JPS6112266U - multilayer integrated circuit board - Google Patents

multilayer integrated circuit board

Info

Publication number
JPS6112266U
JPS6112266U JP9583284U JP9583284U JPS6112266U JP S6112266 U JPS6112266 U JP S6112266U JP 9583284 U JP9583284 U JP 9583284U JP 9583284 U JP9583284 U JP 9583284U JP S6112266 U JPS6112266 U JP S6112266U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit board
semiconductor chip
multilayer integrated
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9583284U
Other languages
Japanese (ja)
Inventor
博樹 越智
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9583284U priority Critical patent/JPS6112266U/en
Publication of JPS6112266U publication Critical patent/JPS6112266U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による多層集積回路基板の実施，例を示
す斜視図である。 １・・・半導体チップキャリア、２・・・取付窓、３・
・・半導体チップキャリアコンタクト部、４・・・絶縁
基板、５・・・取り外し用小窓、６・・・接続コンタク
ト部、７・・・多層基板。FIG. 1 is a perspective view showing an example of a multilayer integrated circuit board according to the present invention. 1... Semiconductor chip carrier, 2... Mounting window, 3...
... Semiconductor chip carrier contact part, 4... Insulating substrate, 5... Small window for removal, 6... Connection contact part, 7... Multilayer board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の半導体チップキャリアを実装する多層集積回路基
板において、半導体チップキャリアを実装するための窓
を設け、その窓の周囲に前記半導体チップキャリアの側
面に形成されているコンタクト部と圧接するための印刷
配線パターンに接続された基板側コンタクト部を設け、
さらに実装した半導体チップキャリアを取り外すための
小窓を設けた絶縁基板を積層したことを特徴とする多層
集積回路基板。In a multilayer integrated circuit board on which a plurality of semiconductor chip carriers are mounted, a window is provided for mounting the semiconductor chip carriers, and printing is provided around the window for pressure contact with a contact portion formed on a side surface of the semiconductor chip carrier. Provide a board side contact part connected to the wiring pattern,
A multilayer integrated circuit board further comprising a laminated insulating substrate having a small window for removing a mounted semiconductor chip carrier.
JP9583284U 1984-06-26 1984-06-26 multilayer integrated circuit board Pending JPS6112266U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9583284U JPS6112266U (en) 1984-06-26 1984-06-26 multilayer integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9583284U JPS6112266U (en) 1984-06-26 1984-06-26 multilayer integrated circuit board

Publications (1)

Publication Number Publication Date
JPS6112266U true JPS6112266U (en) 1986-01-24

Family

ID=30655077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9583284U Pending JPS6112266U (en) 1984-06-26 1984-06-26 multilayer integrated circuit board

Country Status (1)

Country Link
JP (1) JPS6112266U (en)

Similar Documents

Publication Publication Date Title
JPS62184775U (en)
JPS6112266U (en) multilayer integrated circuit board
JPS58158443U (en) hybrid integrated circuit board
JPS59145056U (en) printed wiring board
JPS58146372U (en) printed wiring board
JPS58125373U (en) printed wiring board
JPS59164264U (en) printed wiring board
JPS5920675U (en) Laminated structure of printed wiring board
JPS6049662U (en) Chip component mounting structure
JPS58191661U (en) printed board
JPS5812969U (en) flexible printed circuit board
JPS59107139U (en) IC chip mounting structure on circuit board
JPS59169073U (en) multilayer printed wiring board
JPS61245U (en) IC module
JPS59127258U (en) flexible printed circuit board
JPS63132476U (en)
JPS6030567U (en) Printed wiring board for mounting chip components
JPS5999467U (en) Recognition pattern for positioning flexible printed circuits
JPS59171352U (en) semiconductor equipment
JPS5881949U (en) integrated circuit board
JPS59145070U (en) Light emitting element mounting device
JPS5984852U (en) Leadless hybrid integrated circuit components
JPS60125765U (en) printed wiring board
JPS6127271U (en) Printed board
JPS6138954U (en) semiconductor equipment