JPS6114855A - Polishing device - Google Patents

Abstract

PURPOSE:To completely remove an abrasive from a work with no remnant by feeding a washing liquid to both surfaces of a work on polishing surface plates via feed means. CONSTITUTION:Feed ports 11, 12 are provided respectively on a pair of surface plates 23 pinching a work 7, a washing liquid is fed to both surface of the work 7 from these feed ports 11, 12 via feed means 13A, 13B, and both surface of the work 7 are washed respectively to remove an abrasive and chips. Accordingly, it is unnecessary to remove the abrasive or the like particularly in another process, the parallelism and flatness of the work 7 is sufficient, and furthermore, a danger of corrosion can be reliably prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention polishes, for example, aluminum alloy substrates for magnetic dinuks, semiconductor wafers, and the like. d Regarding an IJ sing device.

[Technical background of the invention and its problems]

In general, this type of I-riding device has an upper surface plate and a lower surface plate arranged so as to be able to move toward and away from each other, and an aluminum for magnetic disk as a workpiece held by a carrier between the upper surface plate and the lower surface plate. Alloy substrates, etc. (hereinafter referred to as workpieces)
The upper surface plate and the lower surface plate are rotated, and the carrier is rotated and revolved to polish the surface of the workpiece with an abrasive and a polishing cloth.

When this polishing is completed, cleaning water is supplied to the workpiece to wash it, and then the workpiece is taken out.

However, in the past, washing water was supplied only from the upper surface of the workpiece to clean it, resulting in incomplete cleaning of the lower surface of the workpiece. For this reason, for example, in mechanochemical boring, which uses a combination of mechanical removal and chemical elution, if abrasive adheres to the lower surface of the workpiece after the cleaning process, etching of the lower surface will progress. As a result, the parallelism and flatness of the workpiece are reduced and contamination is caused. In addition, the abrasives based on eroidal silica, which are used when the workpiece is silicon, Group III semiconductors, Group II semiconductors, or compound semiconductors, have the property of solidifying when exposed to air, and are used to polish semiconductor wafers that have not been sufficiently cleaned. The agent adheres and solidifies, and it takes time to remove it in the subsequent process. Furthermore, when the workpiece is a hard disk substrate for a magnetic memory disk, an aluminum-magnesium alloy is generally used, which has high activity against acids and alkali IJK, and corrosion of the substrate has been a problem. Therefore, even if an attempt was made to increase the size of the device, it would take time to remove the substrate after processing, making it difficult to increase the size of the device.

[Purpose of the invention]

The present invention was made in view of the above circumstances, and its purpose is to provide a parishing device that can completely remove abrasives from V-workpieces without leaving any residue on them. .

[Summary of the invention]

In order to achieve the above object, the present invention provides a cleaning liquid supply port in each of a pair of polishing surface plates that pinch the workpiece, and supplies the cleaning liquid to both surfaces of the workpiece by a supply means. Sled B8 Hereinafter, the main temple plan will be explained with reference to an embodiment shown in FIGS. 1 to 3. In the figure, 1 is the center shaft, and a spline-shaped coupling 7m is attached to the upper end, and the upper surface plate 2, which has a spline hole 2& that removably engages with the coupling I&, is moved up and down by a cylinder (not shown). possible. A lower surface plate 3 is rotatably disposed coaxially with the central axis 1 and facing the upper leg 2. The upper surface plate 2 is driven to rotate in opposite directions to each other by drive sources (not shown) through the central shaft 1 and the cassogling 1a, and the lower surface plate 3 is driven through the hollow shaft 2). However, even though the polishing cloths 4 and 5 are attached to the opposing surfaces of the upper surface plate 2 and the lower surface plate 30, respectively,
A plurality of carriers 6 are provided between the upper surface plate 2 and the lower surface plate 3.
... are interposed, and each of these carriers 6...K holds a plurality of aluminum alloy substrates for magnetic disks (hereinafter referred to as substrates) 7 as workpieces. Both surfaces of the substrate 7 are coated with the polishing cloths 4 of the upper surface plate 2 and lower surface plate 3.
゜5, respectively. Oh, carrier 6 above
A toothed portion 8 is formed on the outer periphery of the hollow shaft 9.
It meshes with a sun gear 9 provided at the true upper end and an internal gear 10 provided coaxially therewith. The sun gear 9 and the internal gear 10 are rotated many times by a drive source (not shown), which causes the carrier 6 to revolve while rotating.

On the other hand, the upper surface plate 2 and the lower surface plate 3 are further provided with a plurality of polishing cloths 4 and 5, respectively.
, 12... are drilled, and these supply ports 1]...

12..., each supply means 1 on the soil part and lower side
．． 9A and 13B so that cleaning water as a cleaning liquid is supplied.

