JPS6114873B2 - - Google Patents

Info

Publication number
JPS6114873B2
JPS6114873B2 JP6388278A JP6388278A JPS6114873B2 JP S6114873 B2 JPS6114873 B2 JP S6114873B2 JP 6388278 A JP6388278 A JP 6388278A JP 6388278 A JP6388278 A JP 6388278A JP S6114873 B2 JPS6114873 B2 JP S6114873B2
Authority
JP
Japan
Prior art keywords
adhesive
stamp
stamping
stamp tool
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6388278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54155235A (en
Inventor
Akira Yamada
Tadashi Arai
Shigeru Kato
Tadao Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP6388278A priority Critical patent/JPS54155235A/ja
Publication of JPS54155235A publication Critical patent/JPS54155235A/ja
Publication of JPS6114873B2 publication Critical patent/JPS6114873B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
JP6388278A 1978-05-30 1978-05-30 Adhesive coating device Granted JPS54155235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6388278A JPS54155235A (en) 1978-05-30 1978-05-30 Adhesive coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6388278A JPS54155235A (en) 1978-05-30 1978-05-30 Adhesive coating device

Publications (2)

Publication Number Publication Date
JPS54155235A JPS54155235A (en) 1979-12-07
JPS6114873B2 true JPS6114873B2 (US06168776-20010102-C00041.png) 1986-04-21

Family

ID=13242095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6388278A Granted JPS54155235A (en) 1978-05-30 1978-05-30 Adhesive coating device

Country Status (1)

Country Link
JP (1) JPS54155235A (US06168776-20010102-C00041.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428761U (US06168776-20010102-C00041.png) * 1990-05-24 1992-03-06

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10113022B4 (de) * 2001-03-17 2013-05-29 Volkswagen Ag Vorrichtung zum Lackieren einer Fläche eines Bauteils

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428761U (US06168776-20010102-C00041.png) * 1990-05-24 1992-03-06

Also Published As

Publication number Publication date
JPS54155235A (en) 1979-12-07

Similar Documents

Publication Publication Date Title
JPS6114873B2 (US06168776-20010102-C00041.png)
JPH06200949A (ja) 軸受用密封板の装着方法および軸受用密封装置
KR100474843B1 (ko) 리드프레임,그의제조방법및그것을사용한반도체장치
KR19990001716A (ko) Loc 리드프레임 접착제 도포장치 및 도포방법
JPS61177731A (ja) 半導体装置用塗布剤供給治具
JPS6285454A (ja) クラツド材の製造方法
JP2529395Y2 (ja) 塗布用チャック
JP3247462B2 (ja) ロール収納カートン用カッターの装着方法
JPH01123495A (ja) 回路基板に対する感光性樹脂フイルムの貼付方法
JP3520815B2 (ja) 圧力センサチップのダイボンド方法
JP2740500B2 (ja) 電子部品テーピング構造
JPS5927536A (ja) 半導体装置及びその製造方法
KR970063706A (ko) 반도체 리드프레임 및 패키지 방법
JPS6016432A (ja) 半導体装置
JPH02163182A (ja) 粘着テープによる接着構造
JP2681297B2 (ja) 密封装置の製造方法
JP3766206B2 (ja) フィルム基板の固定方法
JPS5956340A (ja) 防爆型受像管の製造方法
JPH0332212B2 (US06168776-20010102-C00041.png)
SU1212996A2 (ru) Способ защиты поверхности изделий из диэлектрических материалов
JPS646933Y2 (US06168776-20010102-C00041.png)
JPS62143496A (ja) 光半導体素子のダイボンド方法
JPH09148350A (ja) 樹脂成形方法
JPH09150475A (ja) 接着可能な包装材料および包装体
JPH08186226A (ja) リードフレーム及び基板