JPS61148845A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS61148845A JPS61148845A JP59271163A JP27116384A JPS61148845A JP S61148845 A JPS61148845 A JP S61148845A JP 59271163 A JP59271163 A JP 59271163A JP 27116384 A JP27116384 A JP 27116384A JP S61148845 A JPS61148845 A JP S61148845A
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- gel
- semiconductor device
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 1
- 230000009193 crawling Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59271163A JPS61148845A (ja) | 1984-12-21 | 1984-12-21 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59271163A JPS61148845A (ja) | 1984-12-21 | 1984-12-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61148845A true JPS61148845A (ja) | 1986-07-07 |
| JPH0334863B2 JPH0334863B2 (enrdf_load_stackoverflow) | 1991-05-24 |
Family
ID=17496212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59271163A Granted JPS61148845A (ja) | 1984-12-21 | 1984-12-21 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148845A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0608051A3 (en) * | 1993-01-13 | 1994-09-21 | Fuji Electric Co Ltd | Resin-sealed semiconductor device. |
| GB2452594A (en) * | 2007-08-20 | 2009-03-11 | Champion Aerospace Inc | High voltage semiconductor device package for an aircraft ignition circuit |
| CN101500389B (zh) | 2008-01-29 | 2011-08-03 | 上海西门子医疗器械有限公司 | 一种连接装置及其装配工具和装配方法 |
| JP2019110217A (ja) * | 2017-12-19 | 2019-07-04 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53122650U (enrdf_load_stackoverflow) * | 1977-03-08 | 1978-09-29 |
-
1984
- 1984-12-21 JP JP59271163A patent/JPS61148845A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53122650U (enrdf_load_stackoverflow) * | 1977-03-08 | 1978-09-29 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0608051A3 (en) * | 1993-01-13 | 1994-09-21 | Fuji Electric Co Ltd | Resin-sealed semiconductor device. |
| US5606200A (en) * | 1993-01-13 | 1997-02-25 | Fuji Electric Co., Ltd. | Resin sealed semiconductor device with improved structural integrity |
| GB2452594A (en) * | 2007-08-20 | 2009-03-11 | Champion Aerospace Inc | High voltage semiconductor device package for an aircraft ignition circuit |
| US7880281B2 (en) | 2007-08-20 | 2011-02-01 | Champion Aerospace Llc | Switching assembly for an aircraft ignition system |
| GB2452594B (en) * | 2007-08-20 | 2012-04-25 | Champion Aerospace Inc | Switching assembly for an aircraft ignition system |
| CN101500389B (zh) | 2008-01-29 | 2011-08-03 | 上海西门子医疗器械有限公司 | 一种连接装置及其装配工具和装配方法 |
| JP2019110217A (ja) * | 2017-12-19 | 2019-07-04 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334863B2 (enrdf_load_stackoverflow) | 1991-05-24 |
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