * | 1996-02-09 | 2000-06-20 | Hitachi, Ltd. | Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421968B2 (enExample) | 1992-04-14 |
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