JPS61127150A - 半導体パツケ−ジの封止構造 - Google Patents

半導体パツケ−ジの封止構造

Info

Publication number
JPS61127150A
JPS61127150A JP59247944A JP24794484A JPS61127150A JP S61127150 A JPS61127150 A JP S61127150A JP 59247944 A JP59247944 A JP 59247944A JP 24794484 A JP24794484 A JP 24794484A JP S61127150 A JPS61127150 A JP S61127150A
Authority
JP
Japan
Prior art keywords
solder
cap
connection layer
substrate
junction layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59247944A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0460348B2 (enExample
Inventor
Yoshiyuki Ishii
義之 石井
Toshikatsu Kiriyama
桐山　利勝
Tokio Sakate
坂手　時夫
Ichiro Ohigata
大日方　一郎
Akira Ito
明 伊藤
Kazumasa Arai
新井　和正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59247944A priority Critical patent/JPS61127150A/ja
Publication of JPS61127150A publication Critical patent/JPS61127150A/ja
Publication of JPH0460348B2 publication Critical patent/JPH0460348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W70/682—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP59247944A 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造 Granted JPS61127150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59247944A JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59247944A JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Publications (2)

Publication Number Publication Date
JPS61127150A true JPS61127150A (ja) 1986-06-14
JPH0460348B2 JPH0460348B2 (enExample) 1992-09-25

Family

ID=17170868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59247944A Granted JPS61127150A (ja) 1984-11-26 1984-11-26 半導体パツケ−ジの封止構造

Country Status (1)

Country Link
JP (1) JPS61127150A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649700A (ja) * 1992-07-31 1994-02-22 Sumitomo Metal Ind Ltd 帯鋼連続酸洗装置
JP2006135264A (ja) * 2004-11-09 2006-05-25 Murata Mfg Co Ltd 電子部品の製造方法及びそれを用いた電子部品
JP2013502065A (ja) * 2009-08-13 2013-01-17 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ２つの構成要素からなる気密性の組立体およびそうした組立体を製造するための方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101602278B1 (ko) * 2015-09-11 2016-03-10 주식회사 피플앤코 자력퍼프 및 자력퍼프 손잡이 돌출형 화장품 콤팩트

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649700A (ja) * 1992-07-31 1994-02-22 Sumitomo Metal Ind Ltd 帯鋼連続酸洗装置
JP2006135264A (ja) * 2004-11-09 2006-05-25 Murata Mfg Co Ltd 電子部品の製造方法及びそれを用いた電子部品
JP2013502065A (ja) * 2009-08-13 2013-01-17 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ２つの構成要素からなる気密性の組立体およびそうした組立体を製造するための方法

Also Published As

Publication number Publication date
JPH0460348B2 (enExample) 1992-09-25

Similar Documents

Publication Publication Date Title
US6002172A (en) Substrate structure and method for improving attachment reliability of semiconductor chips and modules
US20070145553A1 (en) Flip-chip mounting substrate and flip-chip mounting method
US8810016B2 (en) Semiconductor device, substrate and semiconductor device manufacturing method
WO2008055105A2 (en) Non-pull back pad package with an additional solder standoff
KR100381111B1 (ko) Ｂｇａ패키지를 이용한 반도체장치 및 그 제조방법
JPH10135276A (ja) エリアアレイ半導体装置、プリント基板及びスクリーンマスク
JPS61127150A (ja) 半導体パツケ−ジの封止構造
JPH09153519A (ja) 半導体の実装構造
JPH0347693A (ja) ソルダーペースト
US20040038452A1 (en) Connection between semiconductor unit and device carrier
JPS5917271A (ja) セラミツクパツケ−ジ半導体装置
JP3449268B2 (ja) 半導体圧力センサ
JPH06204352A (ja) 半導体セラミックパッケージ用基体及び蓋体
CN110610916B (zh) 封装结构
JPH025534A (ja) ペースト塗布用ノズル及びペースト塗布方法
JP2008517475A (ja) 電気接点を有する基板及びその製造方法
JP2002164473A (ja) 半導体装置及びその製造方法
JPH0661368A (ja) フリップチップ型半導体装置
JPS6068637A (ja) 半導体のバンプ電極
TWI405312B (zh) 半導體封裝構造、半導體封裝構造用載板及其製造方法
JP2005333034A (ja) 半導体装置、その製造方法および実装方法
KR100481424B1 (ko) 칩 스케일 패키지의 제조 방법
JP3282932B2 (ja) 半導体装置用パッケージ及びその製造方法
JPH08213503A (ja) セラミック製パッケージ及び該パッケージの封着方法
JPS62108546A (ja) 半導体パツケ−ジの封止構造