JPS53122650U - - Google Patents
Info
- Publication number
- JPS53122650U JPS53122650U JP2753477U JP2753477U JPS53122650U JP S53122650 U JPS53122650 U JP S53122650U JP 2753477 U JP2753477 U JP 2753477U JP 2753477 U JP2753477 U JP 2753477U JP S53122650 U JPS53122650 U JP S53122650U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977027534U JPS5824464Y2 (ja) | 1977-03-08 | 1977-03-08 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977027534U JPS5824464Y2 (ja) | 1977-03-08 | 1977-03-08 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53122650U true JPS53122650U (enrdf_load_stackoverflow) | 1978-09-29 |
JPS5824464Y2 JPS5824464Y2 (ja) | 1983-05-25 |
Family
ID=28871825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977027534U Expired JPS5824464Y2 (ja) | 1977-03-08 | 1977-03-08 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824464Y2 (enrdf_load_stackoverflow) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60216570A (ja) * | 1984-04-12 | 1985-10-30 | Toshiba Corp | 半導体装置用外囲器のケ−ス |
JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS61148845A (ja) * | 1984-12-21 | 1986-07-07 | Mitsubishi Electric Corp | 半導体装置 |
JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
JP2019110217A (ja) * | 2017-12-19 | 2019-07-04 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
JP2020179678A (ja) * | 2017-10-05 | 2020-11-05 | カシオ計算機株式会社 | 電池モジュールの製造方法及び電池モジュール部品 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4710053U (enrdf_load_stackoverflow) * | 1971-02-26 | 1972-10-06 |
-
1977
- 1977-03-08 JP JP1977027534U patent/JPS5824464Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4710053U (enrdf_load_stackoverflow) * | 1971-02-26 | 1972-10-06 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60216570A (ja) * | 1984-04-12 | 1985-10-30 | Toshiba Corp | 半導体装置用外囲器のケ−ス |
JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS61148845A (ja) * | 1984-12-21 | 1986-07-07 | Mitsubishi Electric Corp | 半導体装置 |
JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
JP2020179678A (ja) * | 2017-10-05 | 2020-11-05 | カシオ計算機株式会社 | 電池モジュールの製造方法及び電池モジュール部品 |
JP2019110217A (ja) * | 2017-12-19 | 2019-07-04 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5824464Y2 (ja) | 1983-05-25 |