JPS61136549U - - Google Patents
Info
- Publication number
- JPS61136549U JPS61136549U JP1985019804U JP1980485U JPS61136549U JP S61136549 U JPS61136549 U JP S61136549U JP 1985019804 U JP1985019804 U JP 1985019804U JP 1980485 U JP1980485 U JP 1980485U JP S61136549 U JPS61136549 U JP S61136549U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stepped
- hole
- minute gap
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/877—
-
- H10W90/724—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019804U JPS61136549U (cg-RX-API-DMAC10.html) | 1985-02-14 | 1985-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019804U JPS61136549U (cg-RX-API-DMAC10.html) | 1985-02-14 | 1985-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136549U true JPS61136549U (cg-RX-API-DMAC10.html) | 1986-08-25 |
Family
ID=30509713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985019804U Pending JPS61136549U (cg-RX-API-DMAC10.html) | 1985-02-14 | 1985-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136549U (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040383B2 (en) | 2001-08-16 | 2006-05-09 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
-
1985
- 1985-02-14 JP JP1985019804U patent/JPS61136549U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040383B2 (en) | 2001-08-16 | 2006-05-09 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
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