The above-mentioned first co-supply means J, ? A supply source 14 of washing water is provided, and this supply source 14 is connected to the coupling 15 of the upper surface plate 2.
The tray 16 attached to the tray 16 is connected to the tray 16 via a supply pipe J7. A plurality of through holes J are provided on the inner bottom surface of the tray 16.
8... are bored, and these through holes 18... communicate with the supply holes of the upper surface plate 2 via tubes 28....

Further, the supply means 13B on the lower side is the supply source 2 of washing water.
0, and this supply source 20 is connected to the rotary/S shive 22 of the hollow shaft 21 via the supply pipe 19. The hollow shaft 2 has a passage 2 communicating with the port-tally valve 22.
3 is formed. In addition, the lower surface plate 3 is the upper surface that is polymerized.

It has a lower grate 24, 25, and a recess 26 is formed in the lower surface of the upper plate 24.

This recess 26 is the supply port 1 bored in the upper grate 24.
2...K are communicated with each other, and are also communicated with the passage 23 of the hollow shaft 2 through a passage 27 bored in the lower plate 25.

Furthermore, the tray J6VC in the upper supply means 13 is supplied with polishing slurry instead of cleaning water during polishing.

When polishing the substrates 7..., in the above-described configuration, the upper surface plate 2 and the lower surface plate 3 are rotated, the sun gear 9 and the internal gear 10 are rotated, and the upper surface plate 2 and the lower surface plate 3 are rotated. Supply port 1 for disk 2 and its polishing cloth 4
The abrasive is supplied from... As a result, the carrier 6 revolves while rotating, and the substrates 7 held by the carrier 15 are rotated by the pressing force and rotational speed as shown in FIG. Then, it is brought into sliding contact with the polishing cloth 4°5 on the lower surface plate 3 and polished.

When this polishing is completed, as shown in Figure 3,
1, the supply of abrasive is stopped, and from the supply sources 14.20 of the upper and lower supply means 131.13B, respectively,
Wash water is supplied.

The cleaning water supplied from the supply source 14 on the upper side is fed to the tray 16.
From this tray 16, the upper surface plate 2 and its polishing cloth 4 are fed to each supply port 11 through tubes 28.
K is sent to the upper surface side of the substrate 7 from each of these supply ports 11 . . . to clean the upper surface of the substrate 7 . On the other hand, the cleaning water supplied from the supply source 20 on the lower side passes through the rotary pulp 22 and passages 23 and 27 to the recess 2 of the lower surface plate 5.
6 and is supplied from this recess 26 to the lower surface side of one substrate 7 via the upper plate 24 and the plurality of supply ports 12 . . . of the polishing cloth 5, thereby cleaning the lower surface of the substrate 7.

After cleaning the wafers 7 in this way, the upper surface plate 2 is raised and the wafers 7 are taken out.

As described above, since not only the upper surface side of the wafer 7 but also the lower surface side is cleaned, the abrasive and chips adhering to the substrate 7 are completely removed and no residue remains.

It goes without saying that the present invention can be modified in various ways within the scope of its gist.

〔Effect of the invention〕

As explained above, in the present invention, each of the pair of surface plates that pinch the workpiece is provided with a supply port, and the cleaning liquid is supplied from these supply ports to both sides of the workpiece by the supply means. This means that both sides can be cleaned separately, eliminating the need to leave behind abrasives or chips like in the past. Therefore, the conventional work of removing abrasives etc. in a special post-process is no longer necessary, the parallelism and flatness of the workpiece are now sufficient, and the risk of corrosion is also minimized. This has the effect of actually preventing this.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, and FIG.
A vertical cross-sectional view showing the ridging device, and FIGS. 2 and 3 are time charts of the processing process, respectively. 2...Upper surface plate (surface plate), 3...Lower surface plate (surface plate), 7
..., ... Aluminum alloy substrate for magnetic disks (
Workpiece), 11..., 12...,...Cleaning liquid supply port 13k...Upper side supply means (supply means), IJB
...Lower side supply means (supply means) Applicant's agent Patent attorney Takehiko Suzue 1st figure opening/closing (min)

Claims (4)

[Claims] (1) In an apparatus for polishing a workpiece by sandwiching it between a pair of polishing surface plates arranged at a distance and facing each other, each of the pair of surface plates is provided with a cleaning liquid supply port, and these cleaning liquids are supplied. A polishing apparatus comprising a supply means for supplying a cleaning liquid to both surfaces of the workpiece from the mouth. (2) The polishing apparatus according to claim 1, wherein the workpiece is an aluminum alloy substrate for a magnetic disk. (3) The polishing apparatus according to claim 1, wherein the workpiece is a semiconductor wafer. (4) The workpiece is held by a carrier and rotates as the carrier rotates relative to a pair of surface plates.
Polishing device as described in section.