JPH0310548U - - Google Patents
Info
- Publication number
- JPH0310548U JPH0310548U JP1989071921U JP7192189U JPH0310548U JP H0310548 U JPH0310548 U JP H0310548U JP 1989071921 U JP1989071921 U JP 1989071921U JP 7192189 U JP7192189 U JP 7192189U JP H0310548 U JPH0310548 U JP H0310548U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- lid
- semiconductor
- cooling
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071921U JPH0648868Y2 (ja) | 1989-06-20 | 1989-06-20 | 半導体装置の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071921U JPH0648868Y2 (ja) | 1989-06-20 | 1989-06-20 | 半導体装置の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310548U true JPH0310548U (enExample) | 1991-01-31 |
| JPH0648868Y2 JPH0648868Y2 (ja) | 1994-12-12 |
Family
ID=31609388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989071921U Expired - Lifetime JPH0648868Y2 (ja) | 1989-06-20 | 1989-06-20 | 半導体装置の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648868Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012091044A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社ザイキューブ | 半導体デバイス・電子部品の実装構造 |
-
1989
- 1989-06-20 JP JP1989071921U patent/JPH0648868Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012091044A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社ザイキューブ | 半導体デバイス・電子部品の実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648868Y2 (ja) | 1994-12-12 |