JPS61125689A - Ic card - Google Patents

Abstract

PURPOSE:To form a complicated circuit pattern with no use of a jumper line by using a double-layer circuit pattern. CONSTITUTION:IC chips 15 are set side by side on a plane and a circuit pattern 14 connects these chips. Then through-holes are provided at several areas. The electrode patterns 13 are connected to the pattern 14 via a through-hole 12 at a place distant from the chips 15 and the pattern 14. These electrodes 13 are all covered with an insulated substrate 17 excluding a partial electrode pattern which is exposed through an opening 18.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical part of the invention?) This invention relates to an IC card having an IC module that is capable of configuring a complex circuit by providing circuit patterns on both sides of the circuit board of the IC module. .

(Technical background of the invention and its problems) Figure m1 shows a cross section of an IC module installed or built into a conventional IC card.
The module is assembled as follows.

First, a printed wiring film made by laminating copper foil with a thickness of 18 mm on a glass epoxy film substrate 1 with a thickness of about 0.1 mm was etched to obtain a desired pattern, and then nickel and Gold plating is performed to form an electrode pattern 2 for external connection terminals and a circuit pattern 3, and the electrode pattern 2 for connection terminals and the circuit pattern 3 are electrically connected through through holes 4 at necessary locations. Then, place the ICC at a predetermined position on the 5-circuit pattern 3.
ICC chip + 5 electrodes 6
and the circuit pattern 3 are connected by a wire bonding method using a conductor 7. Note that this part can also be implemented using a face bomb knob method that does not use wires, and in that case, a thinner IC module can be obtained. On the other hand, before the bonding process, a sealing frame 8 made of a material such as glass epoxy is attached to the glass epoxy film substrate 1 using an epoxy-based TA adhesive or the like to prevent the flow of resin when sealing with epoxy resin. , ICchi, Pu5
After making the necessary connections with the circuit pattern 3, epoxy resin 9 is poured and molded.

By the way, the IC chip 5 used in the IC module is an 1-chip type in which a microcomputer and a memory for storing card data are integrated into one, a 2-chip hole type with a microcomputer 1 chip and a memory chip, and a microcomputer 2+ type. , a 3-chip hole type with 2 chips and 2 memory chips has been considered, but the 1-chip type is expensive and it is difficult to increase the memory capacity, so the 2-chip hole type is currently mainly used. There is. However, since the single circuit pattern 3 is a planar pattern, jumper wires are required, which increases the thickness of the chip, so that it is not suitable for complex circuits.

(Object of the invention) This invention was made under the above circumstances,
An object of the present invention is to provide an IC card equipped with or built-in an IC module that allows complex circuit patterns to be created without using jumper wires.

(Summary of the Invention) The present invention relates to an IC card in which an IC module is mounted and embedded in a synthetic resin sheet base, in which a circuit board is disposed on the upper surface of a sealing frame, and an external device is mounted on the outer surface of the circuit board. A second circuit pattern is provided for bonding an IC chip embedded in the inner surface of the circuit board. The second circuit pattern is connected through through holes.

(Embodiment of 1991) FIG. 2 is a front view showing an example of an IC module 30 according to the present invention, which includes a microcomputer chip, a memory chip, etc.
C chips +5 are arranged in a plane, circuit patterns 14 connecting them are arranged around them, and through-holes are formed in several places. Furthermore, an electrode pattern 13 connected to the circuit pattern 4 through a through hole 12 is arranged at a location away from the IC chip and the circuit pattern. However, all of these are covered with the insulating substrate 17 except for a part of the polar pattern exposed through the opening 18.

FIG. 3 is a diagram showing a cross-sectional structure taken along line xx in diagram gr12. Such an IC module 30 is a j! below/i
＼By such a method! 1+l will be built.

Using an approximately 0.2-thick insulating board (for example, a glass epoxy board) II made of glass cloth impregnated with a thermosetting resin and laminated with copper foil approximately 18mm thick on both sides, first one side was Through-hole drilling and through-hole plating are performed on the part where the pattern is to be electrically connected to obtain the through-holes 12, and then the insulating substrate 11
In order to obtain a desired pattern on both sides, buttering is performed by foot etching, followed by nickel plating and gold plating to form electrode patterns 13 and circuit patterns 14 for connection terminals with external devices. Furthermore, a device chip hole (the part to be filled with mold resin 16 described later) having the same size as the IC chip 15 or slightly smaller is made in the position where the 1G chip 15 such as a microcomputer chip or a memory chip is to be installed. An insulating substrate of the same quality as the above-mentioned insulating plate 11 is provided on one side (top side in the figure) of the obtained substrate with an opening 18 for exposing the electrode part for connection with an external device on the electrode pattern 13. 17, and on the other side (bottom of the figure), there is an opening of the minimum size (in the mold resin 15) for ear-ponding the IC chip 15 and this chip and the circuit pattern 14. filled part)
Two insulating substrates (J4 fixing frame) +9 of the same quality as the L distribution edge board II provided with are placed together and heat-pressed with an adhesive layer 20 of 0.05 thickness such as adhesive or semi-hardened epoxy resin film. ZI--shaped and punched to desired dimensions I
Obtain a circuit board for C Moneur.

