JPH028067U - - Google Patents
Info
- Publication number
- JPH028067U JPH028067U JP8350988U JP8350988U JPH028067U JP H028067 U JPH028067 U JP H028067U JP 8350988 U JP8350988 U JP 8350988U JP 8350988 U JP8350988 U JP 8350988U JP H028067 U JPH028067 U JP H028067U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- cutting
- emitting regions
- cutting line
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図は本考案の第1の実施例の平面図、第2
図は第1図の切断精度判定パターンの拡大図、第
3図a〜dは第1図の切断精度判定パターンの活
用図、第4図は第2の実施例の平面図、第5図は
第4図の切断精度判定パターンの拡大図、第6図
a〜dは第4図の切断精度判定パターンの活用図
、第7図は従来の発光ダイオード・アレイの平面
図、第8図は発光ダイオード・アレイのダイ・ボ
デイングの様子を説明するための斜視図である。
1……発光領域、2……電極、3……表面保護
膜、4……切断精度判定パターン、5……切断部
余白、6……端面切断ライン、7……側面切断ラ
イン、8……加工切断ライン。
Figure 1 is a plan view of the first embodiment of the present invention;
The figure is an enlarged view of the cutting accuracy judgment pattern in Fig. 1, Figs. 3 a to d are illustrations of the utilization of the cutting accuracy judgment pattern in Fig. 1, Fig. 4 is a plan view of the second embodiment, and Fig. 5 is an enlarged view of the cutting accuracy judgment pattern in Fig. 1. FIG. 4 is an enlarged view of the cutting accuracy determination pattern, FIGS. 6 a to d are usage diagrams of the cutting accuracy determination pattern in FIG. 4, FIG. 7 is a plan view of a conventional light emitting diode array, and FIG. 8 is a light emitting FIG. 2 is a perspective view for explaining the state of die bodying of a diode array. DESCRIPTION OF SYMBOLS 1... Light emitting region, 2... Electrode, 3... Surface protective film, 4... Cutting accuracy determination pattern, 5... Cutting section margin, 6... End face cutting line, 7... Side cutting line, 8... processing cutting line.
Claims (1)
た複数の発光領域と、発光領域形成の際用いられ
る表面保護膜と、該発光領域にオーミツク接続さ
れた電極と、発光領域の整列方向と垂直方向に切
断する切断ライン近傍に、切断ラインを中心線と
してその両側に凸部と凹部の形状をした切断精度
判定パターンとを備えたことを特徴とする発光ダ
イオード・アレイ。 A plurality of light emitting regions aligned on one surface of a compound semiconductor substrate, a surface protective film used in forming the light emitting regions, an electrode ohmicly connected to the light emitting regions, and a direction perpendicular to the alignment direction of the light emitting regions. 1. A light emitting diode array characterized in that, near a cutting line for cutting, a cutting accuracy determination pattern having a shape of a convex part and a concave part is provided on both sides of the cutting line with the cutting line as a center line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8350988U JPH028067U (en) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8350988U JPH028067U (en) | 1988-06-23 | 1988-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028067U true JPH028067U (en) | 1990-01-18 |
Family
ID=31308224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8350988U Pending JPH028067U (en) | 1988-06-23 | 1988-06-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028067U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6435014U (en) * | 1987-08-28 | 1989-03-03 |
-
1988
- 1988-06-23 JP JP8350988U patent/JPH028067U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6435014U (en) * | 1987-08-28 | 1989-03-03 |