JPS61158954U - - Google Patents
Info
- Publication number
- JPS61158954U JPS61158954U JP4156585U JP4156585U JPS61158954U JP S61158954 U JPS61158954 U JP S61158954U JP 4156585 U JP4156585 U JP 4156585U JP 4156585 U JP4156585 U JP 4156585U JP S61158954 U JPS61158954 U JP S61158954U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- case
- hybrid integrated
- conductor
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図はこの考案の混成集積回路
装置の第１の実施例を示し、第１図は断面図、第
２図は要部の分解斜視図、第３図は従来の混成集
積回路装置の一例を示す斜視図、第４図および第
５図は従来の混成集積回路装置の他の例を示し、
第４図は斜視図、第５図は断面図、第６図はこの
考案の第２の実施例を示す断面図である。
２１…ケース、２３…鍔部、２４…混成集積回
路部、２５…基板、２８…導体部、２９…半田、
３０…コーテイング材。
1 and 2 show a first embodiment of the hybrid integrated circuit device of this invention, FIG. 1 is a sectional view, FIG. 2 is an exploded perspective view of the main parts, and FIG. 3 is a conventional hybrid integrated circuit device. A perspective view showing an example of a circuit device, and FIGS. 4 and 5 show other examples of conventional hybrid integrated circuit devices,
FIG. 4 is a perspective view, FIG. 5 is a sectional view, and FIG. 6 is a sectional view showing a second embodiment of this invention. 21... Case, 23... Flange part, 24... Hybrid integrated circuit part, 25... Board, 28... Conductor part, 29... Solder,
30...Coating material.
Claims (1)
ス内にコーテイング材を充填する混成集積回路装
置において、ケースを熱伝導の大きな材質により
作成するとともに、そのケースの側面内壁に、半
田付け可能な鍔部を設け、一方、混成集積回路部
の基板の端部平面部には導体を設け、この導体を
設けた基板の端部を前記鍔部上に支持した状態で
、前記導体を鍔部に半田付けしたことを特徴とす
る混成集積回路装置。 In a hybrid integrated circuit device in which a hybrid integrated circuit section is housed in a case and a coating material is filled in the case, the case is made of a material with high thermal conductivity, and a flange that can be soldered is attached to the side inner wall of the case. On the other hand, a conductor is provided on the flat end of the substrate of the hybrid integrated circuit section, and the conductor is soldered to the flange while the end of the substrate provided with the conductor is supported on the flange. A hybrid integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156585U JPH0325411Y2 (en) | 1985-03-25 | 1985-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156585U JPH0325411Y2 (en) | 1985-03-25 | 1985-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61158954U true JPS61158954U (en) | 1986-10-02 |
| JPH0325411Y2 JPH0325411Y2 (en) | 1991-06-03 |
Family
ID=30551512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156585U Expired JPH0325411Y2 (en) | 1985-03-25 | 1985-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325411Y2 (en) |
-
1985
- 1985-03-25 JP JP4156585U patent/JPH0325411Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0325411Y2 (en) | 1991-06-03 |