JPS61148845A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61148845A
JPS61148845A JP59271163A JP27116384A JPS61148845A JP S61148845 A JPS61148845 A JP S61148845A JP 59271163 A JP59271163 A JP 59271163A JP 27116384 A JP27116384 A JP 27116384A JP S61148845 A JPS61148845 A JP S61148845A
Authority
JP
Japan
Prior art keywords
case
resin
gel
semiconductor device
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59271163A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334863B2 (cg-RX-API-DMAC10.html
Inventor
Takayuki Kitamura
北村　孝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59271163A priority Critical patent/JPS61148845A/ja
Publication of JPS61148845A publication Critical patent/JPS61148845A/ja
Publication of JPH0334863B2 publication Critical patent/JPH0334863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/15—
    • H10W76/47—
    • H10W72/5475—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59271163A 1984-12-21 1984-12-21 半導体装置 Granted JPS61148845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59271163A JPS61148845A (ja) 1984-12-21 1984-12-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59271163A JPS61148845A (ja) 1984-12-21 1984-12-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS61148845A true JPS61148845A (ja) 1986-07-07
JPH0334863B2 JPH0334863B2 (cg-RX-API-DMAC10.html) 1991-05-24

Family

ID=17496212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59271163A Granted JPS61148845A (ja) 1984-12-21 1984-12-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS61148845A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0608051A3 (en) * 1993-01-13 1994-09-21 Fuji Electric Co Ltd Resin-sealed semiconductor device.
GB2452594A (en) * 2007-08-20 2009-03-11 Champion Aerospace Inc High voltage semiconductor device package for an aircraft ignition circuit
CN101500389B (zh) 2008-01-29 2011-08-03 上海西门子医疗器械有限公司 一种连接装置及其装配工具和装配方法
JP2019110217A (ja) * 2017-12-19 2019-07-04 三菱電機株式会社 半導体装置及び電力変換装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122650U (cg-RX-API-DMAC10.html) * 1977-03-08 1978-09-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122650U (cg-RX-API-DMAC10.html) * 1977-03-08 1978-09-29

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0608051A3 (en) * 1993-01-13 1994-09-21 Fuji Electric Co Ltd Resin-sealed semiconductor device.
US5606200A (en) * 1993-01-13 1997-02-25 Fuji Electric Co., Ltd. Resin sealed semiconductor device with improved structural integrity
GB2452594A (en) * 2007-08-20 2009-03-11 Champion Aerospace Inc High voltage semiconductor device package for an aircraft ignition circuit
US7880281B2 (en) 2007-08-20 2011-02-01 Champion Aerospace Llc Switching assembly for an aircraft ignition system
GB2452594B (en) * 2007-08-20 2012-04-25 Champion Aerospace Inc Switching assembly for an aircraft ignition system
CN101500389B (zh) 2008-01-29 2011-08-03 上海西门子医疗器械有限公司 一种连接装置及其装配工具和装配方法
JP2019110217A (ja) * 2017-12-19 2019-07-04 三菱電機株式会社 半導体装置及び電力変換装置

Also Published As

Publication number Publication date
JPH0334863B2 (cg-RX-API-DMAC10.html) 1991-05-24

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