JPS61148858A - リ−ドフレ−ム用金型 - Google Patents
リ−ドフレ−ム用金型Info
- Publication number
- JPS61148858A JPS61148858A JP27112684A JP27112684A JPS61148858A JP S61148858 A JPS61148858 A JP S61148858A JP 27112684 A JP27112684 A JP 27112684A JP 27112684 A JP27112684 A JP 27112684A JP S61148858 A JPS61148858 A JP S61148858A
- Authority
- JP
- Japan
- Prior art keywords
- die
- lead frame
- mold
- casing
- sharpening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27112684A JPS61148858A (ja) | 1984-12-22 | 1984-12-22 | リ−ドフレ−ム用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27112684A JPS61148858A (ja) | 1984-12-22 | 1984-12-22 | リ−ドフレ−ム用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61148858A true JPS61148858A (ja) | 1986-07-07 |
| JPH0143462B2 JPH0143462B2 (enExample) | 1989-09-20 |
Family
ID=17495689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27112684A Granted JPS61148858A (ja) | 1984-12-22 | 1984-12-22 | リ−ドフレ−ム用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148858A (enExample) |
-
1984
- 1984-12-22 JP JP27112684A patent/JPS61148858A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0143462B2 (enExample) | 1989-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |