JPS61136549U - - Google Patents
Info
- Publication number
- JPS61136549U JPS61136549U JP1985019804U JP1980485U JPS61136549U JP S61136549 U JPS61136549 U JP S61136549U JP 1985019804 U JP1985019804 U JP 1985019804U JP 1980485 U JP1980485 U JP 1980485U JP S61136549 U JPS61136549 U JP S61136549U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stepped
- hole
- minute gap
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019804U JPS61136549U (enrdf_load_stackoverflow) | 1985-02-14 | 1985-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019804U JPS61136549U (enrdf_load_stackoverflow) | 1985-02-14 | 1985-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136549U true JPS61136549U (enrdf_load_stackoverflow) | 1986-08-25 |
Family
ID=30509713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985019804U Pending JPS61136549U (enrdf_load_stackoverflow) | 1985-02-14 | 1985-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136549U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040383B2 (en) | 2001-08-16 | 2006-05-09 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
-
1985
- 1985-02-14 JP JP1985019804U patent/JPS61136549U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040383B2 (en) | 2001-08-16 | 2006-05-09 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
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