JPS6113949U - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPS6113949U
JPS6113949U JP1984099390U JP9939084U JPS6113949U JP S6113949 U JPS6113949 U JP S6113949U JP 1984099390 U JP1984099390 U JP 1984099390U JP 9939084 U JP9939084 U JP 9939084U JP S6113949 U JPS6113949 U JP S6113949U
Authority
JP
Japan
Prior art keywords
cooling structure
semiconductor devices
refrigerant
section
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984099390U
Other languages
English (en)
Other versions
JPH037960Y2 (ja
Inventor
貴志男 横内
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1984099390U priority Critical patent/JPS6113949U/ja
Publication of JPS6113949U publication Critical patent/JPS6113949U/ja
Application granted granted Critical
Publication of JPH037960Y2 publication Critical patent/JPH037960Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 第１図は本考案に係る液冷容器の側断面図。 第２図は従来の液冷容器の側断面図。 第３図は本考案に係るノズルとＬＳＩチップの位置関係
を示す斜視図である。 図において、１，７は液冷容器、３，９は配線基板、５
は沌媒、６は凝縮器、８はＬＳＩチップ、１０は隔壁、
１１はノズル、１２は導出口、１３は導入口、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 冷媒を入れた密封容器が複数個の半導体チップをフエイ
    スダウンボンデイングした配線基板を浸漬する区画と該
    基板上に装着した各チップに加圧した冷媒をノズルを通
    して吹き付ける加圧区画とから構成されており、該両区
    画を冷凍機で結んで冷媒を循環させることを特徴とする
    半導体装置の冷却構造。
JP1984099390U 1984-06-29 1984-06-29 半導体装置の冷却構造 Granted JPS6113949U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984099390U JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984099390U JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPS6113949U true JPS6113949U (ja) 1986-01-27
JPH037960Y2 JPH037960Y2 (ja) 1991-02-27

Family

ID=30658897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984099390U Granted JPS6113949U (ja) 1984-06-29 1984-06-29 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPS6113949U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019794A (ja) * 2003-06-27 2005-01-20 Mitsubishi Electric Corp 冷却装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019794A (ja) * 2003-06-27 2005-01-20 Mitsubishi Electric Corp 冷却装置

Also Published As

Publication number Publication date
JPH037960Y2 (ja) 1991-02-27

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