The IC chip 15 is installed in the opening of the circuit board obtained as described above using adhesive 2I.

That is, the IC chip 15 is adhered to and supported by the J11 and J17.Next, the electrodes 22 on the IG chip 15 and the circuit pattern 14 are connected by wire bonding with the conductor 23, and the faces are connected by a bonding method. Furthermore, I
A mold resin (for example, epoxy resin) is applied to the opening of the circuit board to fix and cover the C chip, the plug 15, and the conductor 23.
This 5I is filled with +8 to the same level of flatness as the insulating substrate +8 and fixed by heat curing.
An IC module 30 according to the method is obtained.

Note that IC + FFP15 is 0.4% due to the increase in wafer size.
~0.6-1 thickness is common, and even if you backlap it or use a small diameter wafer, the thickness is approximately 0.2~0.3■■ due to handling properties (yield, etc.). Common.

Further, in the embodiments described below, the electrode pattern 13 formed on the upper surface of the insulating substrate 11 was connected to the U-way pattern 14 formed on the lower surface of the substrate 11 by a through hole, but the The circuit pattern 14 on the upper surface of 11 may be extended and connected to the electrode pattern 13.

The IC module 30 manufactured as described above is embedded in a predetermined card base 31 as shown in FIG.
Get card 33. The IC module 3G is attached to the card base 3I by the method described in Japanese Patent Application No. 158444/1983. That is, after forming a printing pattern (picture Jpl) 32 on a milky white hard chlorinated vinyl sheet by silk printing or offset printing,
Transparent hard vinyl chloride sheets are temporarily pasted and laminated, and module embedding holes are punched out at desired uneven locations. Desired +C of milky white hard vinyl chloride sheet? Aligning the position with the module embedding location, bury the embedding substrate made of, for example, a stainless steel plate, approximately the same size as the IC module 30, and make holes to be immersed using a punching method. The vinyl sheet, the opalescent vinyl chloride sheet that supports the IC module 30 and the embedded substrate, and the punched sheet are aligned and laminated into a laminated sheet. Then, a buried substrate of a semi-cured (B stage) glass epoxy sheet is placed in the buried substrate hole provided in the sheet, and an IC module 30 is installed in the IC module buried hole to obtain a temporarily pasted layered laminate. . The thus obtained laminate was sandwiched between two mirror-finished metal plates such as stainless steel, heated and pressurized under the laminating conditions of 150° temperature and 25 kg/c for 23 hours and 30 minutes, followed by +C Moannealing. f! G. This laminate is punched out into a card shape so that the electrode pattern of the IC module 30 is aligned with a single line, and the target cart 33 is punched out.6 (Effects of the Invention) As described above, according to the present invention, By using a 2#- circuit pattern, there is an advantage that an IC card using an IC module having a more complicated circuit pattern can be manufactured without using unnecessary jumper wires or the like.

[Brief explanation of the drawing]

wIJ1 is a cross-sectional structure diagram showing an example of a conventional IC module, FIG. 2 is a plan view showing an example of a tC module according to the present invention, FIG. 3 is a cross-sectional structure diagram taken along the line x-x, and FIG. FIG. 2 is a plan view showing one embodiment of the invention. l...Glass epoxy film substrate, 2.13...
Electrode pattern, 3.14...Circuit pattern, 4.12
...Through hole, 5.15...re chip, 6.
22... Electrode, 7.23... Conductor, 8... Sealing frame, 9... Epoxy resin, 1G... IC module,
11.17...Insulating substrate, +6...Mode resin,
1B...Opening W&18...Insulating substrate (sealing frame), 2
0...adhesive layer, 2t...adhesive. Figure l Graduation 2 Sono Tsune 3 Zuko 4 Figure?

Claims (1)

[Claims] In an IC card in which an IC module is mounted and embedded in a synthetic resin sheet base, a circuit board is disposed on the upper surface of the sealing frame of the IC module, and an external device is electrically connected to the outer surface of the circuit board. A second circuit pattern for bonding an IC chip such as a microcomputer or a memory embedded in the inner surface of the circuit board is provided, and An IC card characterized in that a first circuit pattern provided on the circuit board and a second circuit pattern provided on the inner surface of the circuit board are connected through through holes.