JPS61134039U - - Google Patents
Info
- Publication number
- JPS61134039U JPS61134039U JP1986004131U JP413186U JPS61134039U JP S61134039 U JPS61134039 U JP S61134039U JP 1986004131 U JP1986004131 U JP 1986004131U JP 413186 U JP413186 U JP 413186U JP S61134039 U JPS61134039 U JP S61134039U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- protrusion
- solder
- hole
- reference numeral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004131U JPS6211014Y2 (US08124317-20120228-C00060.png) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004131U JPS6211014Y2 (US08124317-20120228-C00060.png) | 1986-01-16 | 1986-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61134039U true JPS61134039U (US08124317-20120228-C00060.png) | 1986-08-21 |
| JPS6211014Y2 JPS6211014Y2 (US08124317-20120228-C00060.png) | 1987-03-16 |
Family
ID=30479408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986004131U Expired JPS6211014Y2 (US08124317-20120228-C00060.png) | 1986-01-16 | 1986-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6211014Y2 (US08124317-20120228-C00060.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021059914A1 (US08124317-20120228-C00060.png) * | 2019-09-25 | 2021-04-01 | ||
| WO2024142542A1 (ja) * | 2022-12-27 | 2024-07-04 | 日立Astemo株式会社 | 電気回路体および電力変換装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4896447U (US08124317-20120228-C00060.png) * | 1972-02-17 | 1973-11-16 |
-
1986
- 1986-01-16 JP JP1986004131U patent/JPS6211014Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4896447U (US08124317-20120228-C00060.png) * | 1972-02-17 | 1973-11-16 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021059914A1 (US08124317-20120228-C00060.png) * | 2019-09-25 | 2021-04-01 | ||
| WO2021059914A1 (ja) * | 2019-09-25 | 2021-04-01 | 日立Astemo株式会社 | 電子回路装置 |
| WO2024142542A1 (ja) * | 2022-12-27 | 2024-07-04 | 日立Astemo株式会社 | 電気回路体および電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211014Y2 (US08124317-20120228-C00060.png) | 1987-03-16 |
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