JPS61127150A - 半導体パツケ−ジの封止構造 - Google Patents

半導体パツケ−ジの封止構造

Info

Publication number
JPS61127150A
JPS61127150A JP24794484A JP24794484A JPS61127150A JP S61127150 A JPS61127150 A JP S61127150A JP 24794484 A JP24794484 A JP 24794484A JP 24794484 A JP24794484 A JP 24794484A JP S61127150 A JPS61127150 A JP S61127150A
Authority
JP
Japan
Prior art keywords
solder
connection layer
cap
semiconductor package
sealing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24794484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0460348B2 (enExample
Inventor
Yoshiyuki Ishii
義之 石井
Toshikatsu Kiriyama
桐山　利勝
Tokio Sakate
坂手　時夫
Ichiro Ohigata
大日方　一郎
Akira Ito
明 伊藤
Kazumasa Arai
新井　和正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24794484A priority Critical patent/JPS61127150A/ja
Publication of JPS61127150A publication Critical patent/JPS61127150A/ja
Publication of JPH0460348B2 publication Critical patent/JPH0460348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP24794484A 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造 Granted JPS61127150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24794484A JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24794484A JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Publications (2)

Publication Number Publication Date
JPS61127150A true JPS61127150A (ja) 1986-06-14
JPH0460348B2 JPH0460348B2 (enExample) 1992-09-25

Family

ID=17170868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24794484A Granted JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Country Status (1)

Country Link
JP (1) JPS61127150A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649700A (ja) * 1992-07-31 1994-02-22 Sumitomo Metal Ind Ltd 帯鋼連続酸洗装置
JP2006135264A (ja) * 2004-11-09 2006-05-25 Murata Mfg Co Ltd 電子部品の製造方法及びそれを用いた電子部品
JP2013502065A (ja) * 2009-08-13 2013-01-17 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ２つの構成要素からなる気密性の組立体およびそうした組立体を製造するための方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101602278B1 (ko) * 2015-09-11 2016-03-10 주식회사 피플앤코 자력퍼프 및 자력퍼프 손잡이 돌출형 화장품 콤팩트

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649700A (ja) * 1992-07-31 1994-02-22 Sumitomo Metal Ind Ltd 帯鋼連続酸洗装置
JP2006135264A (ja) * 2004-11-09 2006-05-25 Murata Mfg Co Ltd 電子部品の製造方法及びそれを用いた電子部品
JP2013502065A (ja) * 2009-08-13 2013-01-17 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ２つの構成要素からなる気密性の組立体およびそうした組立体を製造するための方法

Also Published As

Publication number Publication date
JPH0460348B2 (enExample) 1992-09-25

Similar Documents

Publication Publication Date Title
JP3420076B2 (ja) フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造
JP2570628B2 (ja) 半導体パッケージおよびその製造方法
US7271479B2 (en) Flip chip package including a non-planar heat spreader and method of making the same
US6281581B1 (en) Substrate structure for improving attachment reliability of semiconductor chips and modules
US20060091542A1 (en) Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same
WO2008055105A2 (en) Non-pull back pad package with an additional solder standoff
KR101146973B1 (ko) 패키지 프레임 및 그를 이용한 반도체 패키지
JPH10135276A (ja) エリアアレイ半導体装置、プリント基板及びスクリーンマスク
JPS61127150A (ja) 半導体パツケ−ジの封止構造
US20040038452A1 (en) Connection between semiconductor unit and device carrier
JPH09153519A (ja) 半導体の実装構造
JPH0347693A (ja) ソルダーペースト
JPS5917271A (ja) セラミツクパツケ−ジ半導体装置
JPH07122827A (ja) 電子部品実装用基板
JP3449268B2 (ja) 半導体圧力センサ
JPH03209734A (ja) 半導体接続方法
JP3034231B2 (ja) 中継基板
CN110610916B (zh) 封装结构
JPH10223802A (ja) ボール・グリッド・アレイ型半導体パッケージの外部出力バンプ、およびその形成方法
JPS62108546A (ja) 半導体パツケ−ジの封止構造
JPH08213503A (ja) セラミック製パッケージ及び該パッケージの封着方法
JPH11145374A (ja) 半導体チップの接続方法および半導体集積回路
JP2005333034A (ja) 半導体装置、その製造方法および実装方法
JPS594196A (ja) 半導体部品実装用半田バンプの形成方法
JPH02288255A (ja) 半導体装置