JPS61144030A - 半導体装置の組立装置 - Google Patents

半導体装置の組立装置

Info

Publication number
JPS61144030A
JPS61144030A JP26674484A JP26674484A JPS61144030A JP S61144030 A JPS61144030 A JP S61144030A JP 26674484 A JP26674484 A JP 26674484A JP 26674484 A JP26674484 A JP 26674484A JP S61144030 A JPS61144030 A JP S61144030A
Authority
JP
Japan
Prior art keywords
magazine
frame
empty
supply
arrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26674484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0421340B2 (enrdf_load_html_response
Inventor
Hiroyuki Harada
裕之 原田
Yuujirou Mori
森　雄治郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP26674484A priority Critical patent/JPS61144030A/ja
Publication of JPS61144030A publication Critical patent/JPS61144030A/ja
Publication of JPH0421340B2 publication Critical patent/JPH0421340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
JP26674484A 1984-12-18 1984-12-18 半導体装置の組立装置 Granted JPS61144030A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26674484A JPS61144030A (ja) 1984-12-18 1984-12-18 半導体装置の組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26674484A JPS61144030A (ja) 1984-12-18 1984-12-18 半導体装置の組立装置

Publications (2)

Publication Number Publication Date
JPS61144030A true JPS61144030A (ja) 1986-07-01
JPH0421340B2 JPH0421340B2 (enrdf_load_html_response) 1992-04-09

Family

ID=17435100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26674484A Granted JPS61144030A (ja) 1984-12-18 1984-12-18 半導体装置の組立装置

Country Status (1)

Country Link
JP (1) JPS61144030A (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457723A (en) * 1987-08-28 1989-03-06 Sony Corp Conveyor for lead frame
JPH01140731A (ja) * 1987-11-27 1989-06-01 Toshiba Seiki Kk マガジンの交換装置
JPH07179224A (ja) * 1994-11-28 1995-07-18 Toshiba Seiki Kk マガジン移載方法
CN102070020A (zh) * 2010-11-01 2011-05-25 沙洲职业工学院 太阳能电池片检测仪中的自动送料装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352066A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Bonding unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352066A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Bonding unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457723A (en) * 1987-08-28 1989-03-06 Sony Corp Conveyor for lead frame
JPH01140731A (ja) * 1987-11-27 1989-06-01 Toshiba Seiki Kk マガジンの交換装置
JPH07179224A (ja) * 1994-11-28 1995-07-18 Toshiba Seiki Kk マガジン移載方法
CN102070020A (zh) * 2010-11-01 2011-05-25 沙洲职业工学院 太阳能电池片检测仪中的自动送料装置

Also Published As

Publication number Publication date
JPH0421340B2 (enrdf_load_html_response) 1992-04-09

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Legal Events

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