JPS6114855A - ポリシング装置 - Google Patents
ポリシング装置Info
- Publication number
- JPS6114855A JPS6114855A JP59133966A JP13396684A JPS6114855A JP S6114855 A JPS6114855 A JP S6114855A JP 59133966 A JP59133966 A JP 59133966A JP 13396684 A JP13396684 A JP 13396684A JP S6114855 A JPS6114855 A JP S6114855A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- surface plate
- polishing
- work
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000004744 fabric Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59133966A JPS6114855A (ja) | 1984-06-28 | 1984-06-28 | ポリシング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59133966A JPS6114855A (ja) | 1984-06-28 | 1984-06-28 | ポリシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6114855A true JPS6114855A (ja) | 1986-01-23 |
| JPH0457467B2 JPH0457467B2 (enrdf_load_stackoverflow) | 1992-09-11 |
Family
ID=15117243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59133966A Granted JPS6114855A (ja) | 1984-06-28 | 1984-06-28 | ポリシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6114855A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63200965A (ja) * | 1987-02-12 | 1988-08-19 | Fujitsu Ltd | ウエ−ハ研磨装置 |
| JPH09120528A (ja) * | 1996-09-02 | 1997-05-06 | Hitachi Ltd | 磁気ディスクの製造方法及び製造装置 |
| JP2000317812A (ja) * | 1999-03-26 | 2000-11-21 | Applied Materials Inc | ポリシングスラリーを供給するキャリヤヘッド |
| KR100370245B1 (ko) * | 1997-06-19 | 2003-04-07 | 인터내셔널 비지네스 머신즈 코포레이션 | 연마패드세정조립체및화학기계적연마어셈블리 |
| JP2006224233A (ja) * | 2005-02-17 | 2006-08-31 | Hoya Corp | マスクブランクス用ガラス基板の製造方法及びマスクブランクスの製造方法 |
| JP2010231854A (ja) * | 2009-03-27 | 2010-10-14 | Hoya Corp | 磁気ディスク用基板の製造方法 |
| JP2012148360A (ja) * | 2011-01-18 | 2012-08-09 | Fujikoshi Mach Corp | 両面研磨装置 |
| JP2016000444A (ja) * | 2014-06-12 | 2016-01-07 | 信越半導体株式会社 | 研磨パッドの洗浄方法及びウェーハの研磨方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122733A (ja) * | 1982-01-18 | 1983-07-21 | Toshiba Corp | 半導体ウエハの研摩装置 |
-
1984
- 1984-06-28 JP JP59133966A patent/JPS6114855A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122733A (ja) * | 1982-01-18 | 1983-07-21 | Toshiba Corp | 半導体ウエハの研摩装置 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63200965A (ja) * | 1987-02-12 | 1988-08-19 | Fujitsu Ltd | ウエ−ハ研磨装置 |
| JPH09120528A (ja) * | 1996-09-02 | 1997-05-06 | Hitachi Ltd | 磁気ディスクの製造方法及び製造装置 |
| KR100370245B1 (ko) * | 1997-06-19 | 2003-04-07 | 인터내셔널 비지네스 머신즈 코포레이션 | 연마패드세정조립체및화학기계적연마어셈블리 |
| JP2000317812A (ja) * | 1999-03-26 | 2000-11-21 | Applied Materials Inc | ポリシングスラリーを供給するキャリヤヘッド |
| JP2006224233A (ja) * | 2005-02-17 | 2006-08-31 | Hoya Corp | マスクブランクス用ガラス基板の製造方法及びマスクブランクスの製造方法 |
| JP2010231854A (ja) * | 2009-03-27 | 2010-10-14 | Hoya Corp | 磁気ディスク用基板の製造方法 |
| JP2012148360A (ja) * | 2011-01-18 | 2012-08-09 | Fujikoshi Mach Corp | 両面研磨装置 |
| KR101832495B1 (ko) * | 2011-01-18 | 2018-02-26 | 후지코시 기카이 고교 가부시키가이샤 | 양면 연마 장치 |
| JP2016000444A (ja) * | 2014-06-12 | 2016-01-07 | 信越半導体株式会社 | 研磨パッドの洗浄方法及びウェーハの研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457467B2 (enrdf_load_stackoverflow) | 1992-09-11 |
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