JPS61149474A - Heating method of thin film material in vacuum deposition - Google Patents

Abstract

PURPOSE:To make possible many times of the stable formation of thin films for a long period of time by heating simultaneously a thin film material for vapor deposition by using a heat source for heating the entire part and a heat source for local heating. CONSTITUTION:A crucible 7 contg. the thin film material 8 for vacuum deposition is mounted to a crucible rest 5 embedded with a heater 4. The above- mentioned material 8 is heated over the entire part by the heater 4 via the crucible 7 to about the temp. at which the material 8 does not evaporate. Electron rays 3 generated from a filament 1 are focused by using the magnetic field formed by a magnet 2, by which the material 8 heated over the entire part is locally heated to evaporate 9. The material 8 is thereby evaporated in the stable state without making chemical reaction with the crucible 7 and without bumping. Many times of the stable formation of the thin films over a long period of time are thus made possible.

Description

[Detailed description of the invention] Industrial applications The present invention enables stable formation of thin films by vacuum evaporation. The present invention relates to a heating method for thin film materials.

2. Description of the Related Art In general, methods for heating thin film materials in vacuum deposition include a resistance heating method as shown in FIG. 2, and an electron beam heating method as shown in FIG.

In the former case, for example, a thin film material 1 is placed in a boat-shaped evaporation source 1o.
1, and a current is passed through the evaporation source 1o through the electrode 12 to generate heat, thereby heating the thin film material 11.

The latter uses a magnetic field formed by a magnet 14 to focus an electron beam 16 generated from a filament 13 onto the thin film material 16 and heat it. In this case, in order to prevent damage to the evaporation source, cooling water 17 is flown to cool it (for example, Kume Kanehara and Hideo Fujiwara [Thin Film J, (1982).
e, s), Shokabou.

P10-11).

Problems to be Solved by the Invention In the method using resistance heating, the evaporation source 1o has a higher temperature than the thin film material 11, so the thin film material 11 and the evaporation source 1o
A chemical reaction with the material and bumping at the interface between the two is likely to occur.

In addition, in the method using electron beam heating, only the part that is hit by the electron beam 15 is heated, and the surface that is in contact with the evaporation source is cooled, so the temperature gradient becomes large and only the part that is hit by the electron beam 16 melts. , holes as shown by broken lines are likely to be formed in the thin film material 11.

Furthermore, if the intensity of the electron beam 16 is increased in order to heat the whole, bumping is likely to occur.

Due to the above reasons, it has been difficult to stably form a thin film with few defects over a long period of time using conventional heating methods.

The present invention has been made in view of these points, and an object of the present invention is to provide a method for heating a thin film material, which allows stable thin film formation over a long period of time and many times.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention heats the thin film material as a whole with a first heat source and locally heats it with a second heat source.

Effect The present invention uses the method described above to evaporate the thin film material by local heating while heating the entire thin film material to some extent, thereby performing vapor deposition in a state where the temperature gradient within the thin film material is small and there is no rapid heating of the evaporation source. can be done. Therefore, there is no damage to the thin film material or evaporation source even during long-term and multiple depositions, without creating holes in the thin film material during deposition, without causing a chemical reaction between the thin film material and the evaporation source, and without causing the thin film material to boil. Since there is little , it becomes possible to form a stable thin film over a long period of time.

Embodiment FIG. 1 is a sectional view of a heating device showing an embodiment of the method for heating thin film materials of the present invention. In FIG. 1, a crucible 7 containing a thin film material 8 is mounted on a crucible holder 5. A heater 4 is embedded in the crucible holder 5, thereby heating the thin film material 8 entirely through the crucible.

The heating temperature is set to such a level that the thin film material does not evaporate. Here, the cavity 6 adjacent to the crucible holder 6 is for preventing the heat of the heater 4 from escaping. By focusing the electron beam 3 generated from the filament 1 on the thin film material 8 that has been entirely heated in this manner using the magnetic field formed by the magnet 2, the thin film material 8 is heated.
is locally heated and evaporated. Arrow 9 shows how the thin film material evaporates.

As a result, the thin film material 8 can be evaporated in a stable state without causing a chemical reaction with the crucible 7, causing bumping, or creating a hole in the portion exposed to the electron beam. Therefore, it is possible to form a stable thin film over a long period of time and many times.

In this example, Pd was used as the thin film material, and a crucible made of BN was used.

Effects of the Invention As described above, according to the present invention, with a simple configuration, holes are formed in the thin film material during vacuum evaporation, chemical reactions occur between the thin film material and the evaporation source, and the thin film material boils. It is possible to form a stable thin film over a long period of time and many times without any problems, which is extremely advantageous in practical terms.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a heating device that implements the method of heating thin film materials in vacuum evaporation of the present invention, and FIGS. 2 and 3 are sectional views of heating devices that use a conventional method. 1...Filament, 2...Magnet, 3
...Electron beam, 4...Heater, 7...
...Crucible, 8...Thin film material. Name of agent: Patent attorney Toshio Nakao and 1 other person!・
...Finmen) 4 Heater δ...Rotsu IJ゛ψ1 Poor Roha゛. θ... Utsuto Awaoooooooo! ?・ Quality Kafuno 3 ・ Filament

Claims (2)

[Claims] (1) A method for heating a thin film material in vacuum evaporation, which comprises heating the material to be formed into a thin film in vacuum entirely by a first heat source and locally heating it by a second heat source. (2) Claim 1 in which a resistance heating means is used as the first heat source and an electron beam heating means is used as the second heat source.
A method of heating a thin film material in vacuum evaporation as described in 2.