JPS6113949U - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPS6113949U
JPS6113949U JP1984099390U JP9939084U JPS6113949U JP S6113949 U JPS6113949 U JP S6113949U JP 1984099390 U JP1984099390 U JP 1984099390U JP 9939084 U JP9939084 U JP 9939084U JP S6113949 U JPS6113949 U JP S6113949U
Authority
JP
Japan
Prior art keywords
cooling structure
semiconductor devices
refrigerant
section
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984099390U
Other languages
English (en)
Japanese (ja)
Other versions
JPH037960Y2 (enExample
Inventor
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1984099390U priority Critical patent/JPS6113949U/ja
Publication of JPS6113949U publication Critical patent/JPS6113949U/ja
Application granted granted Critical
Publication of JPH037960Y2 publication Critical patent/JPH037960Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1984099390U 1984-06-29 1984-06-29 半導体装置の冷却構造 Granted JPS6113949U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984099390U JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984099390U JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPS6113949U true JPS6113949U (ja) 1986-01-27
JPH037960Y2 JPH037960Y2 (enExample) 1991-02-27

Family

ID=30658897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984099390U Granted JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPS6113949U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019794A (ja) * 2003-06-27 2005-01-20 Mitsubishi Electric Corp 冷却装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019794A (ja) * 2003-06-27 2005-01-20 Mitsubishi Electric Corp 冷却装置

Also Published As

Publication number Publication date
JPH037960Y2 (enExample) 1991-02-27

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