JPS61151363U - - Google Patents
Info
- Publication number
- JPS61151363U JPS61151363U JP3435585U JP3435585U JPS61151363U JP S61151363 U JPS61151363 U JP S61151363U JP 3435585 U JP3435585 U JP 3435585U JP 3435585 U JP3435585 U JP 3435585U JP S61151363 U JPS61151363 U JP S61151363U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor laser
- scribed
- light
- receiving elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims 1
Description
第１図及び第２図は本考案半導体レーザ製造用
半導体基板の各別の実施例を示す平面図、第３図
Ａ乃至Ｅは背景技術を半導体レーザ装置製造工程
順に示す斜視図、第４図Ａ，Ｂは従来技術の問題
点の各別の例を示す断面図である。
符号の説明、１，１ａ……半導体基板、２……
受光素子、３……チツプボンデイング部、４……
半導体レーザチツプ、５……スクライブすべき領
域、６……半導体レーザチツプの端面と平行なス
クライブすべき領域、７，１４……カツテイング
位置合せ用指標。
1 and 2 are plan views showing different embodiments of the semiconductor substrate for manufacturing a semiconductor laser according to the present invention, FIGS. 3A to 3E are perspective views showing the background art in order of the manufacturing process of a semiconductor laser device, and FIG. 4 A and B are cross-sectional views showing different examples of problems in the prior art. Explanation of symbols, 1, 1a...semiconductor substrate, 2...
Light receiving element, 3... Chip bonding section, 4...
Semiconductor laser chip, 5...A region to be scribed, 6...A region to be scribed parallel to the end face of the semiconductor laser chip, 7, 14... Cutting alignment index.
Claims (1)
プボンデイング部を有する受光素子が群成せしめ
られ、 上記各受光素子間を仕切る碁盤目状のスクライ
ブすべき領域のうち上記チツプボンデイング部に
ボンデイングされる半導体レーザチツプのレーザ
ビーム出射端面と平行な各スクライブすべき領域
にカツテイング位置合せ用指標が形成されて なることを特徴とする半導体レーザ製造用半導
体基板。[Scope of Claim for Utility Model Registration] Light-receiving elements each having a chip-bonding part to which a semiconductor laser chip is bonded are grouped together, and bonding is applied to the chip-bonding part in a grid-shaped area to be scribed that partitions each of the light-receiving elements. 1. A semiconductor substrate for manufacturing a semiconductor laser, characterized in that a cutting positioning index is formed in each region to be scribed parallel to a laser beam emitting end face of a semiconductor laser chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985034355U JPH073657Y2 (en) | 1985-03-11 | 1985-03-11 | Semiconductor substrate for semiconductor laser manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985034355U JPH073657Y2 (en) | 1985-03-11 | 1985-03-11 | Semiconductor substrate for semiconductor laser manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61151363U true JPS61151363U (en) | 1986-09-18 |
| JPH073657Y2 JPH073657Y2 (en) | 1995-01-30 |
Family
ID=30537646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985034355U Expired - Lifetime JPH073657Y2 (en) | 1985-03-11 | 1985-03-11 | Semiconductor substrate for semiconductor laser manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073657Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50153862U (en) * | 1974-06-07 | 1975-12-20 | ||
| JPS58173880A (en) * | 1982-04-07 | 1983-10-12 | Sony Corp | Installing method for light-emitting element |
| JPS5996789A (en) * | 1982-11-25 | 1984-06-04 | Nec Corp | Photosemiconductor device |
-
1985
- 1985-03-11 JP JP1985034355U patent/JPH073657Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50153862U (en) * | 1974-06-07 | 1975-12-20 | ||
| JPS58173880A (en) * | 1982-04-07 | 1983-10-12 | Sony Corp | Installing method for light-emitting element |
| JPS5996789A (en) * | 1982-11-25 | 1984-06-04 | Nec Corp | Photosemiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073657Y2 (en) | 1995-01-30 |
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